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31. 发明授权

US07847877B2 Panel 有权
标题翻译：面板
公开(公告)号：US07847877B2
公开(公告)日：2010-12-07
申请号：US11887160
申请日：2006-11-07
申请人： Kazuhiro Nishikawa , Takeshi Asakura , Yoshihiro Kai
发明人： Kazuhiro Nishikawa , Takeshi Asakura , Yoshihiro Kai
IPC分类号： G02F1/1335
CPC分类号： G02F1/133308 , G02B27/286 , G02F2001/133388 , G02F2001/133638 , G02F2203/64
摘要： A design panel attached to a casing for an electronic equipment, which is constructed so that a display device whose display surface goes black at standby is placeable inside the casing, and which is formed with an opening that makes the display surface visible, the design panel being attached to the casing so as to cover the opening, the design panel including, a transparent support substrate having a larger area than the opening, a polarizing film provided outside or inside the transparent support substrate, a ¼ wavelength phase difference film provided on a closer side to an attachment side of the casing with respect to the polarizing film, and a black colored section provided on the closer side to the attachment side of the casing with respect to the transparent support substrate, for blacking a portion which is able to be in contact with the casing, wherein the display device is made visible from the outside at information display, whereas the display device is covered so as to be made invisible from the outside at standby.
摘要翻译：连接到电子设备的壳体的设计面板被构造成使得显示表面在待机状态下变黑的显示装置可放置在壳体内部，并且形成有使显示表面可见的开口，设计面板所述设计面板包括具有比所述开口大的面积的透明支撑基板，设置在所述透明支撑基板的外侧或内部的偏振膜，设置在所述透明支撑基板上的1/4波长相位差膜更靠近壳体相对于偏振膜的附接侧，以及黑色部分，其设置在相对于透明支撑基板的壳体的附接侧的更靠近侧上，用于使能够与壳体接触，其中显示装置在信息显示时从外部可见，而显示装置被覆盖成b e从外面看不见，待命。

32. 发明授权

US07768795B2 Electronic circuit device, electronic device using the same, and method for manufacturing the same 有权
标题翻译：电子电路装置，使用该电子装置的电子装置及其制造方法
公开(公告)号：US07768795B2
公开(公告)日：2010-08-03
申请号：US11660515
申请日：2005-08-31
申请人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
发明人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
IPC分类号： H01R12/16
CPC分类号： H01L25/18 , G11C5/04 , H01L23/5386 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/92 , H01L24/96 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2224/24137 , H01L2224/32145 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/01078 , H01L2924/15331 , H05K1/185 , H05K1/189 , H05K3/4614
摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.
摘要翻译：电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。该电子电路装置（100）分配母基板。此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。

33. 发明申请

US20100167908A1 DIELECTRIC PORCELAIN COMPOSITION FOR USE IN ELECTRONIC DEVICES 有权
标题翻译：用于电子设备的电介质组合物
公开(公告)号：US20100167908A1
公开(公告)日：2010-07-01
申请号：US11993722
申请日：2005-06-24
申请人： Tomoyuki Tada , Kazuhiro Nishikawa , Kazuya Toji , Kazuhiro Kura , Takeshi Shimada
发明人： Tomoyuki Tada , Kazuhiro Nishikawa , Kazuya Toji , Kazuhiro Kura , Takeshi Shimada
IPC分类号： C04B35/465
CPC分类号： H01B3/12 , C01G23/002 , C01P2002/50 , C01P2002/72 , C01P2006/32 , C01P2006/40 , C04B35/465 , C04B35/6262 , C04B35/62695 , C04B2235/3208 , C04B2235/3217 , C04B2235/3222 , C04B2235/3224 , C04B2235/3232 , C04B2235/3286 , C04B2235/5436 , C04B2235/608 , C04B2235/77 , C04B2235/786 , C04B2235/80
摘要： The invention intends to provide a dielectric porcelain composition for use in electronic devices, in which the relative dielectric constant εr is high, the Qf value is high and, the temperature coefficient τf can be controlled while maintaining the temperature coefficient τf at the resonant frequency small and the Qf value high. According to the invention, when, in an LnAlO3—CaTiO3-based dielectric porcelain composition, a molar ratio of LnAlO3 and CaTiO2 is optimized and Al is substituted by a slight amount of Ga, a structure that has an LnAlO3—CaTiO3 solid solution as a main phase and a solid solution of Al—Ga-based oxide as a secondary phase and does not substantially contain α-Al2O3 in the structure can be obtained, and the temperature coefficient τf can be controlled while maintaining the temperature coefficient τf at the resonant frequency small and the Qf value high.
摘要翻译：本发明提供一种用于电子器件的电介质瓷组合物，其中相对介电常数ε高，Qf值高，并且可以控制温度系数τf，同时保持谐振时的温度系数τf 频率小，Qf值高。根据本发明，当在基于LnAlO3-CaTiO3的电介质瓷组合物中，优化LnAlO 3和CaTiO 2的摩尔比并且Al被少量的Ga取代时，具有LnAlO 3 -CaTiO 3固溶体作为主相和作为第二相的Al-Ga类氧化物的固溶体，并且在该结构中基本上不含有α-Al 2 O 3，并且可以在将温度系数τf保持在谐振频率的同时控制温度系数τf 小，Qf值高。

34. 发明授权

US07613010B2 Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效
标题翻译：立体电子电路装置，其中使用的继电器板和继电器框架
公开(公告)号：US07613010B2
公开(公告)日：2009-11-03
申请号：US10985325
申请日：2004-11-10
申请人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
发明人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
IPC分类号： H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译：立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

35. 发明授权

US07376318B2 Circuit board and its manufacturing method 有权
标题翻译：电路板及其制造方法
公开(公告)号：US07376318B2
公开(公告)日：2008-05-20
申请号：US11653891
申请日：2007-01-17
申请人： Norihito Tsukahara , Kazuhiro Nishikawa
发明人： Norihito Tsukahara , Kazuhiro Nishikawa
IPC分类号： G02B6/10
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L2224/16 , H01L2224/24226 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/095 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K3/4664 , H05K2201/0187 , H05K2203/0568 , Y10T29/49124 , Y10T29/49126 , Y10T29/53874 , H01L2924/00
摘要： A circuit board comprises a base film that is a base layer, a first conductive circuit manufactured by hardening conductive paste material formed in a predetermined shape on the base film, a first insulating layer manufactured by hardening insulating paste material formed on the base film and the first conductive circuit, and a second conductive circuit manufactured by hardening conductive paste material in a predetermined shape on the first insulating layer, wherein an electronic part built-in by the first insulating layer and second insulating layer is connected to the second conductive circuit, and the first conductive circuit is connected to the second conductive circuit through a via hole.
摘要翻译：电路板包括作为基底层的基膜，通过在基膜上硬化形成为预定形状的导电糊料材料制成的第一导电电路，通过硬化形成在基膜上的绝缘膏材料而形成的第一绝缘层和第一导电电路和通过在第一绝缘层上硬化具有预定形状的导电糊料材料制成的第二导电电路，其中由第一绝缘层和第二绝缘层内置的电子部件连接到第二导电电路，以及第一导电电路通过通孔连接到第二导电电路。

36. 发明申请

US20080106522A1 Lead Wire Connection Method for Touch Panel 有权
标题翻译：触摸屏引线连接方式
公开(公告)号：US20080106522A1
公开(公告)日：2008-05-08
申请号：US11791721
申请日：2006-01-16
申请人： Kazuhiro Nishikawa , Yoshihiro Kai , Kazuto Nakamura
发明人： Kazuhiro Nishikawa , Yoshihiro Kai , Kazuto Nakamura
IPC分类号： G06F3/041
CPC分类号： G06F3/045 , G06F2203/04103 , H01H2207/01 , H01H2207/014 , H01R4/04 , H01R12/62 , H05K3/321 , H05K3/361 , H05K3/368 , H05K2201/10303 , H05K2201/10424 , H05K2201/10871
摘要： In a method for connecting lead wires to a touch panel, the method includes the steps of: providing through holes 9a to 9d the number of which corresponds to the number of electrode ends by perforation in a lower electrode plate 3; using a metal-pin 11 having a pin-shaft 11b and a disk shaped pin-head 11a with a diameter larger than an outer diameter of the pin-shaft; inserting the pin-shaft 11b into a metal-pin fixing hole formed corresponding to the through hole 9a at a circuit 10c in a connector tail of a lead wire 10, whereby the pin-shaft 11b is erectly provided on the connector tail of the lead wire 10; and inserting the pin-shafts 11b to 14b into the through holes 9a to 9d, and in addition, electrically connecting the pin-shaft inserted into a lower electrode plate 3 through a conductive adhesive 15 to electrode ends 6c, 7c, 6d, 7d.
摘要翻译：在将引线连接到触摸面板的方法中，所述方法包括以下步骤：通过在下电极板3中穿孔而将数量对应于电极端数的通孔9a至9d; 使用具有销轴11b的金属销11和直径大于销轴的外径的盘形销头11a; 在引线10的连接器尾部的电路10c处将针轴11b插入与通孔9a形成的金属针固定孔中，由此将引脚轴11b直立地设置在连接器上引线10的尾部; 并将销轴11b至14b插入到通孔9a至9d中，此外，通过导电粘合剂15将插入下电极板3的销轴电连接到电极端6c，7 c，6 d，7 d。

37. 发明申请

US20080094793A1 Electronic Circuit Device, Electronic Device Using the Same, and Method for Manufacturing the Same 有权
标题翻译：电子电路装置，使用其的电子装置及其制造方法
公开(公告)号：US20080094793A1
公开(公告)日：2008-04-24
申请号：US11660515
申请日：2005-08-31
申请人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
发明人： Daisuke Sakurai , Masahiro Ono , Kazuhiro Nishikawa
IPC分类号： H05K5/00 , H01L21/52
CPC分类号： H01L25/18 , G11C5/04 , H01L23/5386 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/92 , H01L24/96 , H01L25/0652 , H01L25/105 , H01L2224/16225 , H01L2224/24137 , H01L2224/32145 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/01078 , H01L2924/15331 , H05K1/185 , H05K1/189 , H05K3/4614
摘要： Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device (100) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.
摘要翻译：电子电路装置100被构造成使得通过将由第一树脂片制成的基板模块与嵌入其中的电子部件（190）组成的基板模块单元插入到包括连接端子（120）的壳体（150）中，控制电路（130）和第一布线图案（140），其中基板模块彼此电连接和机械连接。该电子电路装置（100）分配母基板。此外，通过减少衬底模块，可以将具有大量衬底模块的衬底模块单元堆叠在有限的封装空间中，从而安装更大的存储容量和更高的功能。

38. 发明授权

US07297876B2 Circuit board and method of manufacturing the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US07297876B2
公开(公告)日：2007-11-20
申请号：US10918274
申请日：2004-08-13
申请人： Daisuke Sakurai , Norihito Tsukahara , Kazuhiro Nishikawa
发明人： Daisuke Sakurai , Norihito Tsukahara , Kazuhiro Nishikawa
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L21/4846 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/16 , H01L2224/76155 , H01L2224/82102 , H01L2224/97 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H05K1/095 , H05K3/107 , H05K3/1258 , H05K2201/0129 , H05K2201/09036 , H05K2201/10674 , H05K2203/1189 , Y10T29/4913 , H01L2224/82 , H01L2924/00
摘要： Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.
摘要翻译：对热塑性树脂膜进行热处理，最终成为绝缘树脂层，并将膜压在膜上形成凹槽的模具上。接下来，从薄膜的背面将电子部件压配合到树脂薄膜中，从而从凹槽的底部露出部件的电极。然后将薄膜冷却固化。将薄膜剥离模具，然后用导电膏填充凹槽，并固化糊料以形成电路图案。上述过程允许将电极与包含电子部件的电路板的电路图案正向地导通，并且在电路图案的布线之间实现更窄的间距。

39. 发明申请

US20070218957A1 Touch Panel And Protective Panel For Display Window Of Electronic Device Using The Same 有权
标题翻译：触摸面板和保护面板用于使用其的电子设备的显示窗口
公开(公告)号：US20070218957A1
公开(公告)日：2007-09-20
申请号：US11597202
申请日：2005-05-20
申请人： Kazuhiro Nishikawa , Yoshihiro Kai , Kazuto Nakamura
发明人： Kazuhiro Nishikawa , Yoshihiro Kai , Kazuto Nakamura
IPC分类号： H04M1/00
CPC分类号： G06F3/045 , H01H13/785 , H01H2201/036 , H01H2207/00 , H05K1/116 , H05K3/4046 , H05K3/4069 , H05K2201/09909 , H05K2201/10416
摘要： There is provided a touch panel capable of obtaining a stable connection resistance without requiring fitting accuracy at the time of the connection to an external terminal, and a protective panel for a display window of an electronic device using the same. The analog type touch panel includes a touch side substrate 2 and a non-touch side substrate 3 each having resistive films 2a, 3a provided on opposed inner surfaces thereof. Through-holes 4a, 4b, 4c, 4d formed at the periphery of the non-touch side substrate 3. A connecting part 5 for electrically connecting electrodes of the resistive films 2a, 3a to an external terminal, in which a conductive paste is injected into the through-holes and a rivet 14 is inserted into each of the through-holes from the lower surface side so that a head of the rivet 14 forms flat connecting electrodes 15a, 15b for connection to the external terminal on the lower surface of the non-touch side substrate 3.
摘要翻译：提供了一种能够获得稳定的连接电阻而不需要在与外部端子连接时的配合精度的触摸面板，以及使用该触摸面板的电子设备的显示窗口用保护面板。模拟型触摸面板包括在其相对的内表面上设置有电阻膜2a，3a的触摸侧基板2和非接触侧基板3。形成在非接触侧基板3的周围的通孔4a，4b，4c，4d。用于将电阻膜2a，3a的电极与外部端子电连接的连接部5 导电膏被注入到通孔中，并且铆钉14从下表面侧插入到每个通孔中，使得铆钉14的头部形成平坦的连接电极15a，15b，用于连接到非接触侧基板3的下表面的外部端子。

40. 发明授权

US07233069B2 Interconnection substrate and fabrication method thereof 失效
标题翻译：互连基板及其制造方法
公开(公告)号：US07233069B2
公开(公告)日：2007-06-19
申请号：US10947177
申请日：2004-09-23
申请人： Norihito Tsukahara , Kazuhiro Nishikawa , Daisuke Sakurai
发明人： Norihito Tsukahara , Kazuhiro Nishikawa , Daisuke Sakurai
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H05K3/247 , H01L2924/0002 , H05K1/095 , H05K2201/0266 , H05K2201/035 , H01L2924/00
摘要： An interconnection substrate includes: an interconnection layer region where at least a first conductor layer and a second conductor layer are vertically stacked in that order on a substrate, with the first conductor layer and second conductor layer containing conductive particles and a binder, wherein the first conductor layer and second conductor layer stacked in the interconnection layer region have conductive particles different in average particle size from each other. As a result, only an intended region can have low resistance.
摘要翻译：互连基板包括：互连层区域，其中至少第一导体层和第二导体层在基板上依次垂直堆叠，第一导体层和第二导体层包含导电颗粒和粘合剂，其中第一堆叠在互连层区域中的导体层和第二导体层具有彼此平均粒径不同的导电粒子。结果，只有预期的区域可以具有低电阻。

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