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31. 发明授权

US4360847A Diode assisted relay contactor 失效
标题翻译：二极管辅助继电器接触器
公开(公告)号：US4360847A
公开(公告)日：1982-11-23
申请号：US222410
申请日：1981-01-05
申请人： Milton D. Bloomer , Joseph L. Ciccone , John D. Harnden, Jr. , William P. Kornrumpf , Donald P. Shattuck
发明人： Milton D. Bloomer , Joseph L. Ciccone , John D. Harnden, Jr. , William P. Kornrumpf , Donald P. Shattuck
IPC分类号： G01R19/175 , H01H9/54 , H01H9/56 , H01H51/00 , H02H3/00
CPC分类号： H01H9/56 , G01R19/175 , H01H51/005 , H01H9/541 , H01H9/563
摘要： A switching circuit having hybrid contactors connects the three output lines of a 3 phase AC power source to three input lines of a load, such as a motor and the like. A single pair of relay contacts is used to directly connect one output line of the AC power source to one input line of the load, whereas each of the other two phases of the AC power source are supplied to the load by one of a pair of pilot relay contacts in series with a diode-shunted one of a pair of master relay contacts. Only two extra pilot relays are used to provide a reversing function. The switching circuit further includes a zero-crossing detector, a phase-sequence detector, a control circuit including four flip-flops arranged in a tumble-down chain and a single distribution circuit having a data select circuit. The control circuit causes the making and breaking of the contacts at particular times, and in a sequence, such that arcing is prevented.
摘要翻译：具有混合接触器的开关电路将三相AC电源的三条输出线连接到诸如电动机等负载的三条输入线。一对继电器触点用于将交流电源的一个输出线直接连接到负载的一个输入线，而交流电源的其他两相中的每一个通过一对先导继电器触点与一对主继电器触点中的二极管分流器串联。只有两个额外的先导继电器用于提供换向功能。开关电路还包括过零检测器，相序检测器，包括布置在滚降链中的四个触发器和具有数据选择电路的单个分配电路的控制电路。控制电路在特定时间引起触点的制作和断开，并且按顺序使得防止电弧。

32. 发明授权

US4281372A Power supply for magnetron and the like loads 失效
标题翻译：磁控管等的电源负载
公开(公告)号：US4281372A
公开(公告)日：1981-07-28
申请号：US86826
申请日：1979-10-22
申请人： William P. Kornrumpf
发明人： William P. Kornrumpf
IPC分类号： H05B6/68
CPC分类号： H05B6/666 , H05B6/68
摘要： A flyback-type high-frequency, high-voltage power supply for energizing a self-rectifying load, such as a magnetron microwave power generator for a microwave oven and the like. A switching device is connected in series with a primary winding of a transformer to provide pulses of energy to a self-resonant circuit at the transformer secondary winding. The self-resonant circuit includes the electrical capacitance of the load connected across the transformer secondary winding. The load conducts only for unipolarity excitation exceeding a minimum magnitude. A clamping diode is positioned in parallel with the switching device, at the transformer primary winding, to protect the switching device from reverse-voltage effects. A high-voltage rectifier is not required in this relatively light-weight power supply.
摘要翻译：用于激励自整流负载的反激式高频，高压电源，例如用于微波炉的磁控管微波发生器等。开关装置与变压器的初级绕组串联连接，以向变压器次级绕组的自谐振电路提供能量脉冲。自谐振电路包括跨变压器次级绕组连接的负载的电容。负载仅对超过最小值的单极化激励。在变压器初级绕组处，钳位二极管与开关器件并联放置，以保护开关器件免受反向电压影响。在这种相对较轻的电源中不需要高压整流器。

33. 发明授权

US5452182A Flexible high density interconnect structure and flexibly interconnected system 失效
标题翻译：灵活的高密度互连结构和灵活互连的系统
公开(公告)号：US5452182A
公开(公告)日：1995-09-19
申请号：US865786
申请日：1992-04-07
申请人： Charles W. Eichelberger , William P. Kornrumpf , Robert J. Wojnarowski
发明人： Charles W. Eichelberger , William P. Kornrumpf , Robert J. Wojnarowski
IPC分类号： H01L23/52 , H01L21/00 , H01L21/68 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H05K1/02 , H05K1/05 , H05K1/14 , H05K1/18 , H05K3/00 , H05K1/11
CPC分类号： H05K1/189 , H01L21/67144 , H01L21/6835 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L2221/68313 , H01L2224/24227 , H01L2224/7665 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H05K1/05 , H05K2201/051 , H05K2201/09745 , H05K2201/2009 , H05K2203/0264 , H05K3/0058
摘要： A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.
摘要翻译：通过将高密度互连结构延伸超过含有由此相互连接的芯片的固体基板而提供灵活的高密度互连结构。在制造期间，高密度互连结构的柔性部分由临时互连支撑支撑，以便于根据现有制造技术制造结构。随后，如果临时支撑结构足够柔软以赋予该高密度互连结构部分所需的柔性程度，那么该临时支撑结构可被移除或保持在适当位置。还公开了制造方法。

34. 发明授权

US5389876A Flexible eddy current surface measurement array for detecting near surface flaws in a conductive part 失效
标题翻译：灵活的涡流表面测量阵列，用于检测导电部件中的近表面缺陷
公开(公告)号：US5389876A
公开(公告)日：1995-02-14
申请号：US696455
申请日：1991-05-06
申请人： Kristina H. V. Hedengren , Richard O. McCary , Robert P. Alley , Richard J. Charles , William P. Kornrumpf , John D. Young
发明人： Kristina H. V. Hedengren , Richard O. McCary , Robert P. Alley , Richard J. Charles , William P. Kornrumpf , John D. Young
IPC分类号： G01N27/90 , G01N27/82 , G01R33/12
CPC分类号： G01N27/902 , G01N27/904
摘要： An eddy current probe array is disclosed comprising a plurality of spatially correlated eddy current probe elements sufficiently disposed within a flexible interconnecting structure to collect a discrete plurality of spatially correlated eddy current measurements for nondestructive near surface flaw detection. A plurality of precisely fabricated, substantially identical elements being sufficiently distributed can accommodate inspecting an area of conductor covered by the active width of the array in a single uni-directional scan. The array structure can flexibly conform to accommodate inspection of large, irregular, curved conductive surfaces which cannot be inspected by conventional means.
摘要翻译：公开了一种涡流探针阵列，其包括充分设置在柔性互连结构内的多个空间相关的涡流探针元件，以收集用于非破坏性近面探伤的离散的多个空间相关涡流测量。多个精确制造的基本上相同的足够分布的元件可以容纳在单个单向扫描中检查由阵列的有效宽度覆盖的导体的区域。阵列结构可以灵活地符合适应大型不规则弯曲导电表面的检查，这些传统表面不能用常规方法检查。

35. 发明授权

US5345205A Compact high density interconnected microwave system 失效
标题翻译：紧凑型高密度互联微波系统
公开(公告)号：US5345205A
公开(公告)日：1994-09-06
申请号：US504753
申请日：1990-04-05
申请人： William P. Kornrumpf
发明人： William P. Kornrumpf
IPC分类号： H01L23/538 , H01L23/66 , H01P3/08 , H05K1/00
CPC分类号： H01L23/66 , H01L23/5387 , H01L24/18 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/3011 , Y10T29/49124
摘要： A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the interconnect structure on appropriate sized mandrels between the modules to place the modules in a multi-tier physical stack. Shielding and hermetic packaging may also be provided.
摘要翻译：多模微波系统以物理紧凑的高可靠性方式组装，采用高密度互连结构来互连微波系统的不同模块，通过使模块之间的互连结构的部分变得柔性并且通过将互连结构折叠在适当尺寸的心轴上在模块之间将模块放置在多层物理堆栈中。也可以提供屏蔽和密封包装。

36. 发明授权

US5331203A High density interconnect structure including a chamber 失效
标题翻译：包括腔室的高密度互连结构
公开(公告)号：US5331203A
公开(公告)日：1994-07-19
申请号：US141460
申请日：1993-10-25
申请人： Robert J. Wojnarowski , Charles W. Eichelberger , William P. Kornrumpf
发明人： Robert J. Wojnarowski , Charles W. Eichelberger , William P. Kornrumpf
IPC分类号： H01L23/538 , H01L23/02 , H01L23/12
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L2224/2402 , H01L2224/24227 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01052 , H01L2924/01058 , H01L2924/01068 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/10329 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011
摘要： A high density interconnect structure is rendered suitable for the packaging of overlay sensitive chips by providing a cavity in the high density interconnect structure which spaces the sensitive surface of such chips from the overlying high density interconnect structure in a manner which prevents undesired interactions between the dielectric of the high density interconnect structure and the chip.
摘要翻译：通过在高密度互连结构中提供空腔使得高密度互连结构适合于覆盖敏感芯片的封装，其将这种芯片的敏感表面与上覆的高密度互连结构隔离，以防止电介质之间的不期望的相互作用的高密度互连结构和芯片。

37. 发明授权

US5315486A Hermetically packaged HDI electronic system 失效
标题翻译：密封HDI电子系统
公开(公告)号：US5315486A
公开(公告)日：1994-05-24
申请号：US73250
申请日：1993-06-07
申请人： Raymond A. Fillion , William P. Kornrumpf , Edward S. Bernard
发明人： Raymond A. Fillion , William P. Kornrumpf , Edward S. Bernard
IPC分类号： H01L23/02 , H01L23/057 , H01L23/10 , H01L23/12 , H01L23/13 , H01L23/50 , H01L23/538 , H01L25/04 , H01L25/18 , H01L23/053 , H01L23/055 , H05K1/16
CPC分类号： H01L23/538 , H01L23/057 , H01L23/10 , H01L23/13 , H01L23/5384 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15192 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011
摘要： A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner contact points and a set of outer contact points bridging a seal ring that comprises either a solder seal or a weldable seal for the hermetic package lid. The outer contact points may be directly connected to a leadframe. The leadframe leads, after severing, can be directly attached to a printed circuit board.
摘要翻译：特别适用于高密度互连（HDI）电子系统的气密封装采用陶瓷衬底，其用作气密封装的底座。衬底包括共烧体，其包括掩埋导体，其提供一组内部接触点之间的电连续性，以及桥接密封环的一组外部接触点，该密封环包括密封封装盖的焊接密封件或可焊接密封件。外部接触点可以直接连接到引线框架。引线框引线在断开之后可以直接连接到印刷电路板。

38. 发明授权

US5206712A Building block approach to microwave modules 失效
标题翻译：微波模块的构建方法
公开(公告)号：US5206712A
公开(公告)日：1993-04-27
申请号：US504760
申请日：1990-04-05
申请人： William P. Kornrumpf , David A. Bates
发明人： William P. Kornrumpf , David A. Bates
IPC分类号： G01R1/04 , H01L21/60 , H01L21/66 , H01L23/13 , H01L23/538 , H01L23/64
CPC分类号： H01L22/20 , G01R1/04 , H01L23/13 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L23/642 , H01L24/24 , H01L24/82 , H01L2224/24137 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011
摘要： Microwave components are prepackaged and pretested to provide standard microwave components or subsystems. A dielectric overlay interconnection structure enables accurate testing and rework of out of specification packages. Microwave systems are formed of a plurality of such prepackaged components with a high yield.
摘要翻译：微波组件被预先包装并预先测试以提供标准的微波组件或子系统。介质覆盖互连结构使得能够对规格包进行精确测试和返工。微波系统由多种这样的预先包装的组分以高产率形成。

39. 发明授权

US5146303A Compact, thermally efficient focal plane array and testing and repair thereof 失效
标题翻译：紧凑，高效的焦平面阵列及其测试和修复
公开(公告)号：US5146303A
公开(公告)日：1992-09-08
申请号：US504751
申请日：1990-04-05
申请人： William P. Kornrumpf , Walter M. Marcinkiewicz , William E. Davern , Herbert C. Zieger , Jonathan R. Miles
发明人： William P. Kornrumpf , Walter M. Marcinkiewicz , William E. Davern , Herbert C. Zieger , Jonathan R. Miles
IPC分类号： H01L25/16 , H01L27/146 , H01L31/024
CPC分类号： H01L24/49 , H01L25/167 , H01L27/146 , H01L31/024 , H01L2224/05554 , H01L2224/45015 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787
摘要： In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.
摘要翻译：在焦平面阵列传感器混合物中，制造在一个半导体材料的芯片中的焦平面阵列和在不同半导体材料的一个或多个芯片中制造的读出电路通过高密度互连结构连接，其中电介质层材料被结合到芯片并且具有布置在其上并且穿过其中的通孔的互连导体与芯片的适当接触垫的欧姆接触。在高密度互连结构中包括柔性部分使得读出和焦平面阵列芯片能够设置在不同的平面中以提供紧凑的结构。这种结构促进了焦平面阵列传感器混合测试和修复。

40. 发明授权

US4967568A Control system, method of operating an atmospheric cooling apparatus and atmospheric cooling apparatus 失效
标题翻译：控制系统，操作大气冷却装置和大气冷却装置的方法
公开(公告)号：US4967568A
公开(公告)日：1990-11-06
申请号：US439540
申请日：1989-11-20
申请人： John D. Harnden, Jr. , William P. Kornrumpf
发明人： John D. Harnden, Jr. , William P. Kornrumpf
IPC分类号： F25D17/06 , F25D29/00 , H01H57/00
CPC分类号： H01H57/00 , F25D17/065 , F25D29/00 , F25B2600/0251 , F25D2317/0653 , F25D2400/04 , Y02B40/32
摘要： A control system for regulating electrical power input to the refrigeration mechanism or defrost mechanism in an atmospheric cooling apparatus, including domestic refrigeration appliances, is provided which employs at least one piezoceramic relay device. The electrical power is applied with the piezoceramic relay device responsive to control signals and with the control circuitry being directly and ohmically connected to the power source. In one embodiment, the control means employs individual piezoceramic relay devices for power regulation to the respective mechanisms while in a different embodiment a single piezoceramic relay device regulates power input between the refrigeration mechanism and the defrost mechanism. A method of operating the controlled apparatus in such manner and a refrigeration apparatus having such control means are also disclosed.
摘要翻译：提供一种用于调节在包括家用制冷装置的大气冷却装置中输入到制冷机构或除霜机构的电力的控制系统，其使用至少一个压电陶瓷中继装置。响应于控制信号并且控制电路直接和欧姆地连接到电源，电压与压电陶瓷继电器一起施加。在一个实施例中，控制装置采用单独的压电陶瓷继电器来对各个机构进行功率调节，而在不同的实施例中，单个压电陶瓷继电器调节制冷机构和除霜机构之间的功率输入。还公开了以这种方式操作受控装置的方法和具有这种控制装置的制冷装置。

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