会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 33. 发明授权
    • Particle removal wafer
    • 除颗粒
    • US5762688A
    • 1998-06-09
    • US632352
    • 1996-04-10
    • David H. ZigerPierre Leroux
    • David H. ZigerPierre Leroux
    • H01L21/00H01L21/306B01D47/14
    • H01L21/306H01L21/67028
    • A particle removal wafer including ridges defining recessed areas and sticky material placed in these recessed areas can be run through wafer processing equipment. The particle removal wafer can remove particles that would otherwise adhere to the backs of wafers run through this equipment. Particles adhering to the backs of wafers are a problem in the photolithographic steps. These particles cause the focus of the photolithographic system to be off and thus can cause fatal errors. By removing the particles which could adhere to the backs of wafers from the wafer fabrication equipment, the accuracy of the photolithographic process can be improved.
    • 包括限定凹陷区域的脊和放置在这些凹陷区域中的粘性材料的颗粒去除晶片可以穿过晶片处理设备。 颗粒去除晶片可以去除否则粘附到穿过该设备的晶片背面的颗粒。 附着在晶片背面的颗粒在光刻步骤中是一个问题。 这些颗粒导致光刻系统的焦点关闭,从而可能导致致命错误。 通过从晶片制造设备去除可能粘附到晶片背面的颗粒,可以提高光刻工艺的精度。
    • 34. 发明授权
    • Semiconductor wafer defect monitoring
    • 半导体晶圆缺陷监测
    • US5392113A
    • 1995-02-21
    • US954200
    • 1992-09-30
    • Anthony SaykaStacy W. HallJudy U. GallowayPierre LerouxBryan D. SchmidtDaniel D. SiemsHenry B. Taylor, IIIEdward R. Vokoun
    • Anthony SaykaStacy W. HallJudy U. GallowayPierre LerouxBryan D. SchmidtDaniel D. SiemsHenry B. Taylor, IIIEdward R. Vokoun
    • G01N21/95G01N21/88
    • G01N21/9501
    • Method and apparatus for detecting the presence of selected types of defects, such as chemical stains from a liquid photoresist material or a liquid dielectric material, on a non-visible chosen surface of a semiconductor water that has undergone at least one processing step. In one embodiment, a support substrate for, the wafer is provided that has a highly reflecting surface adjacent to the chosen surface. The reflecting surface and the chosen surface are moved apart, and the chosen surface is illuminated with light to form an optical image of the chosen surface. The optical image of the chosen surface is reflected in the reflecting surface, and the reflected optical image is examined for the presence of selected types of defects. In another embodiment, a portion of this reflecting surface is initially contiguous to the chosen surface. A selected defect, if any, on the chosen surface changes a surface characteristic of the reflecting surface so that the presence of this defect on the chosen surface is visually perceptible on the reflecting surface.
    • 用于检测在经过至少一个处理步骤的半导体水的不可见的选定表面上存在选定类型的缺陷(例如来自液态光致抗蚀剂材料或液体介电材料的化学污渍)的存在的方法和装置。 在一个实施例中,提供了一种用于晶片的支撑基板,其具有与所选择的表面相邻的高反射表面。 反射表面和所选择的表面被移动分开,并且所选择的表面被光照射以形成所选表面的光学图像。 所选择的表面的光学图像被反射在反射表面中,并且检查反射的光学图像以存在所选择的缺陷类型。 在另一个实施例中,该反射表面的一部分最初与所选择的表面相邻。 所选择的表面上的选定的缺陷(如果有的话)改变反射表面的表面特性,使得在所选择的表面上存在该缺陷在反射表面上在视觉上是可察觉的。
    • 37. 发明申请
    • Measuring the effect of flare on line width
    • 测量耀斑对线宽的影响
    • US20060210885A1
    • 2006-09-21
    • US10566804
    • 2004-07-31
    • David ZigerPierre Leroux
    • David ZigerPierre Leroux
    • G03C5/00G03F1/00G01B11/00G06F17/50G06K9/00H01L21/66G01R31/26
    • G03F7/70941G03F1/44G03F1/70G03F7/70591G03F7/70616
    • In photo-lithography, one may assess the effect of flare due to various exposure tools. In an example embodiment, in a photo-lithography process on a photo resist coated substrate, there is a method (600) for determining the effect of flare on line shortening. The method (600) comprises, at a first die position on the substrate and in a first exposure, printing a first mask (610) that includes a flare pattern (110) corresponding to one corner of the first mask (610), and in a second exposure, printing a second mask (620) that includes another flare pattern corresponding to an opposite corner of the second mask. At a second die position on the substrate, a composite mask pattern (630) based on features of the first mask and the second is printed. The printed patterns (640) are developed and measurements (650) are obtained therefrom. The effect of flare (660) is determined as a function of the measurements.
    • 在光刻中,可以评估由各种曝光工具引起的耀斑的影响。 在一个示例性实施例中,在光刻胶涂覆的基底上的光刻工艺中,存在用于确定火花线对线缩短效果的方法(600)。 方法(600)包括在基板上的第一裸片位置和第一曝光中,打印包括对应于第一掩模(610)的一个角的闪光图案(110)的第一掩模(610),并且 第二曝光,打印包括对应于第二掩模的相对角的另一个耀斑图案的第二掩模(620)。 在衬底上的第二管芯位置,印刷基于第一​​掩模和第二掩模的特征的复合掩模图案(630)。 显影印刷图案(640),并由此获得测量(650)。 作为测量的函数确定耀斑(660)的影响。
    • 39. 发明授权
    • Method for determining rotational error portion of total misalignment error in a stepper
    • 用于确定步进器中总失准误差的旋转误差部分的方法
    • US06639676B1
    • 2003-10-28
    • US09422909
    • 1999-10-21
    • Pierre Leroux
    • Pierre Leroux
    • G01B1100
    • G03F7/70591G03F7/70633
    • A method for determining rotational error portion of total misalignment error in a stepper. In one embodiment, the method comprises a series of steps in a stepper, starting with the step of receiving a wafer, having a first pattern and an error-free fine alignment target, in the stepper. In another step, the wafer is aligned in the stepper using the error-free fine alignment target. Then a second pattern is created on the wafer overlaying said first pattern. In another step, the rotational error portion of the total misalignment error is determined by measuring the circumferential misalignment between the first pattern and the second pattern.
    • 用于确定步进机中的总失准误差的旋转误差部分的方法。 在一个实施例中,该方法包括步进器中的一系列步骤,从在步进器中接收具有第一图案和无差错精细对准目标的晶片的步骤开始。 在另一步骤中,使用无差错的精细对准靶将晶片对准在步进机中。 然后在覆盖所述第一图案的晶片上产生第二图案。 在另一步骤中,通过测量第一图案和第二图案之间的周向未对准来确定总失准误差的旋转误差部分。
    • 40. 发明授权
    • Method for determining magnification error portion of total misalignment error in a stepper
    • 用于确定步进机中总失准误差的倍率误差部分的方法
    • US06541283B1
    • 2003-04-01
    • US09422914
    • 1999-10-21
    • Pierre Leroux
    • Pierre Leroux
    • H01L2166
    • G03F7/70633G03F7/70975
    • A method for determining magnification error portion of total misalignment error in a stepper. In one embodiment, the method comprises a series of steps in a stepper, starting with the step of receiving a wafer, having a first pattern and an error-free fine alignment target, in the stepper. In another step, the wafer is aligned in the stepper using the error-free fine alignment target. Then a second pattern is created on the wafer overlaying said first pattern. In another step, the magnification error portion of the total misalignment error is determined by measuring the radial misalignment between the first pattern and the second pattern.
    • 用于确定步进机中的总失准误差的放大误差部分的方法。 在一个实施例中,该方法包括步进器中的一系列步骤,从在步进器中接收具有第一图案和无差错精细对准目标的晶片的步骤开始。 在另一步骤中,使用无差错的精细对准靶将晶片对准在步进机中。 然后在覆盖所述第一图案的晶片上产生第二图案。 在另一步骤中,通过测量第一图案和第二图案之间的径向未对准来确定总失准误差的放大误差部分。