会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 32. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20130015518A1
    • 2013-01-17
    • US13353818
    • 2012-01-19
    • Hiroyasu SATOKiyohito NISHIHARAHidefumi NAWATAMasayuki ICHIGERyuji OHBA
    • Hiroyasu SATOKiyohito NISHIHARAHidefumi NAWATAMasayuki ICHIGERyuji OHBA
    • H01L29/788
    • H01L29/7881H01L21/764H01L27/11524H01L29/40114H01L29/42336H01L29/66825
    • In general, according to one embodiment, a semiconductor memory device includes active areas extending in a first direction, tunnel films provided on the active areas, floating gate electrodes provided on the tunnel films, an interelectrode insulating film provided on the floating gate electrodes and extending in a second direction, a control gate electrode provided on the interelectrode insulating film and extending in the second direction, a lower insulating portion provided between the active areas, between the tunnel films, and between the floating gate electrodes adjacent in the second direction, and an upper insulating portion provided between the lower insulating portion and the interelectrode insulating film. The lower insulating portion includes a void. Relative dielectric constant of the upper insulating portion is higher than that of the lower insulating portion. Relative dielectric constant of the interelectrode insulating film is higher than that of the upper insulating portion.
    • 通常,根据一个实施例,半导体存储器件包括在第一方向上延伸的有源区域,设置在有源区域上的隧道膜,设置在隧道膜上的浮置栅极电极,设置在浮动栅电极上并延伸的电极间绝缘膜 在第二方向上,设置在电极间绝缘膜上并沿第二方向延伸的控制栅电极,设置在有源区之间,隧道膜之间以及在第二方向相邻的浮栅之间的下绝缘部分,以及 设置在下绝缘部和电极间绝缘膜之间的上绝缘部。 下绝缘部分包括空隙。 上绝缘部分的相对介电常数高于下绝缘部分的相对介电常数。 电极间绝缘膜的相对介电常数高于上绝缘部分。
    • 33. 发明授权
    • Nonvolatile semiconductor flash memory
    • 非易失性半导体闪存
    • US08212308B2
    • 2012-07-03
    • US12618058
    • 2009-11-13
    • Kiyohito NishiharaFumitaka Arai
    • Kiyohito NishiharaFumitaka Arai
    • H01L29/788
    • H01L29/42336H01L21/764H01L27/11521H01L27/11524H01L29/7881
    • Two diffusion layers are provided in an element area. A tunnel insulating film is provided on the surface of the element area between the two diffusion layers. A charge storage layer is provided on the tunnel insulating film. A first insulator provided on the upper surface of the charge storage layer. An inter-electrode insulating film provided on the first insulator, on the side surface of the charge storage layer in a first direction and on the isolation insulating film. And a control gate electrode extends in the first direction and covers the charge storage layer via the first insulator and the inter-electrode insulating film. The first insulator is thicker than the inter-electrode insulating film, and the inter-electrode insulating film has a first slit on the first insulator.
    • 在元件区域中设置两个扩散层。 隧道绝缘膜设置在两个扩散层之间的元件区域的表面上。 电荷存储层设置在隧道绝缘膜上。 设置在电荷存储层的上表面上的第一绝缘体。 一种电极间绝缘膜,设置在第一绝缘体上,在电荷存储层的第一方向的侧表面上以及隔离绝缘膜上。 并且控制栅极电极沿第一方向延伸并且经由第一绝缘体和电极间绝缘膜覆盖电荷存储层。 第一绝缘体比电极间绝缘膜厚,并且电极间绝缘膜在第一绝缘体上具有第一狭缝。
    • 34. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08183624B2
    • 2012-05-22
    • US12061075
    • 2008-04-02
    • Makoto MizukamiKiyohito Nishihara
    • Makoto MizukamiKiyohito Nishihara
    • H01L29/788
    • H01L27/105H01L27/0688H01L27/11529H01L27/11531H01L27/11556
    • A semiconductor memory device includes a substrate having a step including a first upper surface and a second upper surface higher than the first upper surface, a memory cell array formed on the first upper surface, and a peripheral circuit formed on the second upper surface and configured to supply an electrical signal to the memory cell array. The memory cell array includes a stacked structure having a plurality of first interconnection layers and a plurality of second interconnection layers respectively connected to the first interconnection layers. The first interconnection layers are stacked on the first upper surface, are separated from each other by insulating films, and extend in a first direction. The second interconnection layers extend upward and are separated from each other by insulating films.
    • 半导体存储器件包括具有包括第一上表面和高于第一上表面的第二上表面的步骤的衬底,形成在第一上表面上的存储单元阵列和形成在第二上表面上的外围电路, 以向存储单元阵列提供电信号。 存储单元阵列包括具有分别连接到第一互连层的多个第一互连层和多个第二互连层的层叠结构。 第一互连层堆叠在第一上表面上,通过绝缘膜彼此分离,并沿第一方向延伸。 第二互连层向上延伸并通过绝缘膜彼此分离。
    • 35. 发明授权
    • Depletion-type NAND flash memory
    • 消耗型NAND闪存
    • US08039886B2
    • 2011-10-18
    • US12603099
    • 2009-10-21
    • Makoto MizukamiKiyohito Nishihara
    • Makoto MizukamiKiyohito Nishihara
    • H01L29/94
    • H01L27/11568G11C16/0483H01L21/84H01L27/11521H01L27/11524H01L27/11556H01L27/11578H01L27/11582H01L27/1203
    • A depletion-type NAND flash memory includes a NAND string composed of a plurality of serially connected FETs, a control circuit which controls gate potentials of the plurality of FETs in a read operation, a particular potential storage, and an adjacent memory cell threshold storage, wherein each of the plurality of FETs is a transistor whose threshold changes in accordance with a charge quantity in a charge accumulation layer, the adjacent memory cell threshold storage stores a threshold of a source line side FET adjacent to a source line side of a selected FET, and the control circuit applies a potential to the gate electrode of the source line side FET in the read operation, the applied potential being obtained by adding a particular potential stored in the particular potential storage to a threshold stored in the adjacent memory cell threshold storage.
    • 耗尽型NAND闪存包括由多个串联连接的FET组成的NAND串,控制电路,其在读取操作中控制多个FET的栅极电位,特定的电位存储器和相邻的存储单元阈值存储器, 其中,所述多个FET中的每一个是其阈值根据电荷累积层中的电荷量而变化的晶体管,所述相邻存储单元阈值存储器存储与所选择的FET的源极侧相邻的源极侧FET的阈值 ,并且控制电路在读取操作中向源极侧FET的栅电极施加电位,所施加的电位通过将存储在特定电位存储器中的特定电位加到存储在相​​邻存储单元阈值存储器中的阈值 。
    • 39. 发明申请
    • NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 非挥发性半导体存储器件及其制造方法
    • US20090090959A1
    • 2009-04-09
    • US12244174
    • 2008-10-02
    • Kiyohito NishiharaFumitaka Arai
    • Kiyohito NishiharaFumitaka Arai
    • H01L29/423H01L21/28
    • H01L27/1203H01L27/11565H01L27/11568H01L27/11578H01L27/11582H01L29/792H01L29/7926
    • A first lamination part includes: a charge accumulation layer provided on the respective sidewalls of laminated first conductive layers and accumulating charges; and a first semiconductor layer provided in contact with the fourth insulation layer and formed to extend to the lamination direction. A second lamination part includes a second semiconductor layer provided in contact with the first semiconductor layer. A third lamination part includes: a plurality of first contact layers formed in contact with the respective second lamination part, extending to a first direction perpendicular to the lamination direction, and in line with each other along a second direction perpendicular to the first direction; and a plurality of contact plug layers formed in contact with any one of the first contact layers and extending to the lamination direction. The contact plug layers are arranged at different positions relative to each other in the first direction.
    • 第一层压部件包括:电荷累积层,设置在层叠的第一导电层的各个侧壁上并积累电荷; 以及第一半导体层,设置成与所述第四绝缘层接触并形成为向层叠方向延伸。 第二层压部件包括与第一半导体层接触设置的第二半导体层。 第三层压部件包括:多个第一接触层,其形成为与相应的第二层压部分接触,延伸到垂直于层叠方向的第一方向,并且沿着垂直于第一方向的第二方向彼此成直线; 以及多个接触塞层,其形成为与所述第一接触层中的任一个接触并延伸到层叠方向。 接触塞层在第一方向上相对于彼此设置在不同的位置。