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    • 31. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110006346A1
    • 2011-01-13
    • US12919640
    • 2009-03-12
    • Yuji AndoYasuhiro OkamotoKazuki OtaTakashi InoueTatsuo NakayamaHironobu Miyamoto
    • Yuji AndoYasuhiro OkamotoKazuki OtaTakashi InoueTatsuo NakayamaHironobu Miyamoto
    • H01L29/737
    • H01L29/7783H01L29/2003H01L29/4236H01L29/518H01L29/7785
    • The present invention provides a semiconductor device that has high electron mobility while reducing a gate leakage current, and superior uniformity and reproducibility of the threshold voltage, and is also applicable to the enhancement mode type. The semiconductor device according to the present invention is a semiconductor device having such a structure formed by sequentially laminating a lower barrier layer composed of lattice-relaxed AlxGa1-xN (0≦x≦1), a channel layer composed of InyGa1-yN (0≦y≦1) with compressive strain and a contact layer composed of AlzGa1-zN (0≦z≦1), wherein a two-dimensional electron gas is produced in the vicinity of an interface of said InyGa1-yN channel layer with said AlzGa1-zN contact layer; a gate electrode is formed so as to be embedded in the recessed portion with intervention of an insulating film, which recessed portion is formed by removing a part of said AlzGa1-zN contact layer by etching it away until said InyGa1-yN channel layer is exposed; and, ohmic electrodes are formed on the AlzGa1-zN contact layer. Thus, there is provided a semiconductor device that has superior uniformity and reproducibility of the threshold voltage while maintaining a low gate leakage current and high electron mobility, and thereby, is capable of operation in enhancement mode.
    • 本发明提供了一种在降低栅极漏电流的同时具有高电子迁移率并具有优异的阈值电压的均匀性和再现性的半导体器件,并且也适用于增强型。 根据本发明的半导体器件是具有这样的结构的半导体器件,该半导体器件通过顺序地层叠由晶格弛豫的Al x Ga 1-x N(0< n 1; x&n 1; 1)构成的下阻挡层,由InyGa1-yN(0& ; y≦̸ 1)具有压应变和由AlzGa1-zN(0& nlE; z≦̸ 1)组成的接触层,其中在所述In y Ga 1-y N沟道层的界面附近产生二维电子气体与所述AlzGa1 -zN接触层 通过介入绝缘膜形成嵌入在凹陷部分中的栅电极,该凹陷部分通过蚀刻除去所述AlzGa1-zN接触层的一部分而形成,直到所述In y Ga 1-y N沟道层暴露 ; 并且在AlzGa1-zN接触层上形成欧姆电极。 因此,提供了具有优异的阈值电压的均匀性和再现性的半导体器件,同时保持低栅极漏电流和高电子迁移率,从而能够在增强模式下操作。
    • 35. 发明授权
    • Semiconductor device using a group III nitride-based semiconductor
    • 使用III族氮化物基半导体的半导体器件
    • US08674407B2
    • 2014-03-18
    • US12919640
    • 2009-03-12
    • Yuji AndoYasuhiro OkamotoKazuki OtaTakashi InoueTatsuo NakayamaHironobu Miyamoto
    • Yuji AndoYasuhiro OkamotoKazuki OtaTakashi InoueTatsuo NakayamaHironobu Miyamoto
    • H01L29/66
    • H01L29/7783H01L29/2003H01L29/4236H01L29/518H01L29/7785
    • The present invention provides a semiconductor device having such a structure formed by sequentially laminating a lower barrier layer composed of lattice-relaxed AlxGa1-xN (0≦x≦1), a channel layer composed of InyGa1-yN (0≦y≦1) with compressive strain and a contact layer composed of AlzGa1-zN (0≦z≦1), wherein a two-dimensional electron gas is produced in the vicinity of an interface of said InyGa1-yN channel layer with said AlzGa1-zN contact layer; a gate electrode is formed so as to be embedded in the recessed portion with intervention of an insulating film, which recessed portion is formed by removing a part of said AlzGa1-zN contact layer by etching it away until said InyGa1-yN channel layer is exposed; and, ohmic electrodes are formed on the AlzGa1-zN contact layer. Thus, the semiconductor device has superior uniformity and reproducibility of the threshold voltage while maintaining a low gate leakage current, and is also applicable to the enhancement mode type.
    • 本发明提供一种具有这样的结构的半导体器件,该半导体器件通过依次层叠由晶格弛豫的Al x Ga 1-x N(0 @ x @ 1)构成的下阻挡层,由InyGa1-yN(0 @ y @ 1) 具有压应变和由Al z Ga 1-z N(0 @ z @ 1)组成的接触层,其中在所述In y Ga 1-y N沟道层与所述Al z Ga 1-z N接触层的界面附近产生二维电子气; 通过介入绝缘膜形成嵌入在凹陷部分中的栅电极,该凹陷部分通过蚀刻除去所述AlzGa1-zN接触层的一部分而形成,直到所述In y Ga 1-y N沟道层暴露 ; 并且在AlzGa1-zN接触层上形成欧姆电极。 因此,半导体器件在保持低栅极漏电流的同时具有优异的阈值电压的均匀性和再现性,并且也适用于增强型。
    • 39. 发明授权
    • Field effect transistor
    • 场效应晶体管
    • US08618578B2
    • 2013-12-31
    • US13147676
    • 2010-02-03
    • Kazuki OtaYasuhiro OkamotoHironobu Miyamoto
    • Kazuki OtaYasuhiro OkamotoHironobu Miyamoto
    • H01L29/66
    • H01L29/4236H01L29/1029H01L29/2003H01L29/42316H01L29/66462H01L29/66621H01L29/7783H01L29/7787
    • A field effect transistor includes a nitride-based semiconductor multi-layer structure, a source electrode (108), a drain electrode (109), a protective film (110), and a gate electrode (112) that is provided in a recess structure, which is formed by etching, directly or with a gate insulating film interposed therebetween. The nitride-based semiconductor multi-layer structure includes at least a base layer (103) made of AlXGa1-XN (0≦1), a channel layer (104) made of GaN or InGaN, a first electron supply layer (105), which is an undoped or n-type AlYGa1-YN layer, a threshold value control layer (106), which is an undoped AlZGa1-ZN layer, and a second electron supply layer (107), which is an undoped or n-type AlWGa1-WN layer, epitaxially grown in this order on a substrate (101) with a buffer layer (102) interposed therebetween. The Al composition of each layer in the nitride-based semiconductor multi-layer structure satisfies 0
    • 场效应晶体管包括氮化物基半导体多层结构,源电极(108),漏电极(109),保护膜(110)和设置在凹槽结构中的栅电极(112) ,其通过蚀刻直接形成,或者在其间插入栅极绝缘膜。 所述氮化物系半导体多层结构至少包括由Al x Ga 1-x N(0 1)构成的基极层(103),由GaN或InGaN构成的沟道层(104),第1电子供给层(105) 其是未掺杂的或n型AlYGa1-YN层,作为未掺杂的AlZGa1-ZN层的阈值控制层(106)和作为未掺杂的或n型AlWGa1的第二电子供给层(107) -WN层,在衬底(101)上依次外延生长,缓冲层(102)插入其间。 氮化物类半导体多层结构中的各层的Al组成满足0