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31. 发明申请

US20110152285A1 PYRROLE ANTIFUNGAL AGENTS 有权
标题翻译： PYROROLE反真菌药
公开(公告)号：US20110152285A1
公开(公告)日：2011-06-23
申请号：US12989410
申请日：2009-04-23
申请人： Graham Edward Morris Sibley , Robert Downham , Lloyd James Payne , Derek Law , Jason David Oliver , Mike Birch , Gareth Morse Davies , Patricia Suling Davies
发明人： Graham Edward Morris Sibley , Robert Downham , Lloyd James Payne , Derek Law , Jason David Oliver , Mike Birch , Gareth Morse Davies , Patricia Suling Davies
IPC分类号： A61K31/497 , C07D409/14 , A61P31/10
CPC分类号： A61K31/5377 , A01N43/36 , A01N43/40 , A01N43/42 , A01N43/60 , A01N43/76 , A01N43/84 , A01N43/90 , A61K31/4025 , A61K31/4439 , A61K31/4709 , A61K31/4725 , A61K31/496 , A61K31/4985 , A61K45/06 , C07D487/04 , C07D498/04
摘要： The invention provides compounds of formula (I), and pharmaceutically and agriculturally acceptable salts thereof; wherein: R1, R2, R3, R4, R5, R6, A1, L1 and n are as defined herein. These compounds and their pharmaceutically acceptable salts are useful in prevention or treatment of a fungal disease. Compounds of formula (I), and agriculturally acceptable salts thereof, may also be used as agricultural fungicides.
摘要翻译：本发明提供式（I）化合物及其药学上和农业上可接受的盐; 其中：R1，R2，R3，R4，R5，R6，A1，L1和n如本文所定义。这些化合物及其药学上可接受的盐可用于预防或治疗真菌病。式（I）化合物及其农业上可接受的盐也可以用作农业杀真菌剂。

32. 发明申请

US20100047044A1 PLACEMENT HEAD FOR A DIE PLACING ASSEMBLY 有权
标题翻译：放置头用于放置组件
公开(公告)号：US20100047044A1
公开(公告)日：2010-02-25
申请号：US12193751
申请日：2008-08-19
申请人： David Oliver Burke , Jan Waszczuk , Desmond Bruce Boyton , Craig Donald Strudwicke , Peter John Morley Sobey , William Granger , Jason Mark Thelander , Eric Patrick O'Donnell
发明人： David Oliver Burke , Jan Waszczuk , Desmond Bruce Boyton , Craig Donald Strudwicke , Peter John Morley Sobey , William Granger , Jason Mark Thelander , Eric Patrick O'Donnell
IPC分类号： H01L21/67
CPC分类号： H01L21/67144 , H01L21/67248 , H01L21/67276 , H01L21/681
摘要： The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage. The placement head further includes a third translation stage mounted on the second stage, the third stage displaceable orthogonally to the first and second stages, as well as a die placer head mounted to the third stage, the placer head shaped and dimensioned to operatively receive a die from the dice conveyance mechanism and to place the dice onto the carrier.
摘要翻译：本发明提供一种用于组装骰子的模具放置组件的放置头，用于将骰子装配在载体上。汇编器具有外壳，其具有用于在其上操作地支撑晶片的支撑组件，用于从所述晶片拾取骰子的模具拾取组件，用于将模具放置在载体上的管芯放置组件，将模具从模具拾取和放置组件，以及控制组装器的控制系统。放置头包括安装在管芯放置组件上的第一平移台，所述第一台可相对于管芯放置组件沿第一轴线可操作地移位。放置头还包括安装在第一平台上的第二平移台，第二平台可垂直于第一平台移动。放置头还包括安装在第二台上的第三平移台，与第一和第二平台正交可移位的第三台，以及安装到第三阶段的模具沉头，其形状和尺寸设计成可操作地接收从骰子传送机构死亡并将骰子放置在载体上。

33. 发明申请

US20100043980A1 ALIGNMENT MECHANISM FOR ALIGNING AN INTEGRATED CIRCUIT 审中-公开
标题翻译：对齐整合电路的对准机制
公开(公告)号：US20100043980A1
公开(公告)日：2010-02-25
申请号：US12193733
申请日：2008-08-19
申请人： Stephen John Sleijpen , James Andrew , Graeme Kenneth Bowyer , William Granger , Jan Waszczuk , David Oliver Burke , Craig Donald Strudwicke , Jason Mark Thelander
发明人： Stephen John Sleijpen , James Andrew , Graeme Kenneth Bowyer , William Granger , Jan Waszczuk , David Oliver Burke , Craig Donald Strudwicke , Jason Mark Thelander
IPC分类号： B32B37/00
CPC分类号： B32B38/1841 , B26D7/086 , B26D7/27 , B32B38/0004 , B32B41/00 , B32B2310/028 , B32B2457/08 , H01L23/544 , H01L2924/0002 , H01L2924/00
摘要： Provided is an alignment mechanism for aligning a lamination film with a carrier substructure prior to laminating the film to the substructure to form a carrier for integrated circuits. The substructure and the lamination film define complementary perforations and a plurality of respective fiducials. The alignment mechanism includes a sensor arrangement configured to detect the fiducials in the lamination film and substructure and a displacement mechanism configured to displace the lamination film with respect to the substructure to align the perforations of the film and substructure respectively according to alignment of their fiducials so that a printing fluid can pass through the perforations in the film and the substructure of the carrier. The mechanism also includes a controller configured to control operation of the sensor arrangement and the displacement mechanism.
摘要翻译：提供了一种用于在将膜层压到子结构之前将层压膜与载体子结构对准的对准机构，以形成用于集成电路的载体。子结构和层压膜限定互补的穿孔和多个相应的基准。对准机构包括：传感器装置，被配置为检测层压薄膜和底层结构中的基准;以及位移机构，其构造成相对于子结构移动层压膜，以分别根据其基准的对准来对准薄膜和子结构的穿孔，从而印刷液体可以穿过胶片中的穿孔和载体的底层结构。该机构还包括控制器，其被配置为控制传感器装置和位移机构的操作。

34. 发明申请

US20100043979A1 BONDING APPARATUS FOR PRINTHEADS 审中-公开
标题翻译：用于打印的连接装置
公开(公告)号：US20100043979A1
公开(公告)日：2010-02-25
申请号：US12193732
申请日：2008-08-19
申请人： Stephen John Sleijpen , James Andrew , Graeme Kenneth Bowyer , William Granger , Jan Waszczuk , David Oliver Burke , Craig Donald Strudwicke , Jason Mark Thelander
发明人： Stephen John Sleijpen , James Andrew , Graeme Kenneth Bowyer , William Granger , Jan Waszczuk , David Oliver Burke , Craig Donald Strudwicke , Jason Mark Thelander
IPC分类号： B32B37/00
CPC分类号： B32B37/26 , B26D7/086 , B26D7/27 , B32B37/0046 , B32B38/0004 , B32B41/00 , B32B2037/268 , B32B2310/028 , B32B2457/08 , Y10T156/17
摘要： The invention relates to a bonding apparatus for bonding a carrier sheet used for carrying printhead integrated circuits to a carrier base. The apparatus includes a support assembly configured to receive and support the carrier base, and a lamination head arranged on the support assembly and configured to bond the carrier sheet to the carrier base. Further included are a conformal material supply mechanism arranged on the support assembly and configured to interpose a conformal material between the surface and the head prior to bonding, and a controller to control operation of the lamination head and the supply mechanism to facilitate bonding of the carrier sheet to the carrier base.
摘要翻译：本发明涉及一种用于将用于承载打印头集成电路的载体片材接合到载体基底的粘合装置。该装置包括构造成接收和支撑载体基座的支撑组件和布置在支撑组件上并被构造成将载体片材结合到载体基座上的层压头。进一步包括的是保形材料供应机构，其布置在支撑组件上并且构造成在结合之前在表面和头部之间插入共形材料;以及控制器，用于控制层压头和供应机构的操作以便于承载器工作台到承运人基地。

35. 发明申请

US20100043224A1 METHOD OF ATTACHING INTEGRATED CIRCUITS TO A CARRIER 有权
标题翻译：将集成电路连接到载体的方法
公开(公告)号：US20100043224A1
公开(公告)日：2010-02-25
申请号：US12193747
申请日：2008-08-19
申请人： David Oliver Burke , Jan Waszczuk , Desmond Bruce Boyton , Craig Donald Strudwicke , Peter John Morley Sobey , William Granger , Jason Mark Thelander , Eric Patrick O'Donnell
发明人： David Oliver Burke , Jan Waszczuk , Desmond Bruce Boyton , Craig Donald Strudwicke , Peter John Morley Sobey , William Granger , Jason Mark Thelander , Eric Patrick O'Donnell
IPC分类号： H01R43/00
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1635 , H01L23/544 , H01L2924/0002 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49169 , Y10T29/49401 , H01L2924/00
摘要： The invention provides for a method of attaching printhead integrated circuitry to a carrier. The method includes scanning a wafer having a number of circuitry dies formed thereon to demarcate respective dies, aligning a die picker with a dice on the wafer according to a wafer substrate mapping scheme, and removing the dice from the wafer with the die picker. The method further includes the steps of transporting the dice to a placement station operatively positioning the carrier, aligning the dice with the carrier; and heat bonding the dice to the carrier.
摘要翻译：本发明提供了一种将打印头集成电路连接到载体的方法。该方法包括扫描具有其上形成的多个电路管芯的晶片以划定相应的管芯，根据晶片衬底映射方案将芯片拾取器与晶片上的晶片对准，并且使用晶片选择器从晶片去除晶片。该方法还包括以下步骤：将骰子运送到可操作地定位载体的放置台，将骰子与载体对准; 并将骰子热粘合到载体上。

36. 发明申请

US20080206220A1 2031 Oxidoreductase 审中-公开
标题翻译： 2031氧化还原酶
公开(公告)号：US20080206220A1
公开(公告)日：2008-08-28
申请号：US10590171
申请日：2005-02-18
申请人： Sandra Elizabeth Lavens , Jason David Oliver , John Leslie Thain , Daniel Scott Tuckwell , Michael John Bromley
发明人： Sandra Elizabeth Lavens , Jason David Oliver , John Leslie Thain , Daniel Scott Tuckwell , Michael John Bromley
IPC分类号： A61K38/44 , C12Q1/68 , C12Q1/26 , C12N9/02 , C07H21/00 , A61K31/7088 , C12N15/00 , C12N5/00 , C07K16/00 , C12N1/15
CPC分类号： C12Q1/26 , C12Q1/18 , G01N2333/37 , G01N2333/90209 , G01N2500/02
摘要： Method of identifying an anti-fungal agent which targets an essential protein or gene of a fungus comprising contacting a candidate substance with (i) a NADH:flavin oxidoreductase protein which comprises the sequence shown by SEQ ID NO:3, (ii) a NADH:flavin oxidoreductase protein which is a homologue of (i) and which comprises the sequence shown by SEQ ID NO: 8, 12, 14, 19, 24, 42, 44, 83 or 85, (iii) a protein which has 50% identity with (i) or (ii), (iv) a protein comprising a fragment of (i), (ii) or (iii) which fragment has a length of at least 50 amino acids, (v) a polynucleotide that comprises sequence which encodes (i), (ii), (iii) or (iv), (vi) a polynucleotide comprising sequence which has at least 70% identity with the coding sequence of (v), and determining whether the candidate substance binds or modulates (i), (ii), (iii), (iv), (v) or (vi), wherein binding or modulation of (i), (ii), (iii), (iv), (v) or (vi) indicates that the candidate substance is an anti-fungal agent.
摘要翻译：鉴定靶向真菌的必需蛋白质或基因的抗真菌剂的方法，包括使候选物质与（i）包含SEQ ID NO：3所示序列的NADH：黄素氧化还原酶蛋白质接触，（ii）NADH ：（i）的同系物的黄素氧化还原酶蛋白，其包含SEQ ID NO：8,12,14,19,24,42,44,83或85所示的序列，（iii）具有50％与（i）或（ii）的同一性，（iv）包含（i），（ii）或（iii）的片段的蛋白质，该片段长度为至少50个氨基酸，（v）包含序列其编码（i），（ii），（iii）或（iv），（vi）包含与（v）的编码序列具有至少70％同一性的序列的多核苷酸，并确定候选物质是否结合或调节（i），（ii），（iii），（iv），（v）或（vi）中的（i），（ii），（iii） vi）表示候选物质是抗真菌剂。

37. 发明授权

US07163005B2 Cooler bypass valve system and method 有权
标题翻译：冷却器旁通阀系统及方法
公开(公告)号：US07163005B2
公开(公告)日：2007-01-16
申请号：US11235166
申请日：2005-09-27
申请人： Brian Lee Tussing , David Oliver Britner , Stephen Mark Geyer
发明人： Brian Lee Tussing , David Oliver Britner , Stephen Mark Geyer
IPC分类号： F02M25/07 , F02B47/08 , F02B33/34
CPC分类号： F02B33/44 , F02D41/0065 , F02D2200/0414 , F02M26/05 , F02M26/10 , F02M26/25 , F02M26/26 , F02M26/47 , F02M26/70 , F02M26/71
摘要： In preferred embodiments, to, e.g., eliminate condensation build-up in the intake manifold and power cylinders, a charge-air cooler (CAC) and/or EGR cooler “bypass” system is provided that can, e.g., control the intake manifold temperature (IMT) above the dew-point temperature of the boosted air. Preferably, a two-port, single valve-body type valve is provided that proportionally controls the amount of charge-air that is “bypassed” (e.g., not cooled), while simultaneously diverting the charge-air cooler return, preferably, inversely proportionally.
摘要翻译：在优选实施例中，为了例如消除进气歧管和动力缸中的冷凝积聚，提供了一种可以例如控制进气歧管温度的增压 - 空气冷却器（CAC）和/或EGR冷却器“旁通”系统（IMT）高于增压空气的露点温度。优选地，提供了两端口单阀阀型阀，其成比例地控制“旁路”（例如，未冷却）的增压空气的量，同时将加压 - 空气冷却器返回，优选地成反比地。

38. 发明授权

US07007680B2 Cooler bypass valve system and method 有权
标题翻译：冷却器旁通阀系统及方法
公开(公告)号：US07007680B2
公开(公告)日：2006-03-07
申请号：US10635500
申请日：2003-08-07
申请人： Brian Lee Tussing , David Oliver Britner , Stephen Mark Geyer
发明人： Brian Lee Tussing , David Oliver Britner , Stephen Mark Geyer
IPC分类号： F02M25/07 , F02B33/34
CPC分类号： F02B33/44 , F02D41/0065 , F02D2200/0414 , F02M26/05 , F02M26/10 , F02M26/25 , F02M26/26 , F02M26/47 , F02M26/70 , F02M26/71
摘要： In preferred embodiments, to, e.g., eliminate condensation build-up in the intake manifold and power cylinders, a charge-air cooler (CAC) and/or EGR cooler “bypass” system is provided that can, e.g., control the intake manifold temperature (IMT) above the dew-point temperature of the boosted air. Preferably, a two-port, single valve-body type valve is provided that proportionally controls the amount of charge-air that is “bypassed” (e.g., not cooled), while simultaneously diverting the charge-air cooler return, preferably, inversely proportionally.
摘要翻译：在优选实施例中，为了例如消除进气歧管和动力缸中的冷凝积聚，提供了一种可以例如控制进气歧管温度的增压 - 空气冷却器（CAC）和/或EGR冷却器“旁通”系统（IMT）高于增压空气的露点温度。优选地，提供了两端口单阀阀型阀，其成比例地控制“旁路”（例如，未冷却）的增压空气的量，同时将加压 - 空气冷却器返回，优选地成反比地。

39. 发明申请

US20180303237A1 Framed full access cabinet 审中-公开
公开(公告)号：US20180303237A1
公开(公告)日：2018-10-25
申请号：US15956156
申请日：2018-04-18
申请人： David Oliver Boone
发明人： David Oliver Boone
IPC分类号： A47B88/95 , A47B88/90 , A47B57/58 , A47B88/43
CPC分类号： A47B88/95 , A47B47/042 , A47B57/585 , A47B88/43 , A47B88/941 , A47B2088/4235 , A47B2230/0033 , F16B12/22 , F16B12/24 , F16B12/46
摘要： A full access frame can be designed with a thin frame with stiles that are about half the width of conventional stiles, such that inner sides of the stiles and rails include hidden/blind connection points to facilitate hidden or blind mounting of the full access frame to cabinet sides with mounted dowel connectors that attach to the hidden/blind connection points. A framed full access cabinet includes a full access frame mounted on front of a cabinet box, such that drawer rails and door hinges can be mounted on inner cabinet sides of the cabinet box. The dowel connectors and the hidden/blind connection points can be respectively slide-in dowels and slide-in inserts or alternatively snap-in dowels and snap-in inserts.

40. 发明授权

US08909707B2 Method of virally expanding social networks 有权
标题翻译：病毒扩展社交网络的方法
公开(公告)号：US08909707B2
公开(公告)日：2014-12-09
申请号：US13430536
申请日：2012-03-26
申请人： David Oliver Sacks , Adam Marc Pisoni
发明人： David Oliver Sacks , Adam Marc Pisoni
IPC分类号： G06F15/16 , G06Q10/10 , G06Q50/00
CPC分类号： H04L67/22 , G06Q10/10 , G06Q50/01 , H04L51/32
摘要： Membership in a social network is virally expanded by suggesting to a user to invite contacts from the user's address book and, in addition, eligible contacts from other address books. Eligible contacts from other address books include those contacts that have e-mail addresses with the same e-mail domain as the user's e-mail address.
摘要翻译：通过建议用户邀请来自用户的通讯录的联系人以及来自其他通讯录的合格联系人，可以病毒地扩展社交网络中的会员资格。来自其他通讯录的合格联系人包括具有与用户电子邮件地址相同的电子邮件域的电子邮件地址的联系人。

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