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31. 发明授权

US4595572A Recovering gold and silver from an aqueous solution containing cyanic compounds of gold and silver 失效
标题翻译：从含有金和银的氰化合物的水溶液中回收金和银
公开(公告)号：US4595572A
公开(公告)日：1986-06-17
申请号：US675463
申请日：1984-11-28
申请人： Tadayoshi Ogasa , Fumio Kondo
发明人： Tadayoshi Ogasa , Fumio Kondo
IPC分类号： C22B11/00 , C01G5/00 , C01G7/00 , C22B11/08
CPC分类号： C22B11/08 , C01G5/003 , C01G7/003 , C22B3/24 , C22B3/42 , Y02P10/234
摘要： A method of recovering gold and silver efficiently and almost completely from an aqueous solution containing cyanic compounds of gold and silver and which comprises adjusting the pH of the aqueous solution containing cyanic compounds of gold and silver to 6.0 or less, preferably to pH 3.0-5.0, by adding mineral acid, such as sulfuric acid or hydrochloric acid, preferably together with a small amount of active carbon, and subsequently passing the aqueous solution through an active carbon bed, preferably pretreated with mineral acid.
摘要翻译：从含有金和银的氰化合物的水溶液中有效并几乎完全地回收金和银的方法，其包括将含有金和银的氰化合物的水溶液的pH调节至6.0或更低，优选至3.0-5.0 通过添加无机酸如硫酸或盐酸，优选与少量活性炭一起加入，然后将水溶液通过活性炭床，优选用无机酸预处理。

32. 发明授权

US4581096A Tape applying device 失效
标题翻译：胶带装置
公开(公告)号：US4581096A
公开(公告)日：1986-04-08
申请号：US638705
申请日：1984-08-08
申请人： Fumio Sato
发明人： Fumio Sato
IPC分类号： H01L23/50 , H01L21/00 , H01L21/60 , B32B31/18
CPC分类号： H01L21/67132 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , Y10T156/107 , Y10T156/108 , Y10T156/1304 , Y10T156/1322 , Y10T156/1326 , Y10T156/1339
摘要： A tape applying device for punching an annular piece out of an adhesive tape and applying the annular piece of adhesive tape to the inner leads of a lead frame having leads which extend outwardly therefrom in four general directions includes an inner pattern punch disposed along the direction of the travel of the adhesive tape on one surface side thereof and an outer pattern punch disposed along the direction of the travel of the adhesive tape on the same side as the inner punch on the downstream side relative to the inner punch. The outer pattern punch is provided with a press mechanism for applying under pressure the annularly shaped piece of the adhesive tape to the inner leads of the lead frame.
摘要翻译：一种胶带施加装置，用于从胶粘带上冲压环形件，并将环形胶带粘贴到具有从四个一般方向向外从其延伸的引线的引线框架的内部引线上，包括沿着粘合带在其一个表面侧的移动，以及沿着相对于内冲头在下游侧的与内冲头相同的侧面上的粘合带的行进方向设置的外图案冲头。外部图案冲头设置有压力机构，用于在压力下将环形的粘合带片施加到引线框架的内引线。

33. 发明授权

US4357261A Method for manufacture of a composite copper-arsenic compound mixture 失效
标题翻译：复合铜砷化合物混合物的制造方法
公开(公告)号：US4357261A
公开(公告)日：1982-11-02
申请号：US166860
申请日：1980-07-08
申请人： Nobuo Takahashi , Hirao Toda
发明人： Nobuo Takahashi , Hirao Toda
IPC分类号： A01N59/22 , B27K3/02 , B27K3/32 , C01G28/00 , C22B7/00 , C22B15/00 , C22B30/04 , C09K3/00
CPC分类号： C22B15/0086 , C22B15/0089 , C22B30/04 , C22B7/007 , Y02P10/234 , Y02P10/236
摘要： From a refinery's intermediate byproduct composed of a sulfide, oxide or arsenide containing copper and arsenic, a liquid extract containing copper and arsenic at a concentration ratio of not less than 1.0 is obtained. The liquid extract is cooled to a predetermined temperature to achieve solid-liquid phase separation, and the liquid resulting from the phase separation is neutralized to pH 6-7 to isolate copper and arsenic in the form of a composite precipitate. The composite copper-arsenic compound mixture thus obtained has a high purity and low production cost and can be converted through a simple treatment into an effective antiseptic for wood.
摘要翻译：从由含有铜和砷的硫化物，氧化物或砷化物构成的炼油厂的中间副产物中，得到浓度比不小于1.0的含有铜和砷的液体提取物。将液体提取物冷却至预定温度以实现固液相分离，将相分离产生的液体中和至pH6-7，以分离复合沉淀形式的铜和砷。由此获得的复合铜砷化合物混合物具有高纯度和低生产成本，并且可以通过简单的处理转化成有效的木材防腐剂。

34. 发明授权

US5885535A Process for extracting and recovering silver 失效
标题翻译：提取和回收银的方法
公开(公告)号：US5885535A
公开(公告)日：1999-03-23
申请号：US8492
申请日：1998-01-16
申请人： Satoshi Asano , Kaoru Terao
发明人： Satoshi Asano , Kaoru Terao
IPC分类号： C22B3/16 , C22B3/38 , C22B11/00
CPC分类号： C22B3/007 , C22B11/04 , Y02P10/234
摘要： A process for extracting and separating silver safely and selectively from a raw material containing slightly soluble silver compounds and recovering silver from the extract in a simple manner without resorting to electrolysis or a special reducing agent, and further recovering high-purity silver, includes mixing the raw material with an organic solvent solution of an organophosphorus compound containing in the molecule sulfur in the form of S.sup.2- ions, thereby extracting silver into an organic phase simultaneously with dissolving the slightly soluble silver compounds, stripping the silver from the organic phase containing the extracted silver with an aqueous solution of alkali sulfite and forming a stripping solution, and reducing the stripping solution to separate silver therefrom.
摘要翻译：包括从含有微溶银的原料中提取和分离银的方法，并且简单地从提取物中回收银而不使用电解或特殊的还原剂，并进一步回收高纯度银的方法包括将原料与分子中含有S2-离子形式的硫的有机磷化合物的有机溶剂溶液，从而将银溶解到有机相中同时溶解微溶的银化合物，从含有萃取物的有机相中汽提银银与碱性亚硫酸盐的水溶液形成剥离溶液，并且还原剥离溶液以从其中分离银。

35. 发明授权

US5660708A Process for manufacturing a lead frame 失效
标题翻译：制造引线框架的工艺
公开(公告)号：US5660708A
公开(公告)日：1997-08-26
申请号：US561329
申请日：1995-11-21
申请人： Yoshimaro Tezuka , Katsuhisa Tokunaga , Mitsuyuki Kakimoto , Shigeki Ogawa , Miyuki Tani , Satoshi Kobayashi , Kiyotaka Sasaki , Motoyuki Tomizawa
发明人： Yoshimaro Tezuka , Katsuhisa Tokunaga , Mitsuyuki Kakimoto , Shigeki Ogawa , Miyuki Tani , Satoshi Kobayashi , Kiyotaka Sasaki , Motoyuki Tomizawa
IPC分类号： C25D5/34 , C25F3/16 , C25F7/00 , H01L21/48 , H01L23/495 , B05D3/00
CPC分类号： C25F7/00 , C25D5/34 , C25F3/16 , H01L21/4821 , H01L23/49582 , H01L2924/0002
摘要： It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolytic polishing of the blank to be continued for a long time by employing a contactless electrolytic polishing apparatus, and can form an electrolytically polished surface which is sufficiently smooth to allow it to be plated with a very good metal coating.The contactless electrolytic polishing apparatus is employed for applying a direct current with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in an electrolytic polishing tank filled with an electrolytic polishing solution, so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode, and the blank is, then, plated with a metal by employing a customary method.
摘要翻译：本发明的一个目的是提供一种用于通过用电解抛光引线框架的坯料并用金属电镀该电解抛光表面来制造引线框架的方法，该方法能够使坯料的电解抛光继续通过使用非接触式电解抛光装置长时间地形成电解抛光表面，该表面足够光滑以使其能够镀有非常好的金属涂层。非接触电解抛光装置用于在填充有电解抛光溶液的电解抛光槽中向阳极和阴极交替施加具有40至120Hz频率的波纹的直流电流，使得坯料位于两个电极用作阳极可能比其用作阴极的电极的时间长至少3.3倍，然后通过采用常规方法将电镀金属。

36. 发明授权

US5604378A Semiconductor device, its lead frame, and heat spreader having through holes 失效
标题翻译：半导体器件，其引线框架和具有通孔的散热器
公开(公告)号：US5604378A
公开(公告)日：1997-02-18
申请号：US224543
申请日：1994-04-07
申请人： Tadashi Kimura , Takaya Yusa
发明人： Tadashi Kimura , Takaya Yusa
IPC分类号： H01L23/28 , H01L23/433 , H01L23/50 , H01L23/10 , H01L23/34
CPC分类号： H01L23/4334 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/181
摘要： In a lead frame for a semiconductor device which includes a multiplicity of leads, and a heat spreader having an edge to which the leads are bonded by an insulating material coated with an adhesive, and a central portion to which a semiconductor chip is bonded, the heat spreader has a ring-shaped portion defined between its central portion and the inner ends of the leads, and having a width of at least 0.5 mm. The ring-shaped portion has a plurality of through holes occupying not more than 60% by area of that portion, and each of those holes has a width of at least 0.5 mm.
摘要翻译：在包括多个引线的半导体器件的引线框架中，以及具有通过涂覆有粘合剂的绝缘材料将引线接合到其上的边缘的散热器以及与半导体芯片接合的中心部分，散热器具有限定在其中心部分和引线的内端之间的环形部分，并且具有至少0.5mm的宽度。环形部分具有多个通孔占该面积不超过60％的面积，并且每个孔的宽度至少为0.5mm。

37. 发明授权

US5212405A Composite lead frame 失效
标题翻译：复合引线框架
公开(公告)号：US5212405A
公开(公告)日：1993-05-18
申请号：US818089
申请日：1992-01-08
申请人： Kinya Oigawa
发明人： Kinya Oigawa
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49527 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/85444 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/1517
摘要： A composite lead frame in which an island formed with a greater diameter than that of a semiconductor device to be mounted is attached to a lead frame main body having leads being integrally protruded inward, the top ends of the leads are bonded with corresponding fine leads of the island at one ends thereof and lead terminals of the semiconductor device are connected respectively to the other ends of the corresponding fine leads, wherein the composite lead frame comprises an insulating sheet appended on one surface of the island and having the fine leads secured thereto being protruded outward and through holes disposed discretely passing through the insulating sheet and the island so that the wire bonding portions at the other ends of the fine leads are exposed.
摘要翻译：一种复合引线框架，其中形成有比要安装的半导体器件更大的直径的岛被附接到具有一体地向内突出的引线的引线框主体，引线的顶端与相应的细导线其一端的岛和半导体器件的引线端子分别连接到相应的细导线的另一端，其中复合引线框架包括附着在岛的一个表面上并具有固定到其上的细导线的绝缘片向外突出并且穿过离散地穿过绝缘片和岛的通孔，使得细线的另一端的引线接合部分露出。

38. 发明授权

US5044073A Process for producing printed-circuit board 失效
标题翻译：印刷电路板生产工艺
公开(公告)号：US5044073A
公开(公告)日：1991-09-03
申请号：US624539
申请日：1990-12-10
申请人： Shuichi Ogasawara , Kazuo Kawanishi
发明人： Shuichi Ogasawara , Kazuo Kawanishi
IPC分类号： H05K3/06 , H05K3/10 , H05K3/18 , H05K3/26
CPC分类号： H05K3/26 , H05K2201/0761 , H05K2203/0783 , H05K2203/0793 , H05K3/108 , H05K3/184
摘要： Disclosed herein is a process which makes it possible to greatly improve the insulation resistance between conductors on a printed-circuit board having a layer formed by electroless copper plating, and hence it provides a printed circuit board with extremely high reliability. According to the process, a printed-circuit board is formed by forming a metal coating film on a resin board by electroless plating after activation, etching the metal coating film, thereby forming printed conductors, and etching at least the exposed surface of the resin board which is not covered by the printed conductors.
摘要翻译：这里公开了一种能够大大提高具有通过化学镀铜形成的层的印刷电路板上的导体之间的绝缘电阻的方法，因此提供了具有极高可靠性的印刷电路板。根据该方法，通过在激活后通过无电解电镀在树脂板上形成金属涂膜形成印刷电路板，蚀刻金属涂膜，从而形成印刷导体，并至少蚀刻树脂板的露出表面其不被印刷导体覆盖。

39. 发明授权

US5030677A Composition for injection moulding 失效
标题翻译：注塑成分
公开(公告)号：US5030677A
公开(公告)日：1991-07-09
申请号：US423232
申请日：1989-10-18
申请人： Masakazu Achikita , Akihito Ohtsuka
发明人： Masakazu Achikita , Akihito Ohtsuka
IPC分类号： B22F3/02 , C08K3/08 , C08K5/55 , C08L23/06 , C08L91/08
CPC分类号： C08L91/08 , C08K3/08 , C08K5/55 , C08L23/06 , C08L91/06
摘要： Disclosed is a composition for injection moulding which is composed of a sinterable powder comprising at least one metal or alloy and a binder. The binder contains from 10 to 80% by weight of a low-density polyethylene from 10 to 80% by weight of a paraffin wax and from 5 to 35% by weight of a boric acid ester. The ratio of the sinterable powder to the binder in the composition is from 30 to 70% by volume of the former and from 70 to 30% by volume of the latter. The binder can be removed from the green body to be prepared by injection-moulding the composition unexpectedly rapidly without interfering with the properties of the final product sintered.
摘要翻译：公开了一种注射成型用组合物，其由包括至少一种金属或合金和粘合剂的可烧结粉末组成。粘合剂含有10至80重量％的10至80重量％的石蜡和5至35重量％的硼酸酯的低密度聚乙烯。组合物中可烧结粉末与粘合剂的比例为前者的30〜70体积％，后者的70〜30体积％。粘合剂可以从生坯体中除去，以通过在不干扰最终产品烧结的性能的情况下快速注塑成型组合物来制备。

40. 发明授权

US5006199A Process for preparing single crystal of potassium titanium arsenate 失效
标题翻译：制备砷酸钛钾单晶的方法
公开(公告)号：US5006199A
公开(公告)日：1991-04-09
申请号：US541538
申请日：1990-06-21
申请人： Toshiki Kishimoto , Kuniyasu Imamura
发明人： Toshiki Kishimoto , Kuniyasu Imamura
IPC分类号： C30B9/12 , C30B9/00 , C30B29/22
CPC分类号： C30B9/00 , C30B29/10
摘要： Disclosed is a process for preparing a single crystal of potassium titanium arsenate by flux growth method, wherein a compound of K.sub.2 ZO.sub.4, in which Z is at least one of W, S, Mo and Cr, is used as a flux and the flux is blended with potassium titanium arsenate in such a way that the proportion of potassium titanium arsenate is from 15 to 50 mol % of the whole. The process may be carried out by conventional flux growth method under an atmospheric pressure and gives a single crystal of potassium titanium arsenate at a low cost.

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