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21. 发明授权

US06700075B2 Reduced crosstalk ultrasonic piezo film array on a printed circuit board 失效
标题翻译：在印刷电路板上减少串扰超声波压电薄膜阵列
公开(公告)号：US06700075B2
公开(公告)日：2004-03-02
申请号：US09757095
申请日：2001-01-10
申请人： James H. Gordon
发明人： James H. Gordon
IPC分类号： H05K706
CPC分类号： B06B1/0629 , B06B1/0692 , G10K11/34 , H05K1/0218 , Y10S439/941
摘要： A reduced noise ultrasound piezo film array on a printed circuit board. A printed circuit board carries a piezo array on one end and a standard coupling at the other end. The board is made in four layers with the two external layers being ground planes to prevent noise pickup. The two internal layers carry printed circuit lines between various elements of the array and terminals of the connector. The various arrays are sequentially scanned. All of the lines except the one selected are connected to ground to prevent crosstalk and noise pickup.
摘要翻译：印刷电路板上的降噪噪声超声波压电膜阵列。印刷电路板在一端承载压电阵列，另一端承载标准耦合。该板由四层制成，两层是接地层，以防止噪声拾取。两个内部层在阵列的各种元件和连接器的端子之间承载印刷电路线。依次扫描各种阵列。所选择的所有线路都连接到地，以防止串扰和噪声拾取。

22. 发明授权

US06678169B2 Printed circuit board and electronic equipment using the board 失效
标题翻译：印刷电路板和使用电路板的电子设备
公开(公告)号：US06678169B2
公开(公告)日：2004-01-13
申请号：US10254851
申请日：2002-09-26
申请人： Ryoji Ninomiya
发明人： Ryoji Ninomiya
IPC分类号： H05K706
CPC分类号： H05K1/0246 , H05K1/0231 , H05K1/024 , H05K1/025 , H05K1/0253 , H05K1/0269 , H05K1/112 , H05K1/162 , H05K3/28 , H05K2201/0187 , H05K2201/0195 , H05K2201/093 , H05K2201/09309 , H05K2201/09336 , H05K2201/09663 , H05K2201/09672 , H05K2201/0969 , H05K2201/09909 , H05K2201/09936 , H05K2201/10022 , H05K2201/10636 , H05K2203/161 , Y02P70/611
摘要： An insulation layer is formed on a ground layer. The insulation layer includes first and second regions for forming wiring layers. The impedance of a wiring layer formed on the second region is lower than that of a wiring layer formed on the first region. A signal line pattern is formed on the wiring layer on the first region of the insulation layer. A power supply plane is formed on the wiring layer on the second region of the insulation layer in order to feed power to the signal line pattern through a termination resistor connected to the signal line pattern.
摘要翻译：在接地层上形成绝缘层。绝缘层包括用于形成布线层的第一和第二区域。形成在第二区域上的布线层的阻抗低于形成在第一区域上的布线层的阻抗。在绝缘层的第一区域上的布线层上形成信号线图形。在绝缘层的第二区域上的布线层上形成电源平面，以便通过连接到信号线图形的终端电阻向信号线图案供电。

23. 发明授权

US06627824B1 Support circuit with a tapered through-hole for a semiconductor chip assembly 失效
标题翻译：具有用于半导体芯片组件的锥形通孔的支撑电路
公开(公告)号：US06627824B1
公开(公告)日：2003-09-30
申请号：US10002732
申请日：2001-11-15
申请人： Charles W. C. Lin
发明人： Charles W. C. Lin
IPC分类号： H05K706
CPC分类号： H01L21/4857 , H01L21/4853 , H01L23/49861 , H01L2924/00013 , H01L2924/0002 , H01L2924/09701 , Y10S205/92 , Y10T29/49128 , Y10T29/49156 , H01L2224/29099 , H01L2924/00
摘要： A support circuit is adapted to be mechanically and electrically coupled to a semiconductor chip such that the support circuit and the chip in combination form a semiconductor chip assembly. The support circuit includes an insulative base and a conductive trace embedded in the insulative base. The conductive trace is a single continuous piece of metal, the conductive trace includes a pillar that extends above the insulative base and a routing line that is substantially covered by and extends below the insulative base, and an opening in the routing line has tapered sidewalls and a diameter that increases as height increases.
摘要翻译：支撑电路适于机械地和电耦合到半导体芯片，使得支撑电路和芯片组合形成半导体芯片组件。支撑电路包括绝缘基底和嵌入绝缘基底中的导电迹线。导电迹线是单个连续的金属片，导电迹线包括在绝缘基底上方延伸的支柱和基本上被绝缘基底覆盖并延伸到绝缘基底之下的布线线，并且布线线中的开口具有锥形侧壁和直径随着高度的增加而增加。

24. 发明授权

US06625038B2 Functional asymmetrical circuit substrate assembly including a mirror-symmetrical component layout 失效
公开(公告)号：US06625038B2
公开(公告)日：2003-09-23
申请号：US09917430
申请日：2001-07-27
申请人： Dirk Raschke
发明人： Dirk Raschke
IPC分类号： H05K706
CPC分类号： B60N2/0228 , H01H11/0031 , H05K1/116 , H05K1/18 , H05K3/202 , H05K2201/10189 , H05K2201/10325 , H05K2203/168
摘要： The invention relates to a circuit substrate assembly comprising a left-hand (1) and a right-hand (1′) circuit substrate mirror-symmetrical thereto, each including electrical and/or electronic and/or electromechanical components (2-6 or 2′-6′) and circuitry (7 or 7′) electrical connecting said components. All components (2-6) are positioned symmetrically mirrored on the left-hand (1) and right-hand (1′) circuit substrate respectively when the left-hand (1) and right-hand (1′) circuit substrate is oriented mirror-symmetrical along a mirror plane (P). However, the circuit functional plug assignments (A-F) of at least one circuit functional mirror-invariant component 2 or 2′) on the left-hand (1) and on the right-hand (1′) circuit substrate are not mirror-symmetrical to each other. This assembly is suitable for use in applications in which a mirror-symmetrical assembly of the circuit substrates (2, 2′) in a three-dimensional geometry is desired, without requiring the components on the right-hand circuit substrate to be mirror-symmetrical to the components on the left-hand circuit substrate.

25. 发明授权

US06603667B2 Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic 失效
公开(公告)号：US06603667B2
公开(公告)日：2003-08-05
申请号：US09870416
申请日：2001-05-29
申请人： Akiyuki Yoshisato , Kazuhiko Ueda , Akihiko Inoue , Hiroshi Sakuma
发明人： Akiyuki Yoshisato , Kazuhiko Ueda , Akihiko Inoue , Hiroshi Sakuma
IPC分类号： H05K706
CPC分类号： H05K3/403 , H01L23/66 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15313 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0306 , H05K1/092 , H05K3/246 , H05K2201/0317 , H05K2201/0347 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099
摘要： The invention provides an electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic. Capacitors and a wiring pattern are formed on an alumina substrate by means of thin film forming technique, and a part of the wiring pattern is served as the connection land for mounting a bare chip of a transistor. Among the capacitors, the top electrode of the capacitor is served also as a part of the connection land, and the bottom side collector electrode of the bare chip is connected to the connection land by use of conductive adhesive. Top electrodes of the residual capacitors are served as the bonding pad, and the base electrode and the emitter electrode on the top side of the bare chip are connected to the top electrodes of the respective capacitors by a wire.

26. 发明授权

US06534725B2 High-frequency circuit board and semiconductor device using the high-frequency circuit board 有权
标题翻译：高频电路板和半导体器件采用高频电路板
公开(公告)号：US06534725B2
公开(公告)日：2003-03-18
申请号：US09873191
申请日：2001-06-05
申请人： Yoshihiro Tsukahara
发明人： Yoshihiro Tsukahara
IPC分类号： H05K706
CPC分类号： H01P1/15 , H01L23/66 , H01L24/81 , H01L2223/6627 , H01L2224/16 , H01L2224/81801 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12034 , H01L2924/14 , H01L2924/1903 , H01L2924/3011 , H01L2924/00
摘要： A high-frequency switch includes: a high-frequency circuit board including an MIC substrate, a microstrip line disposed on a front surface of the MIC substrate, and a signal wiring layer and a front surface grounding conductor disposed along the microstrip line; bumps disposed on the microstrip line, the signal wiring layer, and the front surface grounding conductor; and a semiconductor chip disposed on the high-frequency circuit board through the bumps. A gate electrode of a transistor of the semiconductor chip is connected to the signal wiring layer of the high-frequency circuit board through at least one of the bumps; a source electrode is connected to the front surface grounding conductor through at least one of the bumps; and a drain electrode is connected to the microstrip line through at least one of the bumps.
摘要翻译：一种高频开关包括：高频电路板，包括MIC基板，设置在MIC基板的前表面上的微带线，以及沿着微带线设置的信号布线层和前表面接地导体; 布置在微带线上的凸起，信号布线层和前表面接地导体; 以及通过凸块设置在高频电路板上的半导体芯片。半导体芯片的晶体管的栅电极通过至少一个凸块连接到高频电路板的信号布线层; 源电极通过至少一个凸块连接到前表面接地导体; 并且漏极通过至少一个凸块连接到微带线。

27. 发明授权

US06501664B1 Decoupling structure and method for printed circuit board component 失效
标题翻译：印刷电路板组件的去耦结构和方法
公开(公告)号：US06501664B1
公开(公告)日：2002-12-31
申请号：US09608183
申请日：2000-06-30
申请人： Jeffrey L. Krieger
发明人： Jeffrey L. Krieger
IPC分类号： H05K706
CPC分类号： H05K1/114 , H05K1/0231 , H05K3/429 , H05K2201/10522 , H05K2201/10734 , Y10T29/49144
摘要： A wiring lay-out is provided, for electrically connecting a decoupling cap on a front surface of a multilayer printed circuit board (e.g., a motherboard), with a surface-mounted electrical component (e.g., a micro-ball grid array packaged semiconductor device, such as a PC core logic chip set) on the front surface of the printed circuit board. The wiring lay-out includes a wiring portion formed from a copper plane on the front surface of the printed circuit board; this wiring portion, providing electrical connection from one of the balls of the ball grid array to the decoupling cap, is provided only on the front surface of the printed circuit board. In order to provide a route for the wiring between the electrical component and decoupling cap, vias through the printed circuit board are positioned in a row with bonding pads. All decoupling caps on the printed circuit board are provided on the front surface of the printed circuit board.
摘要翻译：提供布线布置，用于将多层印刷电路板（例如，母板）的前表面上的去耦帽电气连接到表面安装的电气部件（例如，微球格栅阵列封装的半导体器件，例如PC核心逻辑芯片组）在印刷电路板的前表面上。布线布置包括由印刷电路板的前表面上的铜平面形成的布线部分; 提供从球栅阵列中的一个球到解耦盖的电连接的该布线部分仅设置在印刷电路板的前表面上。为了提供电气部件和去耦帽之间的布线的路径，通过印刷电路板的通孔被定位成具有接合焊盘的一排。印刷电路板上的所有去耦盖都设置在印刷电路板的前表面上。

28. 发明授权

US06434009B1 Power distribution module with reversible relay footprint 失效
标题翻译：具有可逆继电器占地面积的配电模块
公开(公告)号：US06434009B1
公开(公告)日：2002-08-13
申请号：US09921676
申请日：2001-08-03
申请人： Raymond C. Culp
发明人： Raymond C. Culp
IPC分类号： H05K706
CPC分类号： B60R16/0238 , H01R9/28
摘要： A power distribution module utilizes a planar substrate having an array of repeating slots configured to accept two types of relays, one having four terminals and the other having five terminals. Both relays can mate with the slots of the substrate in a variety of orientations, including reverse orientations wherein the relay terminal footprint can be rotated 180 degrees and still mate with a corresponding, yet shifted, slot footprint.
摘要翻译：配电模块利用具有配置成接受两种类型的继电器的重复槽阵列的平面基板，一个具有四个端子，另一个具有五个端子。两个继电器可以以各种取向与衬底的槽匹配，包括反向取向，其中继电器端子覆盖区可以旋转180度并且仍然与相应的但是移动的狭缝覆盖区匹配。

29. 发明授权

US06411518B1 High-density mounted device employing an adhesive sheet 失效
标题翻译：采用粘合片的高密度安装装置
公开(公告)号：US06411518B1
公开(公告)日：2002-06-25
申请号：US09634499
申请日：2000-08-08
申请人： Masaaki Okada
发明人： Masaaki Okada
IPC分类号： H05K706
CPC分类号： H05K3/321 , H01L23/3677 , H01L23/49827 , H01L2224/2929 , H01L2224/29347 , H01L2224/29399 , H01L2924/09701 , H05K2201/09581 , H05K2201/10378 , H05K2201/10674 , H01L2924/00014
摘要： A high-density mounted device, in which a plurality of semiconductor devices such as semiconductor element or module boards, are mounted on a wiring board, includes an adhesive sheet which is interposed between the wiring board and the semiconductor device. The adhesive sheet has a sheet-like base board made of an adhesive member and a plurality of conductive Sections provided at predetermined pitches in the sheet-like base member. The conductive sections are electrically insulated from each other, and extend from one side of the sheet-like base member to the other side thereof, and enable electrical connection between the electrode terminals of the wiring board and the electrode terminals of the semiconductor device. The conductive sections work as heat conductive channels between the wiring board and the semiconductor device. Thus, a high-density mounted device is provided which enables sufficient electrical and mechanical connection between a wiring board and a semiconductor device to be mounted thereon and sufficient grounding of the semiconductor device and the wiring board.
摘要翻译：在布线基板上安装有诸如半导体元件或模块基板的多个半导体器件的高密度安装器件包括插入在布线板和半导体器件之间的粘合片。粘合片具有由粘合构件制成的片状基板和在片状基底构件中以预定间距设置的多个导电部。导电部分彼此电绝缘，并且从片状基体的一侧延伸到另一侧，并且能够在布线板的电极端子和半导体器件的电极端子之间进行电连接。导电部分作为布线板和半导体器件之间的导热通道。因此，提供了一种高密度安装器件，其能够在布线板和要安装在其上的半导体器件之间实现足够的电气和机械连接，并且半导体器件和布线板具有足够的接地。

30. 发明授权

US06396706B1 Self-heating circuit board 失效
标题翻译：自热电路板
公开(公告)号：US06396706B1
公开(公告)日：2002-05-28
申请号：US09364684
申请日：1999-07-30
申请人： Paul D. Wohlfarth
发明人： Paul D. Wohlfarth
IPC分类号： H05K706
CPC分类号： H05K1/0212 , H05K1/167 , H05K3/3494 , H05K3/4611 , H05K7/20 , H05K2201/10689 , H05K2203/1115 , H05K2203/165
摘要： Separate heating elements are embedded in a printed circuit board near integrated circuit (IC) packages or other parts mounted on the circuit board. Each heating element supplies heat to the part residing near it in response to an input voltage pulse. The heating elements are used to selectively melt solder or adhesives attaching the parts to the circuit board so that they can be easily removed or to temporarily melt solder or cure adhesive when the parts are mounted on the circuit board. The heating elements are also used to supply heat to IC packages for regulating their operating temperatures.
摘要翻译：单独的加热元件嵌入在集成电路（IC）封装或安装在电路板上的其它部件附近的印刷电路板中。每个加热元件响应于输入电压脉冲向驻留在其附近的部件供热。加热元件用于选择性地熔化将部件附着到电路板上的焊料或粘合剂，使得当部件安装在电路板上时，它们可以容易地移除或临时熔化焊接或固化粘合剂。加热元件也用于向IC封装提供热量以调节其工作温度。

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