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    • 29. 发明申请
    • Treatment for Electroplating Racks to Avoid Rack Metallization
    • 电镀架的处理以避免机架金属化
    • US20160040315A1
    • 2016-02-11
    • US14454131
    • 2014-08-07
    • MacDermid Acumen, Inc.
    • Roderick D. HerdmanTrevor PearsonRoshan V. ChapaneriAlison Hyslop
    • C25D17/08C25D5/34C09D181/00
    • C25D17/08C09D181/00C23C18/1653C23C18/2086C23C18/22C23C18/30C25D5/34
    • A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: wherein R, R′, R″ and R′″ are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or wherein R, R′, R″ and R′″ are either the same or are independently selected from C1-C10 alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.
    • 一种在电镀工艺期间涂覆用于支撑非导电衬底的电镀架的方法。 该方法包括以下步骤:使电镀架的至少一部分与增塑溶胶组合物接触,增塑溶胶组合物中分散有有效量的具有以下结构的添加剂:其中R,R',R“和R” 相同或独立地选自苄基,取代的苄基,苯基或取代的苯基; 或其中R,R',R“和R”“相同或独立地选自C 1 -C 10烷基(直链或支链),苄基,取代的苄基,苯基或取代的苯基,M是二价金属 阳离子,优选选自镍,铜和锌; 并将其上的增塑溶胶组合物的电镀架加热到合适的温度并持续足够的时间固化增塑溶胶并在电镀架上形成固体绝缘涂层。 然后可以将涂覆的电镀机架用于安装非导电衬底以用于随后的金属化步骤。