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21. 发明申请

US20090174985A1 Ceramic capacitor assembly 审中-公开
标题翻译：陶瓷电容器组件
公开(公告)号：US20090174985A1
公开(公告)日：2009-07-09
申请号：US12006554
申请日：2008-01-03
申请人： Yu-Cheng Fang
发明人： Yu-Cheng Fang
IPC分类号： H01G4/12
CPC分类号： H01G4/228 , H01G2/06 , H01G4/002 , H05K3/301 , H05K2201/0133 , H05K2201/10424 , H05K2201/10606 , H05K2201/10651
摘要： A ceramic capacitor assembly has a ceramic capacitor and a cushion. The ceramic capacitor has a body, two terminals formed respectively on the body and two legs connecting to and protruding respectively from the terminals. The cushion is a resilient material and has an upper surface corresponding to and mounted adjacent to the ceramic capacitor, a lower surface, an outer edge and two fastening detents. The detents correspond to the legs and are provided for legs to fasten to the cushion. The ceramic capacitor and the cushion are easily assembled and reduce cost and complexity of manufacture.
摘要翻译：陶瓷电容器组件具有陶瓷电容器和衬垫。陶瓷电容器具有主体，两个端子分别形成在主体上，两个端子分别连接并分别从端子突出。该衬垫是弹性材料，并且具有与陶瓷电容器相邻并安装的上表面，下表面，外缘和两个紧固棘爪。棘爪对应于腿部，并且被设置用于腿以紧固到衬垫。陶瓷电容器和缓冲垫容易组装，降低了制造成本和复杂性。

22. 发明申请

US20090071698A1 CIRCUIT BOARD 审中-公开
标题翻译：电路板
公开(公告)号：US20090071698A1
公开(公告)日：2009-03-19
申请号：US11863276
申请日：2007-09-28
申请人： CHIH-HANG CHAO , YU-HSU LIN , JENG-DA WU
发明人： CHIH-HANG CHAO , YU-HSU LIN , JENG-DA WU
IPC分类号： H01R12/04
CPC分类号： H05K1/18 , H05K1/0271 , H05K2201/09418 , H05K2201/10015 , H05K2201/10651
摘要： A circuit board includes a capacitor having two pins disposed thereon. A line determined by the two pins of the capacitor is not perpendicular to any of main sides of the circuit board.
摘要翻译：电路板包括一个设置在其上的两个引脚的电容器。由电容器的两个引脚确定的线不垂直于电路板的任何主侧。

23. 发明授权

US07488904B2 Resin molded component fitted with a metal plate and molding method therefor 有权
标题翻译：装有金属板的树脂成型部件及其成型方法
公开(公告)号：US07488904B2
公开(公告)日：2009-02-10
申请号：US11820980
申请日：2007-06-21
申请人： Akihito Maegawa , Shinyu Nagashima
发明人： Akihito Maegawa , Shinyu Nagashima
IPC分类号： H01L23/28
CPC分类号： H05K3/202 , B29C45/14655 , B29C45/1671 , B29C2045/0027 , H05K1/056 , H05K3/326 , H05K2201/0397 , H05K2201/09118 , H05K2201/10151 , H05K2201/10401 , H05K2201/10651
摘要： A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by a pair of forming dies, a distance between the exposed ends (4A) and the placing surface 10A is held constant. Further, gate marks (5D) of the oil temperature sensor (2) are accommodated in recesses (10B) of the placing surface (10) and engaging grooves (9) and engaging projections (26A) are engaged. Thus, the oil temperature sensor (2) can be held in a proper posture. Additionally, the oil temperature sensor (2) can be held on the placing surface (10A) by riveting the exposed end (4A) and a terminal (8) of the oil temperature sensor (2).
摘要翻译：传感器单元（1）具有金属板（10），树脂模制部分（20）和油温传感器（2）。由树脂成型部（20）配置由金属构成的母线（4）。由于母线（4）在将其暴露端（4A）紧紧地保持在一对成形模具上时被插入成型，所以露出端（4A）和放置面10A之间的距离保持恒定。此外，油温传感器（2）的门标（5D）容纳在放置面（10）的凹部（10B）中，并且接合槽（9）和接合突起（26A）接合。因此，可以将油温传感器（2）保持在适当的姿势。此外，油温传感器（2）可以通过铆接暴露的端部（4A）和油温传感器（2）的端子（8）而保持在放置表面（10A）上。

24. 发明申请

US20080280504A1 ELECTRICAL CONNECTION TERMINAL FOR CONNECTION HOLE AND ENGAGEMENT STRUCTURE OF ELECTRONIC COMPONENT INCLUDING THE SAME 有权
标题翻译：用于连接孔的电气连接端子和包括其的电子部件的接合结构
公开(公告)号：US20080280504A1
公开(公告)日：2008-11-13
申请号：US12118125
申请日：2008-05-09
申请人： Shinji TAKAHASHI , Yoshiaki KATO , Harehide SASAKI , Hiroshi KOBAYASHI
发明人： Shinji TAKAHASHI , Yoshiaki KATO , Harehide SASAKI , Hiroshi KOBAYASHI
IPC分类号： H01R13/42
CPC分类号： H05K3/308 , H05K2201/10015 , H05K2201/10651 , H05K2201/10787 , H05K2201/10878
摘要： An electrical connection terminal for a connection hole includes: a base-side end portion (310) having a predetermined width; a retaining portion (313) having an increasing width wider than the predetermined width of the base-side end portion (310), the retaining portion (313) being formed integrally with the base-side end portion (310); and an insertion taper portion (315) having a taper width narrower than the increasing width of the retaining portion (313) to reach a leading end portion, the insertion taper portion (315) being formed integrally with the retaining portion (313); in which the insertion taper portion (315) is composed of a plurality of taper portions taper angles of which change so as to increase along an insertion direction.
摘要翻译：用于连接孔的电连接端子包括：具有预定宽度的底侧端部（310）; 保持部（313）与基底侧端部（310）一体形成，该保持部（313）具有比基部侧端部（310）的规定宽度大的宽度的宽度。以及插入锥形部（315），其具有比所述保持部（313）的增加宽度窄的锥形宽度，以到达前端部，所述插入锥形部（315）与所述保持部（313）一体形成。其中所述插入锥形部分（315）由多个锥形部分组成，所述多个锥形部分锥形角度沿着插入方向变化。

25. 发明申请

US20080122120A1 Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device 有权
标题翻译：电子部件，电子部件的制造方法，电子部件组装体和电子设备
公开(公告)号：US20080122120A1
公开(公告)日：2008-05-29
申请号：US11892139
申请日：2007-08-20
申请人： Masayuki Itoh , Takao Ishikawa , Tomokazu Nakashima
发明人： Masayuki Itoh , Takao Ishikawa , Tomokazu Nakashima
IPC分类号： H01L23/52
CPC分类号： H05K1/182 , H01L33/483 , H01L33/60 , H01L33/62 , H01L2924/0002 , H05K2201/10106 , H05K2201/10651 , H01L2924/00
摘要： An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end connected to a pad formed on the board; wherein the main body part is provided with the leads so that a functional surface of the main body part is positioned at a side connected to the pads of the board.
摘要翻译：电子部件包括插入形成在基板上的开口部的主体部; 以及一对引线，每个所述引线的一端连接到所述主体部分，另一端连接到形成在所述板上的焊盘; 其中主体部分设置有引线，使得主体部分的功能表面位于连接到板的焊盘的一侧。

26. 发明申请

US20070274057A1 ELECTRONIC COMPONENT HOLDER 失效
标题翻译：电子元件支架
公开(公告)号：US20070274057A1
公开(公告)日：2007-11-29
申请号：US11751227
申请日：2007-05-21
申请人： Yasuyuki Fukumoto
发明人： Yasuyuki Fukumoto
IPC分类号： H05K7/04
CPC分类号： H05K7/12 , H05K3/301 , H05K3/3447 , H05K2201/10106 , H05K2201/10462 , H05K2201/10606 , H05K2201/10651 , H05K2201/10757
摘要： An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.
摘要翻译：电子部件保持器包括保持器主体和电线保持部。保持器本体包括形成在保持器主体的顶面中的多个第一槽和形成在保持器主体的后表面中的多个第二槽。第一凹槽和第二凹槽构造成接收电子部件的引线。引线被配置为弯曲以设置在第二槽中的一个中。背面与顶面相交。电线保持部设置在保持体上。电线保持部分构造成接合引线以将导线保持在第二凹槽中。

27. 发明申请

US20070267964A1 A Light Unit with Staggered Electrodes 有权
标题翻译：具有交错电极的灯单元
公开(公告)号：US20070267964A1
公开(公告)日：2007-11-22
申请号：US11459377
申请日：2006-07-24
申请人： Jiahn-Chang WU
发明人： Jiahn-Chang WU
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K3/308 , H05K2201/09309 , H05K2201/10106 , H05K2201/10651 , H05K2203/168 , H01L2924/00014
摘要： A staggered light unit has a top-bottom electrode lead. The light unit is insertable into a substrate having a metal/insulation/metal sandwich structure.
摘要翻译：交错的光单元具有顶部 - 底部电极引线。光单元可插入具有金属/绝缘/金属夹层结构的基板中。

28. 发明申请

US20070254519A1 Pressing mechanism for LED chip 审中-公开
标题翻译： LED芯片按压机构
公开(公告)号：US20070254519A1
公开(公告)日：2007-11-01
申请号：US11413083
申请日：2006-04-28
申请人： Chung Wu , Meng-Cheng Huang , Zu-Chao Hsu
发明人： Chung Wu , Meng-Cheng Huang , Zu-Chao Hsu
IPC分类号： H01R13/62
CPC分类号： H05K3/325 , H05K1/0203 , H05K2201/10393 , H05K2201/10651
摘要： A pressing mechanism presses the LED chip firmly to the base and includes a pressing device. The pressing device includes two parallel metal plates extended integrally from topside of the base and disposed on two sides of the LED chip. The metal plate includes a first pin connected to the base and a second pin extended parallel atop the base. The separation between the pressing plate and the base is slightly larger than the thickness of the LED chip. According to another preferred embodiment of the present invention, the pressing plate is a pressing clip. The pressing clip includes a connection end of substantially L shape and a floating end of substantially U shape. According to still another preferred embodiment of the present invention, the pressing mechanism includes two screws to fix the LED chip to the base on two radial sides of the LED chip.
摘要翻译：按压机构将LED芯片牢固地按压到基座并且包括按压装置。按压装置包括从基座的顶部整体延伸并且设置在LED芯片的两侧上的两个平行的金属板。金属板包括连接到基座的第一销和平行于基座顶部延伸的第二销。按压板和基座之间的间隔略大于LED芯片的厚度。根据本发明的另一个优选实施例，按压板是按压夹。按压夹包括大致L形的连接端和大致U形的浮动端。根据本发明的另一个优选实施例，按压机构包括两个将LED芯片固定在LED芯片的两个径向侧上的基座的螺钉。

29. 发明授权

US07288831B2 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof 有权
标题翻译：用于半导体元件的两极SMT微型外壳及其制造方法
公开(公告)号：US07288831B2
公开(公告)日：2007-10-30
申请号：US11463127
申请日：2006-08-08
申请人： Guenther Waitl , Franz Schellhorn , Herbert Brunner
发明人： Guenther Waitl , Franz Schellhorn , Herbert Brunner
IPC分类号： H01L23/495 , H01L31/0203
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K3/3426 , H05K2201/10454 , H05K2201/10651 , H05K2201/10818 , Y02P70/613 , H01L2924/00014
摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.
摘要翻译：在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。芯片安装表面和部件的安装表面彼此成直角。

30. 发明申请

US20070211443A1 System and method for postponing application of customizing components in a final drive 审中-公开
标题翻译：用于在最终驱动器中推迟应用定制组件的系统和方法
公开(公告)号：US20070211443A1
公开(公告)日：2007-09-13
申请号：US11371838
申请日：2006-03-09
申请人： David Wechter , Richard Lukaszewski , Sharon Renard , Jon Simons , David Danek , Michael Kreiter , Thomas Fuller
发明人： David Wechter , Richard Lukaszewski , Sharon Renard , Jon Simons , David Danek , Michael Kreiter , Thomas Fuller
IPC分类号： H05K7/00
CPC分类号： H05K7/1432 , H05K1/0286 , H05K3/308 , H05K2201/1059 , H05K2201/10651 , H05K2201/10856
摘要： A method and product produced includes a power layer board that is manufactured by providing a printed circuit board having an input configured to receive an input power and an output configured to deliver an output power conditioned to power a motor. The method also includes soldering a first component to the printed circuit board. Thereafter, a request to manufacture the power layer board is received that includes parameters of the input power and/or the output power. Therefrom, characteristics of a second component including a resistor, a capacitor, and/or an inductor is identified based on the parameters of the input power and/or the output power. Accordingly, the identified second component is mounted to the printed circuit board through a solder-less cold-weld connector to complete the power layer board.
摘要翻译：所生产的方法和产品包括功率层板，其通过提供具有被配置为接收输入功率的输入的印刷电路板和被配置为递送调节以为电动机供电的输出功率的输出而制造。该方法还包括将第一组件焊接到印刷电路板。此后，接收到包括输入功率和/或输出功率的参数的制造功率层板的请求。因此，基于输入功率和/或输出功率的参数来识别包括电阻器，电容器和/或电感器的第二部件的特性。因此，所识别的第二部件通过无焊料冷焊接连接器安装到印刷电路板，以完成电源层板。

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