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    • 25. 发明申请
    • COATED CONDUCTIVE POWDER AND CONDUCTIVE ADHESIVE USING THE SAME
    • 涂层导电粉末和导电胶粘剂使用它
    • US20100219382A1
    • 2010-09-02
    • US12738017
    • 2008-10-21
    • Shinji Abe
    • Shinji Abe
    • H01B1/16
    • H05K3/323C08K3/017C08K9/02C09J9/02C09J11/04H01B1/22H01R4/04H05K2201/0209H05K2201/0221H05K2201/0224Y10T428/2991
    • The present invention provides a coated conductive powder in which the aggregation of conductive particles is suppressed and which is also excellent in electrical reliability, and a conductive adhesive using the same that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with insulating inorganic fine particles, wherein the volume resistivity value of the coated conductive powder is 1 Ω·cm or less, the specific gravity of the insulating inorganic fine particles is 5.0 g/ml or less, the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (the insulating inorganic fine particles/the conductive particles) is 1/100 or less, and the insulating inorganic fine particles adhere to the surfaces of the conductive particles.
    • 本发明提供了一种涂覆的导电粉末,其中导电颗粒的聚集被抑制并且电可靠性也优异,并且使用该导电粘合剂可以提供甚至连接小型化的电极的高电气可靠性 电子部件,如IC芯片和电路板。 本发明的涂覆导电粉末是通过用绝缘无机细颗粒涂覆导电颗粒的表面而获得的涂覆导电粉末,其中涂覆的导电粉末的体积电阻率值为1&OHgr·cm以下,比重为 绝缘性无机微粒为5.0g / ml以下,绝缘性无机微粒与导电性粒子(绝缘性无机微粒/导电性粒子)的粒径比为1/100以下,绝缘性无机质 颗粒附着在导电颗粒的表面上。