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    • 29. 发明申请
    • POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE
    • 聚酰胺树脂组合物和模塑制品
    • US20160083564A1
    • 2016-03-24
    • US14785711
    • 2014-04-17
    • MITSUBISHI GAS CHEMICAL COMPANY, INC.
    • Takafumi OdaTomonori KatoMayumi Kikuchi
    • C08K5/5435B29C55/00B29C51/00C08J5/00
    • C08K5/5435B29C51/002B29C55/005B29K2077/00B29K2995/0067C08G69/265C08J5/00C08J2377/06C08L77/06C08L83/04
    • The invention provides a polyamide resin composition (1) containing a polyamide (A) and a free volume modifier (B), and having a free volume, as measured according to a positron annihilation method, of 0.0545 nm3 or less. The invention also provides a polyamide resin composition (2) prepared by adding from 0.005 to 1.200 parts by mass of a polysilsesquioxane (B) whose main chain is comprised of siloxane bonds, to 100 parts by mass of a polyamide (A) that contains a diamine unit including an aromatic diamine unit represented by the following general formula (I) in an amount of 70 mol % or more and a dicarboxylic acid unit including at least one of a linear aliphatic dicarboxylic acid unit represented by the following general formula (II-1) and an aromatic dicarboxylic acid unit represented by the following general formula (II-2) in a total amount of 50 mol % or more: wherein n in the general formula (II-1) indicates an integer of from 2 to 18, and Ar in the general formula (II-2) represents an arylene group.
    • 本发明提供一种含有聚酰胺(A)和自由体积改性剂(B)的聚酰胺树脂组合物(1),其按照正电子湮灭法测定的自由体积为0.0545nm 3以下。 本发明还提供一种聚酰胺树脂组合物(2),其通过将0.005〜1.200质量份的主链由硅氧烷键构成的聚倍半硅氧烷(B)加入到100质量份的含有 二胺单元,其包含由以下通式(I)表示的芳族二胺单元和70摩尔%以上的二羧酸单元和包含以下通式(II-)表示的直链脂肪族二羧酸单元中的至少一种的二羧酸单元, 1)和由以下通式(II-2)表示的芳族二羧酸单元,其总量为50摩尔%以上:其中,通式(II-1)中的n表示2〜18的整数, 通式(II-2)中的Ar表示亚芳基。