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    • 24. 发明申请
    • NONVOLATILE MEMORY BITCELL
    • 非易失性存储器BITCELL
    • US20140209988A1
    • 2014-07-31
    • US13756248
    • 2013-01-31
    • Xin LinHongning YangZhihong ZhangJiang-Kai Zuo
    • Xin LinHongning YangZhihong ZhangJiang-Kai Zuo
    • H01L29/66H01L27/088
    • H01L29/66825H01L27/11558H01L29/7881
    • A multiple time programmable nonvolatile memory device having a single polysilicon memory cell includes a select transistor and a bitcell transistor. The bitcell transistor has asymmetrically configured source, drain, and channel regions including asymmetrically configured source-body and drain-body junctions. Compared with the drain-body junction, the impurity concentration gradient of the source-body junction is more gradual, which may significantly improve program disturb immunity. The bitcell transistor gate may be connected to an electrode of a coupling capacitor, but may be otherwise floating or Ohmically isolated. The floating gate of the bitcell is protected by a dielectric layer for potentially improved data retention.
    • 具有单个多晶硅存储单元的多时间可编程非易失性存储器件包括选择晶体管和位单元晶体管。 位单元晶体管具有不对称配置的源极,漏极和沟道区域,包括不对称配置的源极体和漏极 - 体部结。 与漏 - 体结相比,源 - 体结的杂质浓度梯度更为平缓,可以显着提高程序的干扰免疫力。 位单元晶体管栅极可以连接到耦合电容器的电极,但是可以以浮置或欧姆隔离的方式。 位单元的浮动栅极由介电层保护,以便潜在地改善数据保持。
    • 27. 发明授权
    • Capacitor device using an isolated well and method therefor
    • 使用隔离井的电容器件及其方法
    • US08487398B2
    • 2013-07-16
    • US12835900
    • 2010-07-14
    • Hongzhong XuZhihong ZhangJiang-Kai Zuo
    • Hongzhong XuZhihong ZhangJiang-Kai Zuo
    • H01L21/70
    • H01L29/94H01L29/66181
    • A semiconductor device includes an isolated p-type well, wherein the isolated p-type well is a first electrode of a capacitor device; a capacitor dielectric on the isolated p-type well; a p-type polysilicon electrode over the capacitor dielectric, wherein the p-type polysilicon electrode is a second electrode of the capacitor device; a first p-type contact region in the isolated p-type well, laterally extending from a first sidewall of the p-type polysilicon electrode; a second p-type contact region in the isolated p-type well, laterally extending from a second sidewall of the p-type polysilicon electrode, opposite the first sidewall of the p-type polysilicon electrode, wherein a portion of the isolated p-type well between the first and second p-type contact regions is under the p-type polysilicon electrode and the capacitor dielectric; and an n-type isolation region surrounding the isolated p-type well. This device may be conveniently coupled to a fringe capacitor.
    • 半导体器件包括隔离的p型阱,其中隔离的p型阱是电容器器件的第一电极; 隔离p型阱上的电容器电介质; 电容器电介质上的p型多晶硅电极,其中p型多晶硅电极是电容器器件的第二电极; 分离的p型阱中的第一p型接触区,从p型多晶硅电极的第一侧壁横向延伸; 在隔离的p型阱中的第二p型接触区域,从p型多晶硅电极的第二侧壁横向延伸,与p型多晶硅电极的第一侧壁相对,其中一部分隔离的p型 第一和第二p型接触区之间的阱在p型多晶硅电极和电容器电介质之下; 以及围绕隔离p型阱的n型隔离区。 该装置可以方便地连接到边缘电容器。
    • 29. 发明授权
    • Resurf semiconductor device charge balancing
    • Resurf半导体器件电荷平衡
    • US08389366B2
    • 2013-03-05
    • US12129840
    • 2008-05-30
    • Won Gi MinHongzhong XuZhihong ZhangJiang-Kai Zuo
    • Won Gi MinHongzhong XuZhihong ZhangJiang-Kai Zuo
    • H01L29/772
    • H01L29/7823H01L29/063H01L29/0634H01L29/0653H01L29/0692H01L29/0847H01L29/0882H01L29/1083H01L29/1087H01L29/1095H01L29/7816H01L29/7835H01L2924/0002H01L2924/00
    • Breakdown voltage BVdss is enhanced and ON-resistance reduced in RESURF devices (40, 60, 80, 80′, 80″), e.g., LDMOS transistors, by careful charge balancing, even when body (44, 44′, 84, 84′) and drift (50, 50′, 90, 90′) region charge balance is not ideal, by: (i) providing a plug or sinker (57) near the drain (52, 92) and of the same conductivity type extending through the drift region (50, 50′, 90, 90′) at least into the underlying body region (44, 44′ 84, 84′), and/or (ii) applying bias Viso to a surrounding lateral doped isolation wall (102) coupled to the device buried layer (42, 82), and/or (iii) providing a variable resistance bridge (104) between the isolation wall (102) and the drift region (50, 50′, 90, 90′). The bridge (104) may be a FET (110) whose source-drain (113, 114) couple the isolation wall (102) and drift region (50, 50′, 90, 90′) and whose gate (116) receives control voltage Vc, or a resistor (120) whose cross-section (X, Y, Z) affects its resistance and pinch-off, to set the percentage of drain voltage coupled to the buried layer (42, 82) via the isolation wall (102).
    • 即使当主体(44,44',84,84“),RESURF装置(40,60,80,80',80”),例如LDMOS晶体管也通过小心的电荷平衡来增强击穿电压BVdss并导通电阻, )和漂移(50,50',90,90')区域电荷平衡不是理想的,通过:(i)在漏极(52,92)附近提供插塞或沉降片(57),并且延伸通过相同的导电类型 至少进入下面的主体区域(44,44',84,84')中的漂移区域(50,50',90,90'),和/或(ii)将偏置Viso施加到周围的侧向掺杂隔离壁(102 )和/或(iii)在所述隔离壁(102)和所述漂移区域(50,50',90,90')之间提供可变电阻桥(104)。 桥(104)可以是源极漏极(113,114)耦合隔离壁(102)和漂移区(50,50',90,90')并且其栅极(116)接收控制 电压Vc或其横截面(X,Y,Z)影响其电阻和夹断的电阻器(120),以经由隔离壁(42,82)设置耦合到埋层(42,82)的漏极电压的百分比 102)。
    • 30. 发明申请
    • RESURF SEMICONDUCTOR DEVICE CHARGE BALANCING
    • RESURF半导体器件充电平衡
    • US20090294849A1
    • 2009-12-03
    • US12129840
    • 2008-05-30
    • Won Gi MinZhihong ZhangHongzhong XuJiang-Kai Zuo
    • Won Gi MinZhihong ZhangHongzhong XuJiang-Kai Zuo
    • H01L29/78H01L23/58
    • H01L29/7823H01L29/063H01L29/0634H01L29/0653H01L29/0692H01L29/0847H01L29/0882H01L29/1083H01L29/1087H01L29/1095H01L29/7816H01L29/7835H01L2924/0002H01L2924/00
    • Breakdown voltage BVdss is enhanced and ON-resistance reduced in RESURF devices (40, 60, 80, 80′, 80″), e.g., LDMOS transistors, by careful charge balancing, even when body (44, 44′, 84, 84′) and drift (50, 50′, 90, 90′) region charge balance is not ideal, by: (i) providing a plug or sinker (57) near the drain (52, 92) and of the same conductivity type extending through the drift region (50, 50′, 90, 90′) at least into the underlying body region (44, 44′ 84, 84′), and/or (ii) applying bias Viso to a surrounding lateral doped isolation wall (102) coupled to the device buried layer (42, 82), and/or (iii) providing a variable resistance bridge (104) between the isolation wall (102) and the drift region (50, 50′, 90, 90′). The bridge (104) may be a FET (110) whose source-drain (113, 114) couple the isolation wall (102) and drift region (50, 50′, 90, 90′) and whose gate (116) receives control voltage Vc, or a resistor (120) whose cross-section (X, Y, Z) affects its resistance and pinch-off, to set the percentage of drain voltage coupled to the buried layer (42, 82) via the isolation wall (102).
    • 即使在主体(44,44',84,84)中,分解电压BVdss被增强,并且RESURF器件(40,60,80,80',80“)中的导通电阻降低,例如LDMOS晶体管 ')和漂移(50,50',90,90')区域电荷平衡不是理想的,通过:(i)在漏极(52,92)附近提供插塞或沉降片(57),并且具有相同的导电类型延伸 至少穿过所述漂移区域(50,50',90,90')到所述下部体区域(44,44',84,84')中,和/或(ii)将偏压Viso施加到周围的侧向掺杂隔离壁 102)和/或(iii)在隔离壁(102)和漂移区域(50,50',90,90')之间提供可变电阻桥(104) 。 桥(104)可以是源极漏极(113,114)耦合隔离壁(102)和漂移区(50,50',90,90')并且其栅极(116)接收控制 电压Vc或其横截面(X,Y,Z)影响其电阻和夹断的电阻器(120),以经由隔离壁(42,82)设置耦合到埋层(42,82)的漏极电压的百分比 102)。