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21. 发明申请

US20130340820A1 METAL SUBSTRATE FOR DYE-SENSITIZED SOLAR CELL 审中-公开
标题翻译：用于透明的太阳能电池的金属基材
公开(公告)号：US20130340820A1
公开(公告)日：2013-12-26
申请号：US13530412
申请日：2012-06-22
申请人： Ryouji Inoue , Shinji Yamamoto , Keita Watanabe , Masaaki Ishio
发明人： Ryouji Inoue , Shinji Yamamoto , Keita Watanabe , Masaaki Ishio
IPC分类号： H01L31/0236 , H01L31/02
CPC分类号： H01G9/2068 , H01G9/20 , H01G9/2022 , H01G9/2031 , H01G9/2059 , H01G9/2077 , Y02E10/542
摘要： This metal substrate for a dye-sensitized solar cell includes a clad material including a nonporous first metal layer, arranged on an anode side of a dye-sensitized solar cell element, made of a metal having corrosion resistance against an electrolyte of the dye-sensitized solar cell element and a second metal layer made of a metal having lower electrical resistance than the first metal layer and bonded to a side of the first metal layer opposite to the dye-sensitized solar cell element.
摘要翻译：用于染料敏化太阳能电池的金属基材包括：包含无孔第一金属层的复合材料，其布置在染料敏化太阳能电池元件的阳极侧，由对染料敏化的电解质的电解质具有耐腐蚀性的金属制成太阳能电池元件和由与第一金属层相比电阻低的金属制成的第二金属层，并且与第一金属层的与染料敏化太阳能电池元件相对的一侧结合。

22. 发明申请

US20120177943A1 METAL SUBSTRATE FOR SOLAR BATTERY AND METHOD OF MANUFACTURING METAL SUBSTRATE FOR SOLAR BATTERY 审中-公开
标题翻译：太阳能电池用金属基板及制造太阳能电池用金属基板的方法
公开(公告)号：US20120177943A1
公开(公告)日：2012-07-12
申请号：US13123602
申请日：2011-01-12
申请人： Shinji Yamamoto , Ryouji Inoue , Keita Watanabe , Masaaki Ishio
发明人： Shinji Yamamoto , Ryouji Inoue , Keita Watanabe , Masaaki Ishio
IPC分类号： B32B15/20 , H01M2/00 , C23F1/00 , B32B15/00 , B32B37/14
CPC分类号： H01L21/02491 , H01L21/02425 , H01L21/02502 , H01L21/02568 , H01L21/02658 , H01L31/03928 , H01L31/0749 , Y02E10/541 , Y02P70/521 , Y10T428/12493 , Y10T428/12535 , Y10T428/12757 , Y10T428/12771 , Y10T428/12917 , Y10T428/12924
摘要： A metal substrate for a solar battery capable of inhibiting power generation efficiency of a unit solar cell from decrease due to a defect of the unit solar cell is provided. This metal substrate (1) for a solar battery includes a cladding material having a first metal layer (11) with a first surface (11a) formed with a unit solar cell (2) and a second metal layer (12) bonded to the first metal layer on a second surface (11b) opposite to the first surface, while a kurtosis (Rku) serving as an index indicating surface roughness of the first surface is not more than 7.
摘要翻译：提供一种用于太阳能电池的金属基板，其能够抑制由于单位太阳能电池的缺陷而导致的单位太阳能电池的发电效率的降低。该太阳能电池用金属基板（1）包括：具有第一金属层（11）的包层材料，具有形成有单位太阳能电池（2）的第一表面（11a）和与第一金属层（11）接合的第二金属层金属层在与第一表面相对的第二表面（11b）上，而作为表示第一表面的表面粗糙度的指标的峰度（Rku）不大于7。

23. 发明授权

US07830001B2 Cu-Mo substrate and method for producing same 失效
标题翻译： Cu-Mo基板及其制造方法
公开(公告)号：US07830001B2
公开(公告)日：2010-11-09
申请号：US11915201
申请日：2006-05-23
申请人： Masayuki Yokota , Kazuhiro Shiomi , Fumiaki Kikui , Masaaki Ishio
发明人： Masayuki Yokota , Kazuhiro Shiomi , Fumiaki Kikui , Masaaki Ishio
IPC分类号： H01L21/00
CPC分类号： H01L23/3735 , H01L23/142 , H01L23/3736 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/01019 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , Y10T156/10 , Y10T428/12778 , H01L2924/00014 , H01L2924/00
摘要： A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.
摘要翻译：根据本发明的Cu-Mo基板10包括：以Cu为主要成分的Cu基1; Mo基具有相对的第一和第二主面2a，2b并且包含Mo作为主要成分，Mo基底2的第二主面2b位于Cu基底1的主面1a的至少一部分上; 以及覆盖Mo基2的第一主面2a和侧面2c，2d的第一Sn-Cu系合金层3，含有1质量％以上且不大于1质量％的第一Sn-Cu系合金层3 13质量％的Sn。

24. 发明授权

US07776452B2 Heat sink member and method of manufacturing the same 失效
标题翻译：散热片及其制造方法
公开(公告)号：US07776452B2
公开(公告)日：2010-08-17
申请号：US10566721
申请日：2005-07-27
申请人： Kazuhiro Shiomi , Masaaki Ishio , Tsuyoshi Hasegawa
发明人： Kazuhiro Shiomi , Masaaki Ishio , Tsuyoshi Hasegawa
IPC分类号： H01L23/373 , B32B15/20
CPC分类号： H01L23/3735 , H01L2224/32 , H01L2224/83101 , Y10T428/12826 , Y10T428/12903
摘要： A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.
摘要翻译：获得能够抑制制造中的裂纹和裂纹的发展，抑制热膨胀系数的扩大和抑制导热性的降低的散热构件。该散热构件包括主要由Cu构成的层构件（1），主要由Mo构成的基板（2）和由Sn-Cu合金（Sn：1质量％〜13质量％）构成的钎焊层（4）布置在所述帘布层构件和所述基底之间，用于将所述帘布层构件和所述衬底彼此粘合。

25. 发明授权

US10121602B2 Metal substrate for dye-sensitized solar cell 有权
公开(公告)号：US10121602B2
公开(公告)日：2018-11-06
申请号：US13530412
申请日：2012-06-22
申请人： Ryouji Inoue , Shinji Yamamoto , Keita Watanabe , Masaaki Ishio
发明人： Ryouji Inoue , Shinji Yamamoto , Keita Watanabe , Masaaki Ishio
IPC分类号： H01L31/0236 , H01G9/20
摘要： This metal substrate for a dye-sensitized solar cell includes a clad material including a nonporous first metal layer, arranged on an anode side of a dye-sensitized solar cell element, made of a metal having corrosion resistance against an electrolyte of the dye-sensitized solar cell element and a second metal layer made of a metal having lower electrical resistance than the first metal layer and bonded to a side of the first metal layer opposite to the dye-sensitized solar cell element.

26. 发明申请

US20120202090A1 ALUMINUM BONDING ALLOY, AND CLAD MATERIAL AND ALUMINUM BONDING COMPOSITE MATERIAL EACH HAVING BONDING ALLOY LAYER MADE OF THE ALLOY 有权
标题翻译：铝合金合金，以及合金的粘结合金层的粘合材料和铝结合复合材料
公开(公告)号：US20120202090A1
公开(公告)日：2012-08-09
申请号：US13501533
申请日：2010-10-25
申请人： Shinji Yamamoto , Masaaki Ishio
发明人： Shinji Yamamoto , Masaaki Ishio
IPC分类号： B32B15/01 , B32B15/20 , B23K31/02 , C22C19/03
CPC分类号： B23K1/19 , B23K20/023 , B23K20/16 , B23K20/2275 , B23K20/2333 , B23K20/2336 , B23K35/002 , B23K35/004 , B23K35/0233 , B23K35/3033 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/18 , B23K2103/20 , B23K2103/26 , B32B15/015 , B32B15/017 , C22C19/007 , C22C19/03 , Y10T428/12743 , Y10T428/1275 , Y10T428/12757 , Y10T428/12764 , Y10T428/12806 , Y10T428/1291 , Y10T428/12937
摘要： An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding.
摘要翻译：铝合金合金是用于粘合铝的Ni-Mg合金和选自钢，铜，镍或钛的非铝金属。 Ni-Mg合金基本上由0.08-0.90质量％的Mg组成，余量为Ni和不可避免的杂质。包层材料包括由非铝金属制成的非铝金属层和由铝接合合金制成的接合合金层。非铝金属层和接合合金层通过压焊和扩散接合结合在一起。

27. 发明申请

US20100273025A1 BRAZING METHOD AND BRAZED STRUCTURE 失效
标题翻译： BRAZING方法和BRAZED结构
公开(公告)号：US20100273025A1
公开(公告)日：2010-10-28
申请号：US12829413
申请日：2010-07-02
申请人： Tsuyoshi Hasegawa , Masaaki Ishio , Shunji Kajikawa , Yoshitsugu Sakamoto , Takayuki Hayashi
发明人： Tsuyoshi Hasegawa , Masaaki Ishio , Shunji Kajikawa , Yoshitsugu Sakamoto , Takayuki Hayashi
IPC分类号： B32B15/18 , B32B15/01
CPC分类号： F28F21/085 , B23K1/0012 , B23K1/19 , B23K35/004 , B23K35/302 , B23K2101/14 , F28D1/0308 , F28F3/025 , F28F2275/04 , H01L23/3735 , H01L23/473 , H01L2924/0002 , Y10S165/905 , Y10T428/12854 , Y10T428/1291 , Y10T428/12917 , Y10T428/12924 , Y10T428/12937 , Y10T428/12951 , Y10T428/12979 , H01L2924/00
摘要： A brazing method which provides a braze joint having excellent corrosion resistance and a brazed structure including such a braze joint includes assembling a first member and a second member to be joined into a temporary assembly, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and composed of a N—Cr alloy essentially including not less than about 15% and not greater than about 40% of Cr, the second member being disposed on the diffusion suppressing layer of the first member with intervention of a brazing material of a Cu—Ni alloy essentially including not less than about 10% and not greater than about 20% of Ni, and maintaining the temporary assembly at a temperature of not less than about 1,200° C. to fuse the brazing material and diffuse Ni atoms and Cr atoms into the fused brazing material from the diffusion suppressing layer to form the braze joint, causing the resulting brazing material of the braze joint to have an increased melting point due to the increase of the Ni and Cr contents of the braze joint to self-solidify the braze joint, and then cooling the resulting assembly.
摘要翻译：提供具有优异耐腐蚀性的钎焊接头和包括这种钎焊接头的钎焊结构的钎焊方法包括将第一构件和待接合的第二构件组装到临时组件中，所述第一构件包括由铁质材料制成的基板以及层叠在所述基板上并由基本上包含不少于约15％且不大于约40％的Cr的N-Cr合金构成的扩散抑制层，所述第二构件设置在所述第一构件的扩散抑制层上用Cu-Ni合金的钎焊材料介入，其基本上不小于Ni的约10％且不大于约20％，并且将临时组件保持在不低于约1200℃的温度以熔化钎焊材料和扩散Ni原子和Cr原子从扩散抑制层扩散到熔融钎焊材料中以形成钎焊接头，导致所得到的钎焊材料b 由于钎焊接头的Ni和Cr含量的增加使钎焊接头自固化，然后冷却所得到的组件，使得熔接点具有增加的熔点。

28. 发明申请

US20080020225A1 Discharge Electrode Clad Material And Discharge Electrode 审中-公开
标题翻译：放电电极包层材料和放电电极
公开(公告)号：US20080020225A1
公开(公告)日：2008-01-24
申请号：US10595811
申请日：2004-11-08
申请人： Tomohiro Saito , Hiroshi Miura , Masaaki Ishio , Tsuyoshi Hasegawa
发明人： Tomohiro Saito , Hiroshi Miura , Masaaki Ishio , Tsuyoshi Hasegawa
IPC分类号： H01J61/067 , H01J9/02
CPC分类号： H01J1/02 , H01J61/04 , H01J61/0675 , Y10T428/12201 , Y10T428/12292 , Y10T428/12493 , Y10T428/12937 , Y10T428/12944
摘要： A discharge electrode material is provided, which enable to form a discharge electrode having a service life and discharge characteristics equivalent to those of a discharge electrode mainly composed of Nb and having excellent weldability to a support conductor, and enables to reduce material costs. The discharge electrode clad material according to the present invention includes a base layer composed of pure Ni, a Ni-based alloy mainly comprising Ni or a stainless steel, and a surface layer bonded to the base layer and composed of pure Nb or a Nb-based alloy mainly comprising Nb. The clad material preferably further includes an intermediate layer provided between the base layer and the surface layer and composed of a stainless steel. The base layer may have a strip-like shape, and the surface layer may be disposed only on a middle portion of the base layer.
摘要翻译：提供一种放电电极材料，其能够形成具有与主要由Nb组成的放电电极相当的使用寿命和放电特性并且对支撑导体具有优异的焊接性的放电电极，并且能够降低材料成本。根据本发明的放电电极包覆材料包括由纯Ni构成的基底层，主要包含Ni或不锈钢的Ni基合金以及与基底层结合并由纯Nb或Nb- 主要由Nb构成。包层材料优选还包括设置在基底层和表面层之间并由不锈钢构成的中间层。基底层可以具有条状形状，并且表面层可以仅设置在基底层的中间部分上。

29. 发明授权

US07166497B2 Electronic component package and method of manufacturing same 有权
标题翻译：电子元件封装及其制造方法
公开(公告)号：US07166497B2
公开(公告)日：2007-01-23
申请号：US10989675
申请日：2004-11-16
申请人： Kazuhiro Shiomi , Masaaki Ishio , Minoru Iizuka , Yoshikiyo Ogasawara
发明人： Kazuhiro Shiomi , Masaaki Ishio , Minoru Iizuka , Yoshikiyo Ogasawara
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/04 , H01L23/10 , H01L2924/01079 , H01L2924/16195
摘要： An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer. The ratio of the area of the first and second intermetallic compound layers in a longitudinal section of the fusion-welding layer relative to the area of the longitudinal section of the fusion-welding layer is in a range of from about 25% to about 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material.
摘要翻译：电子部件封装包括具有其中包括电子部件的空腔部分的壳体和通过熔融焊接层熔合到壳体上以密封空腔部分的盖部件。壳体具有层叠在壳体上的第一金属层，以便在空腔部分的开放侧露出。盖部件具有芯部，层叠在芯部的面向壳体的一侧的第二金属层。熔焊层具有由焊料形成的焊接材料层，以及由于焊接材料的主要成分扩散到第一金属层中而设置在焊料层的相对侧上的第一和第二金属间化合物层和第二金属层。熔融层的纵截面中的第一和第二金属间化合物的面积相对于熔融层的纵截面的面积的比例为约25％〜98％。即使暴露在高于焊接材料的熔点的高温气氛下，该包装也保持优异的气密性。

30. 发明授权

US08029918B2 Brazing method and brazed structure 失效
标题翻译：钎焊方法和钎焊结构
公开(公告)号：US08029918B2
公开(公告)日：2011-10-04
申请号：US12829413
申请日：2010-07-02
申请人： Tsuyoshi Hasegawa , Masaaki Ishio , Shunji Kajikawa , Yoshitsugu Sakamoto , Takayuki Hayashi
发明人： Tsuyoshi Hasegawa , Masaaki Ishio , Shunji Kajikawa , Yoshitsugu Sakamoto , Takayuki Hayashi
IPC分类号： B32B15/18 , B32B15/20 , F28F21/08
CPC分类号： F28F21/085 , B23K1/0012 , B23K1/19 , B23K35/004 , B23K35/302 , B23K2101/14 , F28D1/0308 , F28F3/025 , F28F2275/04 , H01L23/3735 , H01L23/473 , H01L2924/0002 , Y10S165/905 , Y10T428/12854 , Y10T428/1291 , Y10T428/12917 , Y10T428/12924 , Y10T428/12937 , Y10T428/12951 , Y10T428/12979 , H01L2924/00
摘要： A brazing method includes assembling a first member and a second member, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and made of a Ni—Cr alloy including more than about 15% and less than about 40% of Cr, the second member being disposed on the first member with a brazing material of a Cu—Ni alloy including more than about 10% and less than about 20% of Ni therebetween, and maintaining the temporary assembly at a temperature of more than about 1,200° C. to fuse the brazing material and diffuse Ni atoms and Cr atoms into the fused brazing material to form the braze joint, causing the resulting brazing material to have an increased melting point due to the Ni and Cr contents of the braze joint to self-solidify the braze joint, and then cooling the resulting assembly.
摘要翻译：钎焊方法包括组装第一构件和第二构件，第一构件包括由铁基材制成的基板和层压在基板上并由包括大于约15％的Ni-Cr合金制成的扩散抑制层，以及小于约40％的Cr，第二构件使用包含大于约10％且小于约20％的Ni的Cu-Ni合金的钎焊材料设置在第一构件上，并且将临时组件保持在温度大于约1200℃，熔化钎焊材料并将Ni原子和Cr原子扩散到熔融钎焊材料中以形成钎焊接头，导致由于Ni和Cr含量导致的钎焊材料具有增加的熔点的钎焊接头自动固化钎焊接头，然后冷却所得组件。

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