专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07237422B2 Method of drawing a composite wire 失效
标题翻译：拉丝复合丝的方法
公开(公告)号：US07237422B2
公开(公告)日：2007-07-03
申请号：US11264877
申请日：2005-11-01
申请人： Nathaniel R. Quick , Aravinda Kar , Yonggang Li , Raymond R. McNeice
发明人： Nathaniel R. Quick , Aravinda Kar , Yonggang Li , Raymond R. McNeice
IPC分类号： B21D37/16
CPC分类号： B21C37/042 , B21C1/003 , B21C1/02 , B21C1/12 , B21C37/047 , Y10S72/70
摘要： An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
摘要翻译：公开了一种用于将具有第一直径的连续金属丝拉制成具有减小的第二直径的金属纤维的装置和方法。进给机构以第一线速度移动线。激光束将导线的区域加热到升高的温度。牵引机构以第二和更大的线速度牵引加热的线，以提供具有减小的第二直径的拉伸金属纤维。

22. 发明授权

US07013695B2 Method for drawing continuous fiber 失效
标题翻译：拉伸连续纤维的方法
公开(公告)号：US07013695B2
公开(公告)日：2006-03-21
申请号：US10828711
申请日：2004-04-20
申请人： Nathaniel R. Quick , Aravinda Kar , Yonggang Li , Raymond R. McNeice
发明人： Nathaniel R. Quick , Aravinda Kar , Yonggang Li , Raymond R. McNeice
IPC分类号： B21D37/16
CPC分类号： B21C37/042 , B21C1/003 , B21C1/02 , B21C1/12 , B21C37/047 , Y10S72/70
摘要： An apparatus and method is disclosed for drawing continuous metallic wire having a first diameter to a metallic fiber having a reduced second diameter. A feed mechanism moves the wire at a first linear velocity. A laser beam heats a region of the wire to an elevated temperature. A draw mechanism draws the heated wire at a second and greater linear velocity for providing a drawn metallic fiber having the reduced second diameter.
摘要翻译：公开了一种用于将具有第一直径的连续金属丝拉制成具有减小的第二直径的金属纤维的装置和方法。进给机构以第一线速度移动线。激光束将导线的区域加热到升高的温度。牵引机构以第二和更大的线速度牵引加热的线，以提供具有减小的第二直径的拉伸金属纤维。

23. 发明授权

US09442286B2 Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate 有权
标题翻译：用于半导体衬底的激光束扫描的声光偏转器的间隔配置
公开(公告)号：US09442286B2
公开(公告)日：2016-09-13
申请号：US13997646
申请日：2011-12-22
申请人： Yonggang Li , Islam A. Salama , Chong Zhang
发明人： Yonggang Li , Islam A. Salama , Chong Zhang
IPC分类号： G02B26/08 , G02F1/29 , G02F1/33 , G02B26/10
CPC分类号： G02B26/10 , B23K2101/42 , G02F1/33 , G02F2001/291 , G02F2201/16
摘要： A first acousto-optic deflector receives a laser beam. The first acousto-optic deflector diffracts the received laser beam along a first axis. A second acousto-optic deflector receives the diffracted laser beam. The second acousto-optic deflector diffracts the received diffracted laser beam along a second axis.
摘要翻译：第一声光偏转器接收激光束。第一声光偏转器沿着第一轴衍射接收的激光束。第二声光偏转器接收衍射激光束。第二声光偏转器沿着第二轴衍射所接收的衍射激光束。

24. 发明授权

US08318536B2 Utilizing aperture with phase shift feature in forming microvias 有权
标题翻译：在形成微孔时利用相移特征的孔径
公开(公告)号：US08318536B2
公开(公告)日：2012-11-27
申请号：US11967862
申请日：2007-12-31
申请人： Yonggang Li
发明人： Yonggang Li
IPC分类号： H01L21/00
CPC分类号： B23K26/066 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/40 , B23K2103/08 , B23K2103/172 , B23K2103/50 , B23K2103/52 , H01L21/486
摘要： A method, comprises drilling a set of one or more microvias in a semiconductor package with an aperture, wherein drilling the set of microvias comprises to use an aperture that has a phase shift region to reduce a spot size of a drilling beam that is used to form the set of microvias.
摘要翻译：一种方法，包括在具有孔的半导体封装中钻一组一个或多个微孔，其中钻一组微孔包括使用具有相移区域的孔径，以减小用于形成一组微血管。

25. 发明授权

US07749900B2 Method and core materials for semiconductor packaging 有权
标题翻译：半导体封装的方法和芯材
公开(公告)号：US07749900B2
公开(公告)日：2010-07-06
申请号：US12242414
申请日：2008-09-30
申请人： Yonggang Li , Amruthavalli P. Alur , Devarajan Balaraman , Xiwang Qi , Charan K. Gurumurthy
发明人： Yonggang Li , Amruthavalli P. Alur , Devarajan Balaraman , Xiwang Qi , Charan K. Gurumurthy
IPC分类号： H01L21/02
CPC分类号： H01L23/15 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/12 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/09701 , H01L2924/14 , H05K3/0029 , H05K3/0032 , H05K3/429 , H05K3/4605 , H05K2201/10674 , H01L2224/0401
摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.
摘要翻译：半导体封装包括可包括芯的半导体衬底。芯可以包括选自包括陶瓷和玻璃电介质的组中的一种或多种材料。所述封装还包括设置在所述芯上的一组或多个内部导电元件，设置在所述基板的外侧上的一组或多个外部导电元件的集合，以及半导体管芯，以通过一个或多个外部导电元件。芯的示例性材料可以包括氧化铝，氧化锆，碳化物，氮化物，熔融二氧化硅，石英，蓝宝石和派雷克斯中的一种或多种。可以使用激光器来钻一个或多个电镀通孔，以将内部导电元件耦合到外部导电元件。介电层可以形成在衬底中以使外部导电元件与芯或内部导电元件绝缘。

26. 发明申请

US20100101084A1 SAME LAYER MICROELECTRONIC CIRCUIT PATTERNING USING HYBRID LASER PROJECTION PATTERNING (LPP) AND SEMI-ADDITIVE PATTERNING(SAP) 有权
标题翻译：使用混合激光投影图案（LPP）和半自动绘图（SAP）的相同层微电子电路图
公开(公告)号：US20100101084A1
公开(公告)日：2010-04-29
申请号：US12257688
申请日：2008-10-24
申请人： John Guzek , Yonggang Li
发明人： John Guzek , Yonggang Li
IPC分类号： H05K3/06
CPC分类号： H05K1/0296 , C25D5/02 , C25D5/34 , H01L23/49541 , H01L23/49582 , H01L2924/0002 , H05K1/0265 , H05K1/09 , H05K1/181 , H05K3/0026 , H05K3/0032 , H05K3/02 , H05K3/045 , H05K3/107 , H05K3/108 , H05K3/188 , H05K2201/0394 , H05K2201/09036 , H05K2201/09563 , H05K2201/09727 , H05K2203/0542 , Y10T29/49156 , H01L2924/00
摘要： In some embodiments, same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) is presented. In this regard, a method is introduced including patterning a first density region of a laminated substrate surface using LPP, patterning a second density region of the laminated substrate surface using SAP, and plating the first and second density regions of the laminated substrate surface, wherein features spanning the first and second density regions are directly coupled. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，提出使用混合激光投影图案化（LPP）和半添加剂图案化（SAP）的相同层微电子电路图案化。在这方面，引入了一种方法，包括使用LPP图案化层叠基板表面的第一密度区域，使用SAP对叠层基板表面的第二密度区域进行图案化，以及电镀层叠基板表面的第一和第二密度区域，其中跨越第一和第二密度区域的特征直接耦合。还公开并要求保护其他实施例。

27. 发明申请

US20090170239A1 UTILIZING APERTURE WITH PHASE SHIFT FEATURE IN FORMING MICROVIAS 有权
标题翻译：在形成微波中使用相移功能实现光孔
公开(公告)号：US20090170239A1
公开(公告)日：2009-07-02
申请号：US11967862
申请日：2007-12-31
申请人： Yonggang Li
发明人： Yonggang Li
IPC分类号： H01L21/50 , B23K26/00
CPC分类号： B23K26/066 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2101/40 , B23K2103/08 , B23K2103/172 , B23K2103/50 , B23K2103/52 , H01L21/486
摘要： A method, comprises drilling a set of one or more microvias in a semiconductor package with an aperture, wherein drilling the set of microvias comprises to use an aperture that has a phase shift region to reduce a spot size of a drilling beam that is used to form the set of microvias.
摘要翻译：一种方法，包括在具有孔的半导体封装中钻一组一个或多个微孔，其中钻一组微孔包括使用具有相移区域的孔径，以减小用于形成一组微血管。

28. 发明申请

US20090111994A1 Method for The Production of Losartan 审中-公开
标题翻译：氯沙坦生产方法
公开(公告)号：US20090111994A1
公开(公告)日：2009-04-30
申请号：US11883972
申请日：2006-02-02
申请人： Yaping Wang , Yonggang Li , Yulin Li , Guojun Zheng , Yi Li
发明人： Yaping Wang , Yonggang Li , Yulin Li , Guojun Zheng , Yi Li
IPC分类号： C07D257/04
CPC分类号： C07C257/14 , C07D233/64 , C07D257/04 , C07D403/10 , Y02P20/55
摘要： The present invention relates to a novel process for preparing losartan, an imidazole derivative with the chemical name 2-n-butyl-4-chloro-5-hydroxymethyl-1-{[2′-(1H-tetrazol-5-yl)biphenyl-4-]methyl}imidazole, and pharmacologically active salts thereof. The invention further relates to novel intermediates which are suitable for preparing losartan and to novel processes for preparing intermediate compounds which are suitable for preparing losartan.One aspect of the invention is a process for preparing a compound of the general formula I which can form as an intermediate in an inventive preparation of losartan.
摘要翻译：本发明涉及一种制备氯沙坦的新方法，该化合物名为2-正丁基-4-氯-5-羟甲基-1 - {[2' - （1H-四唑-5-基）联苯 -4-]甲基}咪唑及其药理学活性盐。本发明还涉及适用于制备氯沙坦的新型中间体和适用于制备氯沙坦的中间体化合物的新方法。本发明的一个方面是制备可在本发明氯沙坦制剂中形成中间体的通式Ⅰ化合物的方法。

29. 发明授权

US07485017B2 Pin grid array package substrate including pins having anchoring elements 有权
标题翻译：针格阵列封装衬底包括具有锚定元件的销
公开(公告)号：US07485017B2
公开(公告)日：2009-02-03
申请号：US11758338
申请日：2007-06-05
申请人： Mengzhi Pang , Yonggang Li
发明人： Mengzhi Pang , Yonggang Li
IPC分类号： H01R4/02
CPC分类号： H05K3/3426 , H05K1/111 , H05K2201/0969 , H05K2201/10318 , H05K2203/167 , Y02P70/613
摘要： A microelectronic package substrate and an electrically conductive pin. The substrates includes: a die-side surface adapted to receive a die thereon; a printed circuit board (PCB)-side surface adapted to be mechanically and electrically bonded to a PCB; an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein; an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements and anchoring recesses being configured such that a mating thereof inhibits a tilting of the pins on the land pads; and a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.
摘要翻译：微电子封装基板和导电引脚。基板包括：适于在其上容纳管芯的模具侧表面; 印刷电路板（PCB） - 侧表面，其适于机械地和电气地结合到PCB; PCB侧表面上的焊盘阵列，焊盘限定其中的固定凹槽; 导电销的阵列电和机械地结合到相应的焊盘，所述引脚在其上具有锚定元件，其中所述锚定元件与所述焊盘的相应锚固凹槽配合，所述锚固元件和锚固凹槽被配置为使得其匹配抑制焊盘上的销的倾斜; 以及多个引脚附接焊点，将引脚机械地和电气地结合到对应的焊盘。

30. 发明申请

US20080085595A1 Method of providing solder bumps on a substrate using localized heating 有权
标题翻译：使用局部加热在基板上提供焊料凸块的方法
公开(公告)号：US20080085595A1
公开(公告)日：2008-04-10
申请号：US11540074
申请日：2006-09-28
申请人： Yonggang Li
发明人： Yonggang Li
IPC分类号： H01L21/44
CPC分类号： H05K3/3478 , H01L24/11 , H01L2224/05144 , H01L2224/05155 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/0558 , H01L2224/05644 , H01L2224/05655 , H01L2224/1131 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/11472 , H01L2224/11552 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01052 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H05K3/1216 , H05K3/3484 , H05K3/3494 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H05K2203/107 , H01L2924/00 , H01L2924/00014
摘要： A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate. The method includes: providing a microelectronic substrate including electrode pads exhibiting an electrode pad pattern; providing solder portions onto respective ones of the electrode pads according to the electrode pad pattern; reflowing the solder portions to form solder bumps therefrom, reflowing comprising applying localized heating to each of the solder portions to reflow the same.
摘要翻译：一种在微电子衬底的电极焊盘上提供导电凸块的方法。该方法包括：提供包括显示电极焊盘图形的电极焊盘的微电子衬底; 根据电极焊盘图案将焊料部分提供到相应的电极焊盘上; 回流焊料部分以形成焊料凸块，回流包括对每个焊料部分施加局部加热以使其回流。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式