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21. 发明授权

US08119529B2 Method for chemical mechanical polishing a substrate 有权
标题翻译：化学机械抛光基材的方法
公开(公告)号：US08119529B2
公开(公告)日：2012-02-21
申请号：US12432021
申请日：2009-04-29
申请人： Yi Guo , Zhendong Liu
发明人： Yi Guo , Zhendong Liu
IPC分类号： H01L21/302
CPC分类号： H01L21/31053 , B24B37/0056 , B24B37/044 , C09G1/02
摘要： A method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate comprises silicon dioxide; providing a chemical mechanical polishing composition, wherein the chemical mechanical polishing composition comprises: water, an abrasive; a diquaternary cation according to formula (I); and optionally a quaternary alkylammonium compound; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate; and dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition has a pH of 2 to 6; wherein the chemical mechanical polishing composition exhibits a silicon dioxide removal rate of at least 1,500 Å/min.
摘要翻译：一种用于基板的化学机械抛光的方法，包括：提供基板，其中所述基板包括二氧化硅; 提供化学机械抛光组合物，其中所述化学机械抛光组合物包括：水，研磨剂; 式（I）的二季阳离子; 和任选的季烷基铵化合物; 提供化学机械抛光垫; 在化学机械抛光垫和基底之间的界面处产生动态接触; 以及将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物的pH为2至6; 其中化学机械抛光组合物的二氧化硅去除率至少为1500埃/分钟。

22. 发明申请

US20110306211A1 Stabilized Chemical Mechanical Polishing Composition And Method Of Polishing A Substrate 有权
标题翻译：稳定的化学机械抛光组合物和抛光底物的方法
公开(公告)号：US20110306211A1
公开(公告)日：2011-12-15
申请号：US12815564
申请日：2010-06-15
申请人： Yi Guo , Zhendong Liu , Kancharla-Arun Kumar Reddy , Guangyun Zhang
发明人： Yi Guo , Zhendong Liu , Kancharla-Arun Kumar Reddy , Guangyun Zhang
IPC分类号： H01L21/306 , C09K13/00
CPC分类号： H01L21/31053 , C09G1/02 , C09K3/1463
摘要： A chemical mechanical polishing composition, comprising, as initial components: water; 0.1 to 40 wt % abrasive having an average particle size of 5 to 150 nm; 0.001 to 1 wt % of an adamarityl substance according to formula (II); 0 to 1 wt % diquaternary substance according to formula (I); and, 0 to 1 wt % of a quaternary ammonium compound. Also, provided is a method for chemical mechanical polishing using the chemical mechanical polishing composition.
摘要翻译：化学机械抛光组合物，其包含作为初始组分的水; 0.1〜40重量％的平均粒径为5〜150nm的研磨剂; 0.001至1重量％的根据式（II）的金属物质; 0至1重量％的式（I）的二季物质; 和0〜1重量％的季铵化合物。此外，提供了使用化学机械抛光组合物的化学机械抛光的方法。

23. 发明申请

US20110230050A1 METHOD OF POLISHING A SUBSTRATE COMPRISING POLYSILICON AND AT LEAST ONE OF SILICON OXIDE AND SILICON NITRIDE 有权
标题翻译：抛光包含多晶硅和至少一种氧化硅和氮化硅的基材的方法
公开(公告)号：US20110230050A1
公开(公告)日：2011-09-22
申请号：US12724990
申请日：2010-03-16
申请人： Yi Guo , Zhendong Liu , Kancharla-Arun Kumar Reddy , Guangyun Zhang
发明人： Yi Guo , Zhendong Liu , Kancharla-Arun Kumar Reddy , Guangyun Zhang
IPC分类号： H01L21/306
CPC分类号： H01L21/31053 , C09G1/02
摘要： A method for chemical mechanical polishing of a substrate is provided, comprising: providing a substrate, wherein the substrate comprises polysilicon and at least one of silicon oxide and silicon nitride; providing a chemical mechanical polishing composition, comprising, as initial components: water; an abrasive; and an alkyl aryl polyether sulfonate compound, wherein the alkyl aryl polyether sulfonate compound has a hydrophobic portion having an alkyl group bound to an aryl ring and a nonionic acyclic hydrophilic portion having 4 to 100 carbon atoms; providing a chemical mechanical polishing pad with a polishing surface; moving the polishing surface relative to the substrate; dispensing the chemical mechanical polishing composition onto the polishing surface; and, abrading at least a portion of the substrate to polish the substrate; wherein at least some of the polysilicon is removed from the substrate; and, wherein at least some of the at least one of silicon oxide and silicon nitride is removed from the substrate.
摘要翻译：提供了一种用于基板的化学机械抛光的方法，包括：提供基板，其中所述基板包括多晶硅和氧化硅和氮化硅中的至少一种; 提供化学机械抛光组合物，其包含作为初始组分的水; 研磨剂烷基芳基聚醚磺酸酯化合物，其中烷基芳基聚醚磺酸酯化合物具有与芳环结合的烷基的疏水部分和具有4至100个碳原子的非离子非环状亲水部分; 提供具有抛光表面的化学机械抛光垫; 相对于衬底移动抛光表面; 将化学机械抛光组合物分配到抛光表面上; 并且研磨所述衬底的至少一部分以抛光所述衬底; 其中所述多晶硅中的至少一些从所述衬底移除; 并且其中所述至少一种氧化硅和氮化硅中的至少一种从所述衬底去除。

24. 发明申请

US20100279507A1 Method for chemical mechanical polishing a substrate 有权
标题翻译：化学机械抛光基材的方法
公开(公告)号：US20100279507A1
公开(公告)日：2010-11-04
申请号：US12432021
申请日：2009-04-29
申请人： Yi Guo , Zhendong Liu
发明人： Yi Guo , Zhendong Liu
IPC分类号： H01L21/306
CPC分类号： H01L21/31053 , B24B37/0056 , B24B37/044 , C09G1/02
摘要： A method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate comprises silicon dioxide; providing a chemical mechanical polishing composition, wherein the chemical mechanical polishing composition comprises: water, an abrasive; a diquaternary cation according to formula (I); and optionally a quaternary alkylammonium compound; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate; and dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition has a pH of 2 to 6; wherein the chemical mechanical polishing composition exhibits a silicon dioxide removal rate of at least 1,500 Å/min.
摘要翻译：一种用于基板的化学机械抛光的方法，包括：提供基板，其中所述基板包括二氧化硅; 提供化学机械抛光组合物，其中所述化学机械抛光组合物包括：水，研磨剂; 式（I）的二季阳离子; 和任选的季烷基铵化合物; 提供化学机械抛光垫; 在化学机械抛光垫和基底之间的界面处产生动态接触; 以及将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物的pH为2至6; 其中化学机械抛光组合物的二氧化硅去除率至少为1500埃/分钟。

25. 发明申请

US20100021912A1 Methods of Modulating Lipid Concentrations in Eukaryotic Cells 有权
标题翻译：调节真核细胞中脂质浓度的方法
公开(公告)号：US20100021912A1
公开(公告)日：2010-01-28
申请号：US12508853
申请日：2009-07-24
申请人： Robert V. Farese, JR. , Yi Guo , Tobias C. Walther , Peter Walter
发明人： Robert V. Farese, JR. , Yi Guo , Tobias C. Walther , Peter Walter
IPC分类号： C12Q1/68 , C12N1/13 , C12N15/74 , C12N15/82 , C12N15/85 , C12N15/81 , C12N15/80 , C12P7/00 , C12P5/00 , C12N1/19 , C12N5/10
CPC分类号： C12P7/649 , C12P7/6409 , C12P7/6436 , C12P7/6463 , Y02E50/13
摘要： The present invention is based on the discovery of a set of genes that are involved in lipid-droplet formation and regulation. Accordingly, the present invention provides methods of increasing or decreasing lipid concentrations in eukaryotic cells by decreasing or increasing expression of one of these genes. Increased lipid concentrations may be useful, for example, in the generation of biofuels. Decreased lipid concentration may be useful in the treatment of diseases characterized by excessive lipid storage. In addition, the invention provides methods of identifying markers of diseases characterized by excessive lipid storage.
摘要翻译：本发明基于一组参与脂滴形成和调节的基因的发现。因此，本发明提供通过减少或增加这些基因之一的表达来增加或减少真核细胞中的脂质浓度的方法。增加的脂质浓度可能是有用的，例如生物燃料的产生。降低的脂质浓度可用于治疗以过量脂质储存为特征的疾病。此外，本发明提供鉴定以过量脂质储存为特征的疾病的标志物的方法。

26. 发明授权

US07370356B1 Distributed network monitoring system and method 有权
标题翻译：分布式网络监控系统及方法
公开(公告)号：US07370356B1
公开(公告)日：2008-05-06
申请号：US10350172
申请日：2003-01-22
申请人： Yi Guo
发明人： Yi Guo
IPC分类号： G06F11/00 , H04L12/28 , H04L9/00 , H04L1/00 , H04K1/00
CPC分类号： H04L63/0861 , G06Q20/0855 , H04L63/101
摘要： Methods and systems for protecting the computer network against unauthorized access are disclosed. Information is reported about each network device connected to the network and/or one or more corresponding users. The reported information is correlated to determine if any unauthorized devices are connected to the network. To report the desired information, each device authorized to use the network may be provided with an agent configured to report information about the device to which it corresponds and information about one or more neighboring devices. A “reporting your neighbor” method may be used wherein each network device report its address and the address of its neighbors may be used to determine if any device is not reporting its address. Alternatively, each agent may report information about its device's physical location, e.g., by global positioning satellite (GPS). A door badge system may be used to provide user location information.
摘要翻译：公开了用于保护计算机网络免受未经授权的访问的方法和系统。报告关于连接到网络和/或一个或多个相应用户的每个网络设备的信息。报告的信息是相关的，以确定是否有任何未经授权的设备连接到网络。为了报告所需的信息，授权使用网络的每个设备可以被提供有被配置为报告关于其对应的设备的信息的代理和关于一个或多个相邻设备的信息的代理。可以使用“报告您的邻居”方法，其中每个网络设备报告其地址，并且可以使用其邻居的地址来确定是否有任何设备不报告其地址。或者，每个代理可以例如通过全球定位卫星（GPS）来报告关于其设备的物理位置的信息。可以使用门徽系统来提供用户位置信息。

27. 发明申请

US20190334600A9 SIGNALING FOR RESOURCE ALLOCATION AND SCHEDULING IN 5G-NR INTEGRATED ACCESS AND BACKHAUL 审中-公开
公开(公告)号：US20190334600A9
公开(公告)日：2019-10-31
申请号：US16189157
申请日：2018-11-13
申请人： Alexander Sirotkin , Alexei Davydov , Andrey Chervyakov , Anthony Lee , Avik Sengupta , Bharat Shrestha , Candy Yiu , Chang Hong Shan , Dae Won Lee , Dawei Ying , Debdeep Chatterjee , Farid Adrangi , Gang Xiong , Geng Wu , Gregory Morozov , Hassan Ghozlan , Hong He , Honglei Miao , Hua Li , Jaemin Han , Jeongho Jeon , Jie Cui , Jing Zhu , Joey Chou , Joonbeom Kim , Joonyoung Cho , Kathiravetpillai Sivanesan , Lu Lu , May Wu , Naveen Palle , Puneet Jain , Qian Li , Richard C. Burbidge , Robert Zaus , Rui Huang , Satish Chandra Jha , Seau S. Lim , Sergey Panteleev , Song Noh , Yaser M. Fouad , Yi Guo , Yizhi Yao , Yongjun Kwak , Youn Hyoung Heo , Yuhan Zhou , Yujian Zhang , Yushu Zhang
发明人： Alexander Sirotkin , Alexei Davydov , Andrey Chervyakov , Anthony Lee , Avik Sengupta , Bharat Shrestha , Candy Yiu , Chang Hong Shan , Dae Won Lee , Dawei Ying , Debdeep Chatterjee , Farid Adrangi , Gang Xiong , Geng Wu , Gregory Morozov , Hassan Ghozlan , Hong He , Honglei Miao , Hua Li , Jaemin Han , Jeongho Jeon , Jie Cui , Jing Zhu , Joey Chou , Joonbeom Kim , Joonyoung Cho , Kathiravetpillai Sivanesan , Lu Lu , May Wu , Naveen Palle , Puneet Jain , Qian Li , Richard C. Burbidge , Robert Zaus , Rui Huang , Satish Chandra Jha , Seau S. Lim , Sergey Panteleev , Song Noh , Yaser M. Fouad , Yi Guo , Yizhi Yao , Yongjun Kwak , Youn Hyoung Heo , Yuhan Zhou , Yujian Zhang , Yushu Zhang
IPC分类号： H04B7/06 , H04L1/00 , H04W76/27 , H04W72/12
摘要： Embodiments of apparatus and methods for signaling for resource allocation and scheduling in 5G-NR integrated access and backhaul are generally described herein. In some embodiments, User Equipment configured for reporting a channel quality indicator (CQI) index in a channel state information (CSI) reference resource assumes a physical resource block (PRB) bundling size of two PRBs to derive the CQI index.

28. 发明授权

US08983517B2 Method, device, and system for determining timing advance grouping 有权
标题翻译：用于确定定时提前分组的方法，装置和系统
公开(公告)号：US08983517B2
公开(公告)日：2015-03-17
申请号：US13548145
申请日：2012-07-12
申请人： Yi Jiang , Zhongbin Qin , Yinghui Yu , Junren Chang , Mingzeng Dai , Guanglin Han , Wei Quan , Jian Zhang , Qiao Zhang , Yajuan Li , Boyun Xie , Yi Guo , Pingping Xing
发明人： Yi Jiang , Zhongbin Qin , Yinghui Yu , Junren Chang , Mingzeng Dai , Guanglin Han , Wei Quan , Jian Zhang , Qiao Zhang , Yajuan Li , Boyun Xie , Yi Guo , Pingping Xing
IPC分类号： H04B7/00 , H04W56/00 , H04W74/08
CPC分类号： H04W74/085 , H04W56/0005 , H04W56/0045 , H04W72/0446 , H04W74/006 , H04W74/0833 , H04W76/27
摘要： Embodiments of the present invention provide a method, a device, and a system for determining timing advance grouping, and relate to the field of communications. A base station (eNodeB) adds a component carrier (CC) for a user equipment (UE). According to obtained timing advance (TA) group information or a preset rule, a TA group that the added CC belongs to is determined. The TA group is a set of CCs that can share a TA. Identification information that identifies the TA group to the UE is sent.
摘要翻译：本发明的实施例提供了一种用于确定定时提前分组并涉及通信领域的方法，装置和系统。基站（eNodeB）为用户设备（UE）添加分量载波（CC）。根据获得的定时提前（TA）组信息或预设规则，确定所添加的CC所属的TA组。 TA组是一组可以共享TA的CC。发送标识到UE的TA组的标识信息。

29. 发明授权

US08790160B2 Chemical mechanical polishing composition and method for polishing phase change alloys 有权
标题翻译：化学机械抛光组合物和抛光相变合金的方法
公开(公告)号：US08790160B2
公开(公告)日：2014-07-29
申请号：US13096707
申请日：2011-04-28
申请人： Jaeseok Lee , Yi Guo , Kancharla-Arun Kumar Reddy , Guangyun Zhang
发明人： Jaeseok Lee , Yi Guo , Kancharla-Arun Kumar Reddy , Guangyun Zhang
IPC分类号： B24B1/00
CPC分类号： C09K3/1463 , C09G1/02 , H01L45/06 , H01L45/144 , H01L45/1683
摘要： A method for chemical mechanical polishing of a substrate comprising a germanium-antimony-tellurium chalcogenide phase change alloy (GST) using a chemical mechanical polishing composition comprising, as initial components: water; an abrasive; at least one of a phthalic acid, a phthalic anhydride, a phthalate compound and a phthalic acid derivative; a chelating agent; a poly(acrylic acid-co-maleic acid); and an oxidizing agent; wherein the chemical mechanical polishing composition facilitates a high GST removal rate with low defectivity.
摘要翻译：一种使用化学机械抛光组合物的包含锗 - 锑 - 碲硫族化物相变合金（GST）的基板的化学机械抛光的方法，其包含作为初始成分的水; 研磨剂邻苯二甲酸，邻苯二甲酸酐，邻苯二甲酸酯化合物和邻苯二甲酸衍生物中的至少一种; 螯合剂; 聚（丙烯酸 - 共 - 马来酸）; 和氧化剂; 其中化学机械抛光组合物有利于具有低缺陷性的高GST去除速率。

30. 发明授权

US08491808B2 Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride 有权
标题翻译：抛光包括多晶硅，氧化硅和氮化硅的衬底的方法
公开(公告)号：US08491808B2
公开(公告)日：2013-07-23
申请号：US12724685
申请日：2010-03-16
申请人： Yi Guo , Zhendong Liu , Kancharla-Arun Kumar Reddy , Guangyun Zhang
发明人： Yi Guo , Zhendong Liu , Kancharla-Arun Kumar Reddy , Guangyun Zhang
IPC分类号： C03C15/00 , C03C25/68 , H01L21/302 , H01L21/461
CPC分类号： H01L21/31053 , C09G1/02 , C09K3/1463
摘要： A method for chemical mechanical polishing of a substrate is provided, comprising: providing a substrate, wherein the substrate comprises polysilicon, silicon oxide and silicon nitride; providing a chemical mechanical polishing composition, comprising, as initial components: water; an abrasive; an alkyl aryl polyether sulfonate compound, wherein the alkyl aryl polyether sulfonate compound has a hydrophobic portion having an alkyl group bound to an aryl ring and a nonionic acyclic hydrophilic portion having 4 to 100 carbon atoms; and a substance according to formula I wherein each of R1, R2, R3, R4, R5, R6 and R7 is a bridging group having a formula —(CH2)n—, wherein n is an integer selected from 1 to 10; providing a chemical mechanical polishing pad with a polishing surface; moving the polishing surface relative to the substrate; dispensing the chemical mechanical polishing composition onto the polishing surface; and, abrading at least a portion of the substrate to polish the substrate; wherein at least some of the polysilicon is removed from the substrate; and, wherein at least some of the silicon oxide and silicon nitride is removed from the substrate.
摘要翻译：提供了一种用于基板的化学机械抛光的方法，包括：提供基板，其中所述基板包括多晶硅，氧化硅和氮化硅; 提供化学机械抛光组合物，其包含作为初始组分的水; 研磨剂烷基芳基聚醚磺酸盐化合物，其中烷基芳基聚醚磺酸盐化合物具有与芳环结合的烷基的疏水部分和具有4至100个碳原子的非离子非环状亲水部分; 和根据式I的物质，其中R1，R2，R3，R4，R5，R6和R7中的每一个是具有式 - （CH 2）n - 的桥连基团，其中n是选自1至10的整数; 提供具有抛光表面的化学机械抛光垫; 相对于衬底移动抛光表面; 将化学机械抛光组合物分配到抛光表面上; 并且研磨所述衬底的至少一部分以抛光所述衬底; 其中所述多晶硅中的至少一些从所述衬底移除; 并且其中从所述衬底去除所述氧化硅和氮化硅中的至少一些。

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