专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07087117B2 Substrate processing apparatus and substrate processing method 有权
公开(公告)号：US07087117B2
公开(公告)日：2006-08-08
申请号：US10712348
申请日：2003-11-14
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
IPC分类号： B05C5/02 , B23H7/00
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

22. 发明授权

US06824613B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US06824613B2
公开(公告)日：2004-11-30
申请号：US10156791
申请日：2002-05-30
申请人： Naoki Dai , Masaya Seki , Akihiro Yazawa , Toshio Yokoyama , Akira Owatari
发明人： Naoki Dai , Masaya Seki , Akihiro Yazawa , Toshio Yokoyama , Akira Owatari
IPC分类号： B05C1102
CPC分类号： H01L21/67051 , C23C18/1632 , H01L21/67046 , H01L21/67742 , Y10S134/902 , Y10S414/137 , Y10S414/141
摘要： A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.
摘要翻译：基板处理装置可以有效地形成，例如，通过化学镀，在基板的表面上以设备的初始成本低的布线保护层和低的运行成本，而不需要宽的安装空间。基板处理装置包括容纳第一传送机器人的装载/卸载和清洁区域，第一传送机器人具有适于处理干燥基板的手和适于处理湿基板的手，装载容纳基板的基板盒的装载口，以及用于清洁基板的清洁单元。电镀处理区域容纳具有设置有反转机构的背面吸引型手的第二传送机器人，用于在电镀之前进行基板的预处理的预处理单元和用于对电镀处理进行电镀处理的电镀处理单元基质。

23. 发明申请

US20070092658A1 Electroless plating apparatus and electroless plating method 有权
标题翻译：无电镀设备和化学镀方法
公开(公告)号：US20070092658A1
公开(公告)日：2007-04-26
申请号：US11585957
申请日：2006-10-25
申请人： Akira Owatari , Yasuhiko Saijo , Junichiro Tsujino
发明人： Akira Owatari , Yasuhiko Saijo , Junichiro Tsujino
IPC分类号： B05D3/00 , B05D1/18 , B05D3/12 , B05C3/00
CPC分类号： C23C18/1628 , C23C18/1617 , C23C18/1619 , C23C18/32
摘要： An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed by a filter.
摘要翻译：化学镀设备能够以良好的选择性稳定地在嵌入式互连的暴露表面上形成保护膜，从而保护互连。化学镀设备包括用于磁性去除未被过滤器去除的化学镀溶液中的小磁悬浮固体的磁性去除部分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式