专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07536068B2 Micro movable element and optical switching device 失效
标题翻译：微动元件和光开关元件
公开(公告)号：US07536068B2
公开(公告)日：2009-05-19
申请号：US11385657
申请日：2006-03-22
申请人： Hiromitsu Soneda , Xiaoyu Mi , Hisao Okuda , Osamu Tsuboi , Norinao Kouma , Satoshi Ueda
发明人： Hiromitsu Soneda , Xiaoyu Mi , Hisao Okuda , Osamu Tsuboi , Norinao Kouma , Satoshi Ueda
IPC分类号： G02B6/26
CPC分类号： G02B6/357 , G02B6/3518 , G02B6/3556 , G02B6/3584 , Y10S359/90
摘要： A micro movable element includes a micro movable substrate, a package base and an electroconductive connector. The micro movable substrate is provided with a micro movable unit that includes a frame, a pivotally movable portion, a torsion connector connecting the frame and the movable portion, and an actuator to generate driving force for the pivotal motion of the movable portion. The package base includes an internal interconnect structure. The electroconductive connector is provided between the micro movable substrate and the package base for electrically connecting the actuator and the internal interconnect structure to each other.
摘要翻译：微型可移动元件包括微型可移动基板，封装基座和导电连接器。微型可移动基板设置有微型可动单元，其包括框架，可枢转运动部分，连接框架和可移动部分的扭转连接器以及用于产生用于可动部分的枢转运动的驱动力的致动器。封装基座包括内部互连结构。导电连接器设置在微移动基板和封装基座之间，用于将致动器和内部互连结构彼此电连接。

22. 发明申请

US20080218933A1 Movable micro-device 有权
标题翻译：移动微型装置
公开(公告)号：US20080218933A1
公开(公告)日：2008-09-11
申请号：US12071746
申请日：2008-02-26
申请人： Xiaoyu Mi , Takeaki Shimanouchi , Masahiko Imai , Satoshi Ueda
发明人： Xiaoyu Mi , Takeaki Shimanouchi , Masahiko Imai , Satoshi Ueda
IPC分类号： H01G5/011
CPC分类号： H01G5/16 , H01G5/011 , H01G5/06 , H03J3/20
摘要： A micro-device includes a movable part, a frame and a connecting part. The movable part has a main portion, a first capacitor electrode and a first driver electrode. The capacitor electrode and the driver electrode have electrode teeth extending from the main portion. The frame includes second capacitor and driver electrodes, where the second capacitor electrode has electrode teeth extending toward the first capacitor electrode, and the second driver electrode has electrode teeth extending toward the first driver electrode. The connecting part connects the movable part to the frame. The first and second capacitor electrodes have their electrode teeth overlapped in their initial position. The movable part is rotatable for varying the extent of the overlapping between the first and second driver electrodes.
摘要翻译：微型装置包括可移动部件，框架和连接部件。可动部具有主要部分，第一电容电极和第一驱动电极。电容电极和驱动电极具有从主要部分延伸的电极齿。该框架包括第二电容器和驱动电极，其中第二电容器电极具有朝着第一电容器电极延伸的电极齿，并且第二驱动电极具有朝向第一驱动电极延伸的电极齿。连接部将可动部连接到框架。第一和第二电容器电极的电极齿在其初始位置重叠。可移动部分可旋转以改变第一和第二驱动器电极之间的重叠程度。

23. 发明授权

US07031041B2 Micro-oscillating element provided with torsion bar 有权
标题翻译：微振动元件设有扭杆
公开(公告)号：US07031041B2
公开(公告)日：2006-04-18
申请号：US11053880
申请日：2005-02-10
申请人： Xiaoyu Mi , Osamu Tsuboi , Satoshi Ueda , Ippei Sawaki
发明人： Xiaoyu Mi , Osamu Tsuboi , Satoshi Ueda , Ippei Sawaki
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , B81B3/007 , B81B2201/0235 , B81B2201/033 , B81B2201/042 , B81B2203/0109 , B81B2203/0154 , B81B2203/058
摘要： A micro-oscillating element is provided with a frame (113) and a oscillating member (111) connected with the frame (113) via a connector (112). Each connector (112) includes two torsion bars (112a), each torsion bar (112a) being constructed so that the rigidity becomes relatively high toward the frame (113) and relatively low toward the oscillating member (111) by forming a plurality of holes (112b).
摘要翻译：微振动元件设置有经由连接器（112）与框架（113）连接的框架（113）和摆动构件（111）。每个连接器（112）包括两个扭杆（112a），每个扭杆（112a）被构造成使得刚性通过形成多个相对于框架（113）而相对较低朝着摆动构件（111）变得相对较高的孔（112b）。

24. 发明申请

US20060057761A1 Method for fabricating microstructure and microstructure 有权
标题翻译：微结构和微结构的制作方法
公开(公告)号：US20060057761A1
公开(公告)日：2006-03-16
申请号：US11256959
申请日：2005-10-25
申请人： Xiaoyu Mi , Norinao Kouma , Osamu Tsuboi , Masafumi Iwaki , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki
发明人： Xiaoyu Mi , Norinao Kouma , Osamu Tsuboi , Masafumi Iwaki , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki
IPC分类号： H01L21/00
CPC分类号： B81C1/00547 , B81B2201/042 , B81B2203/0136 , B81C2201/0132 , B81C2201/0133 , G01P15/0802 , G02B26/0841
摘要： A method of making a microstructure with thin wall portions (T1-T3) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer (11) and a second conductive layer (12) having a thickness of the thin wall portions (T1-T3), where the etching is performed from the side of the first conductive layer (11) thereby forming in the second conductive layer (12) pre thin wall portions (T1′-T3′) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer (12) and contact the first conductive layer (11). The method also includes a step of performing a second etching process from the side of the first conductive layer (11) for removing part of the first conductive layer (11) contacting the pre thin wall portions (T1′-T3′) to form the thin wall portions.
摘要翻译：制造具有薄壁部分（T 1 -T 3）的微结构的方法包括对具有包括第一导电层（11）和第二导电层（12）的层压结构的材料基板进行第一蚀刻工艺的步骤，具有薄壁部分（T 1 -T 3）的厚度，其中从第一导电层（11）的侧面进行蚀刻，从而在第二导电层（12）中形成预薄壁部分（T 1' -T 3'），其在第二导电层（12）的面内方向上具有彼此分离的一对侧表面，并与第一导电层（11）接触。该方法还包括从第一导电层（11）侧进行第二蚀刻处理以去除与预薄壁部分（T 1'-T 3'）接触的第一导电层（11）的一部分的步骤形成薄壁部分。

25. 发明申请

US20080048816A1 Inductor element and integrated electronic component 有权
标题翻译：电感元件和集成电子元件
公开(公告)号：US20080048816A1
公开(公告)日：2008-02-28
申请号：US11892451
申请日：2007-08-23
申请人： Tsuyoshi Matsumoto , Xiaoyu Mi , Yoshihiro Mizuno
发明人： Tsuyoshi Matsumoto , Xiaoyu Mi , Yoshihiro Mizuno
IPC分类号： H01F5/00
CPC分类号： H01F19/04 , H03H2001/0092
摘要： An inductor element and an integrated electronic component that facilitate achieving a higher Q value are provided. The inductor element includes a substrate, a coil unit spaced from the substrate, and a plurality of conductive columns. The coil unit includes a plurality of spiral coils each constituted of a spiral-shaped coil lead. The spiral coils are disposed such that their winding directions are the same, and that the coil lead of each spiral coil includes a portion extending between the coil lead of at least one of the other spiral coils. End portions of the spiral coils are fixed to the substrate via the conductive columns. The integrated electronic component of the invention includes such inductor element.
摘要翻译：提供了有助于实现更高Q值的电感元件和集成电子元件。电感器元件包括衬底，与衬底间隔开的线圈单元和多个导电柱。线圈单元包括由螺旋形线圈引线构成的多个螺旋线圈。螺旋线圈被布置成使得它们的缠绕方向相同，并且每个螺旋线圈的线圈引线包括在至少一个其它螺旋线圈的线圈引线之间延伸的部分。螺旋线圈的端部通过导电柱固定到基板。本发明的集成电子部件包括这种电感元件。

26. 发明授权

US07508291B2 Inductor element and integrated electronic component 有权
标题翻译：电感元件和集成电子元件
公开(公告)号：US07508291B2
公开(公告)日：2009-03-24
申请号：US11892451
申请日：2007-08-23
申请人： Tsuyoshi Matsumoto , Xiaoyu Mi , Yoshihiro Mizuno
发明人： Tsuyoshi Matsumoto , Xiaoyu Mi , Yoshihiro Mizuno
IPC分类号： H01F5/00
CPC分类号： H01F19/04 , H03H2001/0092
摘要： An inductor element and an integrated electronic component that facilitate achieving a higher Q value are provided. The inductor element includes a substrate, a coil unit spaced from the substrate, and a plurality of conductive columns. The coil unit includes a plurality of spiral coils each constituted of a spiral-shaped coil lead. The spiral coils are disposed such that their winding directions are the same, and that the coil lead of each spiral coil includes a portion extending between the coil lead of at least one of the other spiral coils. End portions of the spiral coils are fixed to the substrate via the conductive columns. The integrated electronic component of the invention includes such inductor element.
摘要翻译：提供了有助于实现更高Q值的电感元件和集成电子元件。电感器元件包括衬底，与衬底间隔开的线圈单元和多个导电柱。线圈单元包括由螺旋形线圈引线构成的多个螺旋线圈。螺旋线圈被布置成使得它们的缠绕方向相同，并且每个螺旋线圈的线圈引线包括在至少一个其它螺旋线圈的线圈引线之间延伸的部分。螺旋线圈的端部通过导电柱固定到基板。本发明的集成电子部件包括这种电感元件。

27. 发明授权

US08766103B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US08766103B2
公开(公告)日：2014-07-01
申请号：US12343784
申请日：2008-12-24
申请人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Tokihiro Nishihara , Satoshi Ueda
发明人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Tokihiro Nishihara , Satoshi Ueda
IPC分类号： H05K1/02
CPC分类号： H05K1/16 , H01L2224/16 , H05K1/0306 , H05K1/113 , H05K3/246 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0195 , H05K2201/0347 , H05K2201/09436
摘要： An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.
摘要翻译：电子部件包括：多层陶瓷基板，其具有形成在其中的穿透电极，并且在其上表面上设置无源元件; 绝缘膜，设置在所述多层陶瓷基板上，并且在所述贯通电极的上方具有开口部; 第一连接端子，设置在绝缘膜上以覆盖开口，并且电连接到穿透电极; 以及第二连接端子，其设置在除了开口区域之外的绝缘膜的区域上。

28. 发明授权

US08209829B2 Method of fabricating the electronic device 有权
标题翻译：制造电子装置的方法
公开(公告)号：US08209829B2
公开(公告)日：2012-07-03
申请号：US12394995
申请日：2009-02-27
申请人： Takeo Takahashi , Xiaoyu Mi , Satoshi Ueda
发明人： Takeo Takahashi , Xiaoyu Mi , Satoshi Ueda
IPC分类号： H01G7/00
CPC分类号： H01G4/06 , H01G13/00 , H01L27/016 , H01L28/10 , H01L28/40 , H05K1/0306 , H05K1/162 , H05K3/4007 , H05K3/4611 , H05K3/4629 , H05K3/4644 , H05K2201/09763 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/49126
摘要： A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.
摘要翻译：一种制造电子器件的方法包括通过印刷，烘烤玻璃层和在玻璃层上形成电容器，在陶瓷基片上选择性地形成玻璃层，电容器包括金属电极和置于金属电极之间的电介质层。

29. 发明授权

US07833430B2 Method for fabricating microstructure and microstructure 有权
标题翻译：微结构和微结构的制作方法
公开(公告)号：US07833430B2
公开(公告)日：2010-11-16
申请号：US11256959
申请日：2005-10-25
申请人： Xiaoyu Mi , Norinao Kouma , Osamu Tsuboi , Masafumi Iwaki , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki
发明人： Xiaoyu Mi , Norinao Kouma , Osamu Tsuboi , Masafumi Iwaki , Hisao Okuda , Hiromitsu Soneda , Satoshi Ueda , Ippei Sawaki
IPC分类号： B44C1/22
CPC分类号： B81C1/00547 , B81B2201/042 , B81B2203/0136 , B81C2201/0132 , B81C2201/0133 , G01P15/0802 , G02B26/0841
摘要： A method of making a microstructure with thin wall portions (T1-T3) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer (11) and a second conductive layer (12) having a thickness of the thin wall portions (T1-T3), where the etching is performed from the side of the first conductive layer (11) thereby forming in the second conductive layer (12) pre thin wall portions (T1′-T3′) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer (12) and contact the first conductive layer (11). The method also includes a step of performing a second etching process from the side of the first conductive layer (11) for removing part of the first conductive layer (11) contacting the pre thin wall portions (T1′-T3′) to form the thin wall portions.
摘要翻译：一种制造具有薄壁部分（T1-T3）的微结构的方法包括对具有包括第一导电层（11）和第二导电层（12）的层压结构的材料基板进行第一蚀刻工艺的步骤，所述第一导电层（11）和第二导电层（12）从第一导电层（11）侧进行蚀刻从而在第二导电层（12）中形成预薄壁部分（T1'-T3'）的薄壁部分（T1-T3）的厚度，具有在第二导电层（12）的面内方向上彼此分开的一对侧表面，并与第一导电层（11）接触。该方法还包括从第一导电层（11）侧进行第二蚀刻处理以去除与预薄壁部分（T1'-T3'）接触的第一导电层（11）的一部分的步骤，以形成薄壁部分。

30. 发明申请

US20090166068A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20090166068A1
公开(公告)日：2009-07-02
申请号：US12343784
申请日：2008-12-24
申请人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Tokihiro Nishihara , Satoshi Ueda
发明人： Takeo Takahashi , Xiaoyu Mi , Tsuyoshi Yokoyama , Tokihiro Nishihara , Satoshi Ueda
IPC分类号： H05K1/00 , H05K1/16
CPC分类号： H05K1/16 , H01L2224/16 , H05K1/0306 , H05K1/113 , H05K3/246 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2201/0195 , H05K2201/0347 , H05K2201/09436
摘要： An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.
摘要翻译：电子部件包括：多层陶瓷基板，其具有形成在其中的穿透电极，并且在其上表面上设置无源元件; 绝缘膜，设置在所述多层陶瓷基板上，并且在所述贯通电极的上方具有开口部; 第一连接端子，设置在绝缘膜上以覆盖开口，并且电连接到穿透电极; 以及第二连接端子，其设置在除了开口区域之外的绝缘膜的区域上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式