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    • 22. 发明申请
    • Ionic based sensing for identifying genomic sequence variations and detecting mismatch base pairs, such as single nucleotide polymorphisms
    • 用于鉴定基因组序列变异和检测错配碱基对(例如单核苷酸多态性)的基于离子的感测
    • US20080197025A1
    • 2008-08-21
    • US11090944
    • 2005-03-25
    • Yanxiu ZhouBin YuKalle Levon
    • Yanxiu ZhouBin YuKalle Levon
    • G01N27/406
    • C12Q1/6825C12Q2600/156G01N27/333C12Q2565/518
    • Ionic interactions are monitored to detect hybridization. The measurement may be done measuring the potential change in the solution with the ion sensitive electrode (which may be the conducting polymer (e.g., polyaniline) itself), without applying any external energy during the binding. The double helix formation during the complimentary hybridization makes this electrode act as an ion selective electrode—the nucleotide hydrogen bonding is specific and thus monitoring the ionic phosphate group addition becomes selective. Polyaniline on the surface of nylon film forms a positively charged polymer film. Thiol linkage can be utilized for polyaniline modification and thiol-modified single strand oligonucleotide chains can be added to polyaniline. The sensitivity is because the double helix formation during the complimentary hybridization makes this electrode act as an ion selective electrode as the nucleotide hydrogen bonding is specific and thus monitoring the ionic phosphate group addition becomes selective.
    • 监测离子相互作用以检测杂交。 测量可以通过离子敏感电极(其可以是导电聚合物(例如聚苯胺)本身))测量溶液中的潜在变化,而在结合期间不施加任何外部能量。 在互补杂交期间的双螺旋形成使得该电极用作离子选择性电极 - 核苷酸氢键是特异性的,因此监测离子性磷酸酯基添加成为选择性的。 尼龙膜表面的聚苯胺形成带正电的聚合物膜。 硫醇连接可用于聚苯胺改性,硫醇改性的单链寡核苷酸链可以加入到聚苯胺中。 敏感性是因为互补杂交期间的双螺旋形成使得该电极作为离子选择性电极,因为核苷酸氢键是特异性的,因此监测离子性磷酸酯基添加成为选择性的。
    • 26. 发明授权
    • Doped structure for FinFET devices
    • FinFET器件的掺杂结构
    • US07196374B1
    • 2007-03-27
    • US10653274
    • 2003-09-03
    • Ming-Ren LinBin Yu
    • Ming-Ren LinBin Yu
    • H01L29/76
    • H01L29/785H01L29/42384H01L29/4908H01L29/66795H01L29/78687
    • A semiconductor device includes a substrate and an insulating layer on the substrate. The semiconductor device also includes a fin structure formed on the insulating layer, where the fin structure includes first and second side surfaces, a dielectric layer formed on the first and second side surfaces of the fin structure, a first gate electrode formed adjacent the dielectric layer on the first side surface of the fin structure, a second gate electrode formed adjacent the dielectric layer on the second side surface of the fin structure, and a doped structure formed on an upper surface of the fin structure in the channel region of the semiconductor device.
    • 半导体器件包括衬底和衬底上的绝缘层。 半导体器件还包括形成在绝缘层上的翅片结构,其中鳍结构包括第一和第二侧表面,形成在鳍结构的第一和第二侧表面上的电介质层,形成在电介质层附近的第一栅电极 在翅片结构的第一侧表面上形成与鳍结构的第二侧表面上的电介质层相邻的第二栅电极,以及在半导体器件的沟道区中形成在鳍结构的上表面上的掺杂结构 。