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21. 发明申请

US20060240140A1 Resin molding apparatus 失效
标题翻译：树脂成型装置
公开(公告)号：US20060240140A1
公开(公告)日：2006-10-26
申请号：US11387842
申请日：2006-03-24
申请人： Toshinobu Banjo , Shigeru Hirata , Masanori Shirasawa
发明人： Toshinobu Banjo , Shigeru Hirata , Masanori Shirasawa
IPC分类号： B29C45/66
CPC分类号： B29C45/1761 , B29C45/1744 , B29C2045/1763
摘要： A resin molding apparatus includes a fixing member to which a top mold is attached, a movable member to which a bottom mold is attached, a push-up member provided below the movable member, a drive mechanism moving the push-up member in upward/downward direction, and a flexible joint provided between the movable member and the push-up member. The push-up force of the drive mechanism is transmitted from the push-up member via the flexible joint to the movable member. Thus, a crack does not occur at a connection portion between the push-up member and the movable member. Therefore, a gap is not created between the top mold and the bottom mold. As a result, an excellent molded product is formed.
摘要翻译：树脂成形装置包括：固定部件，顶模附着到该固定部件，安装有底模的可动部件，设置在可动部件的下方的上推部件，将上推部件向上方移动的驱动机构，以及设置在可动构件和上推构件之间的柔性接头。驱动机构的上推力从上推构件通过柔性接头传递到可动构件。因此，在上推构件和可动构件之间的连接部分处不会发生裂纹。因此，在顶模和底模之间不产生间隙。结果，形成了优异的模制品。

22. 发明授权

US4908178A Method of molding a semiconductor device 失效
标题翻译：模制半导体器件的方法
公开(公告)号：US4908178A
公开(公告)日：1990-03-13
申请号：US296647
申请日：1989-01-11
申请人： Osamu Nakagawa , Koji Yanagitani , Ikuo Sasaki , Toshinobu Banjo
发明人： Osamu Nakagawa , Koji Yanagitani , Ikuo Sasaki , Toshinobu Banjo
IPC分类号： H01L21/56 , B29C45/02 , B29C45/14 , B29C45/26 , B29C45/27 , B29K101/10 , B29L31/34
CPC分类号： B29C45/2701
摘要： A metal mold for plastic molding a semiconductor device by a transfer-molding method with the use of thermo-hardening plastics. The mold includes a pot section into which plastic is injected; a cavity section where a product is formed; a runner section constituting a path for the plastic from the pot section to the cavity section; a gate section provided between the runner section and the cavity section so as to reduce the cross-sectional area for the flow of the plastic which flows therethrough from the runner section to the cavity section; a flow restriction section provided in the path of the runner section so as to reduce the cross-sectional area of the flow of plastic.

23. 发明授权

US4905124A IC card 失效
标题翻译： IC卡
公开(公告)号：US4905124A
公开(公告)日：1990-02-27
申请号：US174955
申请日：1988-03-29
申请人： Toshinobu Banjo , Shigeo Onoda , Makoto Omori
发明人： Toshinobu Banjo , Shigeo Onoda , Makoto Omori
IPC分类号： B42D15/10 , G06K19/077 , G11C5/00 , H05K1/11 , H05K1/14 , H05K3/36
CPC分类号： H05K1/117 , G06K19/07743 , H05K1/141 , H05K2201/049 , H05K3/368
摘要： An IC card having a circuit board provided with wiring formed on at least one of two surfaces of the circuit board, a terminal base fixed to one surface of a front portion of the circuit board and having a multiplicity of electrode terminals disposed on its upper surface, a plurality of electronic parts mounted on the two surfaces of the circuit board, and a package in which the circuit board on which the electronic parts are mounted is incorporated while exposing the electrode terminals to the outside of the package.
摘要翻译：一种IC卡，其具有电路板，该电路板设置有形成在所述电路板的两个表面中的至少一个表面上的布线，固定在所述电路板的前部的一个表面上并具有多个电极端子的端子基座，，安装在电路板的两个表面上的多个电子部件和其中安装有电子部件的电路板的封装，同时将电极端子暴露于封装的外部。

24. 发明授权

US4890197A Memory card housing 失效
标题翻译：存储卡外壳
公开(公告)号：US4890197A
公开(公告)日：1989-12-26
申请号：US175212
申请日：1988-03-30
申请人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
发明人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
IPC分类号： B42D15/10 , G06K19/077 , G11C5/00 , H05K5/02
CPC分类号： H05K5/0269 , G06K19/077
摘要： A memory card comprises a plastic outer package which houses a semiconductor device and an electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. At least one of the connecting surface of each pair of adjoining package sections has an overflow groove for bonding agent formed therein which prevents the bonding agent from being forced to the outside of the outer package when the package sections are bonded together.
摘要翻译：存储卡包括容纳半导体器件和电连接器的塑料外包装。外包装包括多个包装部分，这些包装部分彼此堆叠并且沿着形成在包装部分的外周上的连接表面粘合在一起。每对相邻包装部分的连接表面中的至少一个具有用于在其中形成的粘合剂的溢流槽，当封装部分结合在一起时，防止粘合剂被迫到外部包装的外部。

25. 发明授权

US4878610A Die bonding apparatus 失效
标题翻译：焊接装置
公开(公告)号：US4878610A
公开(公告)日：1989-11-07
申请号：US307512
申请日：1989-02-08
申请人： Ryuichiro Mori , Syuichi Osaka , Toshinobu Banjo
发明人： Ryuichiro Mori , Syuichi Osaka , Toshinobu Banjo
IPC分类号： H01L21/52 , H01L21/00
CPC分类号： H01L21/67144
摘要： A die bonding apparatus includes a stocker for temporarily accommodating dice, a first conveying device for successively picking up a plurality of dice from one wafer and conveying them to the stocker, a wafer loader/unloader for replacing the wafer from which the dice have been picked up with a new one, a bonding station for bonding a die to a work which serves as a die mounting medium, a work loader for supplying works to the bonding station, and a second conveying device for successively conveying the dice accommodated in the stocker to the bonding station.
摘要翻译：芯片接合装置包括用于临时容纳骰子的储料器，用于从一个晶片连续地拾取多个骰子并将其传送到储料器的第一输送装置，用于替换骰子已被拣选的晶片的晶片装载/卸载器用于将模具粘合到用作模具安装介质的工件上的粘结站，用于向粘合站供应工件的工作装载器和用于将容纳在储料器中的骰子依次传送到第二输送装置的第二输送装置粘接站。

26. 发明授权

US4839713A Package structure for semiconductor device 失效
标题翻译：半导体器件的封装结构
公开(公告)号：US4839713A
公开(公告)日：1989-06-13
申请号：US156571
申请日：1988-02-17
申请人： Yasuhiro Teraoka , Tetsuya Ueda , Hideya Yagoura , Haruo Shimamoto , Shigeyuki Nango , Toshinobu Banjo , Hiroshi Seki
发明人： Yasuhiro Teraoka , Tetsuya Ueda , Hideya Yagoura , Haruo Shimamoto , Shigeyuki Nango , Toshinobu Banjo , Hiroshi Seki
IPC分类号： H01L23/057 , H01L23/24 , H01L23/31 , H01L23/495
CPC分类号： H01L24/50 , H01L23/057 , H01L23/24 , H01L23/3121 , H01L23/49572 , H01L2924/01005 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082
摘要： A package structure comprising a metallic cap having a bottom wall to which the bottom surface of the semiconductor chip is electrically and mechanically connected, a side wall extending from said bottom wall and surrounding the semiconductor chip, and a flange extending outwardly from said side wall substantially parallel to said bottom wall, said flange supporting the lead conductors thereon through an electrically insulating material. The electrical connection means is disposed between the metallic cap flange and the lead conductor for establishing an electrical connection therebetween. The electrical connection means may comprise an electrically conductive projection formed on the flange of the metal cap, extending through a notch in the insulating material and electrically connected to the lead conductor. The electrical connection means may be an electrically conductive bonding material filled within a cavity defined by an opening in the flange of the metal cap, a through hole in the insulating material and a connecting pad of the lead conductor.
摘要翻译：一种包装结构，包括具有底壁的金属盖，半导体芯片的底表面电气和机械连接到该底壁，从所述底壁延伸并围绕半导体芯片的侧壁，以及从所述侧壁向外延伸的凸缘，平行于所述底壁，所述凸缘通过电绝缘材料在其上支撑引线导体。电连接装置设置在金属帽凸缘和引线导体之间，用于在它们之间建立电连接。电连接装置可以包括形成在金属帽的凸缘上的导电突起，延伸穿过绝缘材料中的凹口并电连接到引线导体。电连接装置可以是填充在由金属盖的凸缘中的开口，绝缘材料中的通孔和引线导体的连接焊盘限定的空腔内的导电接合材料。

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