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21. 发明申请

US20090279740A1 DISTANCE MEASURING DEVICE AND METHOD, AND COMPUTER PROGRAM 有权
标题翻译：距离测量设备和方法，以及计算机程序
公开(公告)号：US20090279740A1
公开(公告)日：2009-11-12
申请号：US12440650
申请日：2006-09-13
申请人： Osamu Yamazaki
发明人： Osamu Yamazaki
IPC分类号： G06K9/00
CPC分类号： G01B11/024 , G01C3/10
摘要： A distance measuring device (1) is included of a feature point detecting element (31) for detecting a set of feature points from a plurality of images (2) picked up at a plurality of places (a, b) by a pickup element, a change detecting element (33) for detecting relative changes among images with respect to the detected set of the feature points, and a first specifying element (8) for specifying rotation quantities of the image pickup element among the places in accordance with the detected changes. Here, the feature point detecting element detects a set of points (P1, P2, P3, P4) composing lines (310, 320) that belong to a stationary object and that are substantially perpendicular to the optical axis of the image pickup element as a set of feature points.
摘要翻译：特征点检测元件（31）包括测距装置（1），用于检测由拾取元件在多个位置（a，b）拾取的多个图像（2）中的一组特征点，用于检测相对于检测到的特征点集合的图像之间的相对变化的变化检测元件（33），以及用于根据检测到的变化来指定各个位置中的图像拾取元件的旋转量的第一指定元件（8）。这里，特征点检测元件检测构成属于静止物体并且基本上垂直于图像拾取元件的光轴的线（P1，P2，P3，P4）的一组点（P1，P2，P3，P4）一组特征点。

22. 发明申请

US20090075429A1 Sheet-Like Underfill Material and Semiconductor Device Manufacturing Method 审中-公开
标题翻译：片状底部填充材料和半导体器件制造方法
公开(公告)号：US20090075429A1
公开(公告)日：2009-03-19
申请号：US11912825
申请日：2006-04-19
申请人： Akinori Sato , Osamu Yamazaki , Kazuhiro Takahashi
发明人： Akinori Sato , Osamu Yamazaki , Kazuhiro Takahashi
IPC分类号： H01L21/50 , B32B7/12
CPC分类号： H01L23/293 , H01L21/563 , H01L21/6835 , H01L24/12 , H01L24/27 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16 , H01L2224/274 , H01L2224/27436 , H01L2224/73104 , H01L2224/81191 , H01L2224/83191 , H01L2924/00013 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/351 , Y10T428/2839 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： A sheet-like underfill material includes a base and adhesive layer provided peelably on the base for use in a flip chip mounting process in the manufacture of a semiconductor device. The process includes laminating a sheet-like underfill material onto a circuit face of a semiconductor wafer having bumps on its circuit face and, simultaneously, allowing the bumps to pierce the adhesive layer and allowing the tops of the bumps to penetrate the base. The base has a storage elastic modulus of 1.0×106 Pa to 4.0×109 Pa, a breaking stress of 1.0×105 Pa to 2.0×108 Pa, and a Young's modulus of 1.0×107 Pa to 1.1×1010 Pa. The adhesive layer has a storage elastic modulus of 1.0×104 Pa to 1.0×107 Pa and a breaking stress of 1.0×103 Pa to 3.0×107 Pa.
摘要翻译：片状底部填充材料包括可剥离地设置在基底上的基底和粘合剂层，以用于制造半导体器件的倒装芯片安装工艺。该方法包括将片状底部填充材料层叠在其电路面上具有凸块的半导体晶片的电路面上，同时允许凸块穿透粘合剂层并允许凸块的顶部穿透基部。该基材的储能弹性模量为1.0×10 6 Pa〜4.0×10 9 Pa，断裂应力为1.0×10 5 Pa〜2.0×10 8 Pa，杨氏模量为1.0×10 7 Pa〜1.1×10 10 Pa，粘合层的储能弹性模量 1.0×10 4 Pa〜1.0×10 7 Pa，断裂应力为1.0×10 3 Pa〜3.0×10 7 Pa。

23. 发明申请

US20080160782A1 Method for forming insulating film 审中-公开
标题翻译：绝缘膜的形成方法
公开(公告)号：US20080160782A1
公开(公告)日：2008-07-03
申请号：US12003464
申请日：2007-12-26
申请人： Osamu Yamazaki , Takahiro Kotabe
发明人： Osamu Yamazaki , Takahiro Kotabe
IPC分类号： H01L21/31
CPC分类号： H01L21/31633 , H01L21/02126 , H01L21/02211 , H01L21/02274 , H01L21/02304 , H01L21/02337 , H01L21/0234 , H01L21/02348 , H01L21/02362 , H01L21/3105 , H01L21/3148 , H01L21/76801 , H01L21/76802 , H01L21/76826 , H01L21/76829 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A method of forming an insulating film for enhancing the film and removing water and OH groups from the film efficiently. The method comprises steps of forming a second low dielectric constant insulating film having a thickness smaller than a desired thickness in a predetermined material gas atmosphere, carrying out O2 gas treatment at the same substrate temperature and pressure as those in the step of forming the second low dielectric constant insulating film, carrying out residual unreacted material removal, uncombined bonds termination, or absorbed OH group removal, without air exposure, and forming a second cap insulating film. The steps of forming the second low dielectric constant insulating film, carrying out processes such as the residual unreacted material removal, and forming the second cap insulating film are repeated until a total thickness of the second low dielectric constant insulating film and the second cap insulating film reaches a desired level.
摘要翻译：形成用于增强膜并从膜中有效去除水和OH基的绝缘膜的方法。该方法包括以下步骤：在预定的原料气体气氛中形成厚度小于期望厚度的第二低介电常数绝缘膜，在相同的基板温度和压力下进行O 2气体处理在形成第二低介电常数绝缘膜的步骤中，在没有空气暴露的情况下进行残留的未反应材料去除，未结合的键合或吸收的OH基团去除，并形成第二帽绝缘膜。重复形成第二低介电常数绝缘膜，进行残留的未反应材料除去等工序，形成第二帽绝缘膜的工序，直到第二低介电常数绝缘膜和第二帽绝缘膜的总厚度达到所需的水平。

24. 发明申请

US20070229460A1 Pointing device, and method of displaying remaining battery power thereof 审中-公开
标题翻译：指示装置以及显示剩余电池电力的方法
公开(公告)号：US20070229460A1
公开(公告)日：2007-10-04
申请号：US11730076
申请日：2007-03-29
申请人： Osamu Yamazaki , Hidekazu Aizawa
发明人： Osamu Yamazaki , Hidekazu Aizawa
IPC分类号： G09G5/08
CPC分类号： G06F3/03543 , G06F3/0383
摘要： According to one embodiment, a wireless device includes an optical motion detector, battery lifetime display unit, battery, communication unit, communication signal emitting opening, and mouse button unit. The optical motion detector includes a CPU, RAM, ROM, and optical unit. The optical unit has a light emitting unit configured to emit light from an opening toward a plate or desktop upon which the wireless device is placed, a lens for collecting the light reflected therefrom, and a CMOS image sensor for receiving the collected light and detecting patterns on the plate or desktop. The battery lifetime display unit includes the CPU, RAM, ROM, light emitting unit, and a voltage detection circuit. The battery lifetime display unit allows the user to know whether the battery thereof has reached its lifetime, that is to say, whether the voltage of the battery has dropped so low that the wireless device cannot function.
摘要翻译：根据一个实施例，无线设备包括光学运动检测器，电池寿命显示单元，电池，通信单元，通信信号发射开口和鼠标按钮单元。光学运动检测器包括CPU，RAM，ROM和光学单元。光学单元具有发光单元，该发光单元被配置为将光从开口发射到放置无线设备的板或桌面，用于收集从其反射的光的透镜，以及用于接收所收集的光和检测图案的CMOS图像传感器在盘子或桌面上。电池寿命显示单元包括CPU，RAM，ROM，发光单元和电压检测电路。电池寿命显示单元允许用户知道其电池是否已经达到其寿命，也就是说，电池的电压是否已经下降到无线设备不能起作用。

25. 发明授权

US07169648B2 Process for producing a semiconductor device 有权
标题翻译：半导体装置的制造方法
公开(公告)号：US07169648B2
公开(公告)日：2007-01-30
申请号：US10916177
申请日：2004-08-11
申请人： Akinori Sato , Osamu Yamazaki , Hideo Senoo , Takashi Sugino
发明人： Akinori Sato , Osamu Yamazaki , Hideo Senoo , Takashi Sugino
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/90 , H01L2221/68327 , H01L2221/6834 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/29099
摘要： A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and (f) firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.
摘要翻译：一种制造具有高可靠性的树脂密封半导体器件的方法，该半导体器件更容易且高效地生产而没有空隙，该方法包括以下步骤：（a）提供在表面上具有电路的半导体晶片; （b）在半导体晶片的电路表面上涂敷由支撑体构成的树脂片和可从支持体剥离的粘合树脂层，并用环形框固定树脂片的外周; （c）通过每个电路切割半导体晶片和树脂层以形成芯片; （d）从树脂层与支撑体一起拾取每个芯片; （e）通过树脂层将每个芯片安装在芯片安装基板的预定位置上; 和（f）将芯片牢固地接合在芯片安装基板上，以实现芯片和芯片安装基板之间的导通。

26. 发明授权

US07046698B1 Communicating apparatus and communicating method 失效
标题翻译：通讯装置及通讯方式
公开(公告)号：US07046698B1
公开(公告)日：2006-05-16
申请号：US09658877
申请日：2000-09-08
申请人： Manabu Nohara , Takehiko Shioda , Katsunori Arakawa , Osamu Yamazaki , Masami Suzuki , Yasuteru Kodama , Masahiro Okamura , Takayuki Akimoto , Hiroto Inoue
发明人： Manabu Nohara , Takehiko Shioda , Katsunori Arakawa , Osamu Yamazaki , Masami Suzuki , Yasuteru Kodama , Masahiro Okamura , Takayuki Akimoto , Hiroto Inoue
IPC分类号： H04J3/06
CPC分类号： H04W56/0085 , H04B7/2662
摘要： A communicating apparatus performs an asynchronous communication with a base station. The communicating apparatus is provided with: a receiving device for receiving a down link signal, which is transmitted from the base station and in which a division signal is inserted for each of constant time intervals; a detecting device for detecting division signals out of the received down link signal, in phase to the constant time intervals; an adding device for adding the detected division signals over a predetermined time duration, which is longer than the constant time interval, with matching phases for each of the constant time intervals, so as to generate accumulated additional values; and a memory device for storing the accumulated additional values generated by the adding device, to thereby perform synchronization capturing with the base station on the basis of the accumulated additional values added over the predetermined time duration and stored in the memory device.
摘要翻译：通信装置与基站进行异步通信。通信装置具有：接收装置，用于接收从基站发送的下行链路信号，并且对于每个恒定时间间隔插入分频信号; 检测装置，用于相对于所述恒定时间间隔检测所接收的下行链路信号中的分频信号; 一个加法装置，用于在比常数时间间隔长的预定持续时间内对每个恒定时间间隔的匹配相位增加检测到的除法信号，以产生累加的附加值; 以及存储装置，用于存储由加法装置产生的积累的附加值，从而基于在预定持续时间内添加并存储在存储装置中的累积附加值，与基站执行同步捕获。

27. 发明授权

US06900550B2 Semiconductor device including adhesive agent layer with embedded conductor bodies 有权
标题翻译：半导体器件包括具有嵌入导体的粘合剂层
公开(公告)号：US06900550B2
公开(公告)日：2005-05-31
申请号：US10463409
申请日：2003-06-18
申请人： Osamu Yamazaki , Kazuyoshi Ebe
发明人： Osamu Yamazaki , Kazuyoshi Ebe
IPC分类号： C09J7/02 , C09J9/02 , C09J133/06 , C09J163/00 , H01L21/56 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/10 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/6835 , C09J7/20 , C09J2201/28 , C09J2203/326 , H01L21/561 , H01L21/563 , H01L21/6836 , H01L23/10 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H01L2221/68327 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/13099 , H01L2224/16225 , H01L2224/274 , H01L2224/29111 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/83191 , H01L2224/8385 , H01L2224/83851 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15787 , Y10T156/1052 , Y10T156/1062 , H01L2224/73203 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/3512 , H01L2224/13111 , H01L2924/00012 , H01L2224/2919 , H01L2924/00014
摘要： A semiconductor integrated circuit is adhered to the substrate and includes semiconductor integrated circuit electrodes. A hardened adhesive agent layer is formed from an adhesive agent with gradable adhesiveness and has conductor bodies buried therein. The adhesive agent includes a (meth)acrylate copolymer having a weight-average molecular weight of not less than 30,000, an epoxy resin having a weight-average molecular weight of 100 to 10,000, a photopolymerizable low molecular compound and thermal activation latent epoxy resin curing agent. The conductor bodies are connected with the semiconductor integrated circuit electrodes, and the adhesive agent layer is aligned with the substrate so that the conductor bodies buried in the adhesive agent layer and the substrate electrodes are electrically connected.
摘要翻译：半导体集成电路粘附到基板并且包括半导体集成电路电极。硬化的粘合剂层由具有可分级粘合性的粘合剂形成，并且其中埋设有导体体。粘合剂包括重均分子量不小于30,000的（甲基）丙烯酸酯共聚物，重均分子量为100至10,000的环氧树脂，可光聚合的低分子化合物和热活化潜在环氧树脂固化代理商导体体与半导体集成电路电极连接，粘合剂层与衬底对准，使得埋在粘合剂层和衬底电极中的导体体电连接。

28. 发明授权

US06608235B1 Method of reducing epoxidized organic compound with hydrogen 失效
标题翻译：用氢还原环氧化有机化合物的方法
公开(公告)号：US06608235B1
公开(公告)日：2003-08-19
申请号：US09830465
申请日：2001-08-06
申请人： Nobuyuki Kuroda , Tokuo Matsuzaki , Mitsuo Yamanaka , Takato Nakamura , Osamu Yamazaki , Hirofumi Takemoto
发明人： Nobuyuki Kuroda , Tokuo Matsuzaki , Mitsuo Yamanaka , Takato Nakamura , Osamu Yamazaki , Hirofumi Takemoto
IPC分类号： C07C29132
CPC分类号： B01J31/403 , B01J23/755 , B01J23/78 , B01J25/02 , B01J31/0237 , B01J35/10 , B01J35/1014 , B01J35/1019 , B01J37/031 , B01J37/18 , B01J2231/641 , C07C29/132 , C07C45/58 , C07C2601/14 , C07C2601/18 , C07C2601/20 , Y02P20/584 , C07C35/205 , C07C35/20 , C07C35/08 , C07C49/413
摘要： In reduction of an epoxy group-containing organic compound, for example, a C5-C20 saturated or unsaturated epoxy cycloaliphatic compound, in the presence of a nickel catalyst, by bringing the compound into contact with hydrogen, the target compound can be produced at a high yield by adding a basic substance (for example, an alkali metal hydroxide, an alkali metal carbonate, an alkali metal alkoxide, and an amine compound having 1 to 3 C1-C12 alkyl groups), to the reduction reaction system, to thereby restrict production of by-products due to a side deoxidation reaction.
摘要翻译：在通过使化合物与氢接触的情况下，在镍催化剂的存在下还原含环氧基的有机化合物，例如C5-C20饱和或不饱和环氧脂环族化合物，可以在通过向还原反应体系中添加碱性物质（例如碱金属氢氧化物，碱金属碳酸盐，碱金属醇盐，具有1〜3个碳原子数为1〜12的烷基的胺化合物）的高收率，从而限制由于侧面脱氧反应而产生副产物。

29. 发明授权

US06546258B1 Communication apparatus and communication method 失效
标题翻译：通信设备和通信方法
公开(公告)号：US06546258B1
公开(公告)日：2003-04-08
申请号：US09639888
申请日：2000-08-17
申请人： Manabu Nohara , Yasuteru Kodama , Masami Suzuki , Masahiro Okamura , Takayuki Akimoto , Osamu Yamazaki , Takehiko Shioda
发明人： Manabu Nohara , Yasuteru Kodama , Masami Suzuki , Masahiro Okamura , Takayuki Akimoto , Osamu Yamazaki , Takehiko Shioda
IPC分类号： H04B1500
CPC分类号： H04W48/20
摘要： A communication apparatus for communicating with one base station among a plurality of base stations is provided with a present position detecting device for detecting a present position of the communication apparatus and outputting present position information indicative of the detected present position. The communication apparatus is also provided with an identification information obtaining device for obtaining identification information of respective one of the base stations on the basis of the present position information outputted by the present position detecting device. The communication apparatus is further provided with a specifying device for specifying said one base station on the basis of the identification information obtained by the identification information obtaining device.
摘要翻译：在多个基站中与一个基站通信的通信装置设置有用于检测通信装置的当前位置并输出表示检测到的当前位置的当前位置信息的当前位置检测装置。通信装置还具有识别信息获取装置，用于根据当前位置检测装置输出的当前位置信息获得各个基站的识别信息。该通信装置还具有根据由识别信息获取装置获得的识别信息来指定所述一个基站的指定装置。

30. 发明授权

US06402011B1 Reflow method and reflow device 失效
标题翻译：回流方式和回流装置
公开(公告)号：US06402011B1
公开(公告)日：2002-06-11
申请号：US09633293
申请日：2000-08-04
申请人： Masahiro Taniguchi , Kazumi Ishimoto , Koichi Nagai , Osamu Yamazaki , Tatsuaki Kitagawa , Osamu Matsushima , Kazuhiro Uji , Seizo Nemoto
发明人： Masahiro Taniguchi , Kazumi Ishimoto , Koichi Nagai , Osamu Yamazaki , Tatsuaki Kitagawa , Osamu Matsushima , Kazuhiro Uji , Seizo Nemoto
IPC分类号： B23K3102
CPC分类号： B23K3/085 , B23K1/008 , B23K2101/42 , H05K3/3415 , H05K3/3447 , H05K3/3494 , H05K2203/087 , H05K2203/304
摘要： For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.
摘要翻译：对于回流焊接，辐射加热被施加到印刷电路板的放置电子部件的一个表面上，并且在其上供应奶油焊膏，并且同时热空气局部地被吹送并大致垂直于待连接点所述印刷电路板的一个表面。这种回流方法即使热空气被设定在不超过电子部件的耐热性的温度下，由于与辐射热的组合，所以能够进行安全的焊接。此外，这种回流方法可以以这样的方式允许焊接，即只有待连接点被选择性地加热，因为热空气局部地吹动并且大致垂直于要连接的点。因此，这种回流方法可防止对待连接点的其他部分的热损伤，并确保待连接点处的焊料熔化。

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