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21. 发明授权

US08510937B2 Component mounting apparatus and substrate conveyance method in component mounting apparatus 有权
标题翻译：零件安装装置和元件安装装置中的基板输送方法
公开(公告)号：US08510937B2
公开(公告)日：2013-08-20
申请号：US13511789
申请日：2010-11-29
申请人： Takeyuki Kawase , Yoshiyuki Kitagawa , Shuzo Yagi
发明人： Takeyuki Kawase , Yoshiyuki Kitagawa , Shuzo Yagi
IPC分类号： H05K13/04
CPC分类号： H05K13/0061 , H05K13/0452 , Y10T29/4913 , Y10T29/53174 , Y10T29/53265
摘要： An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (10B, 10C) which are farther from the component supplying units (20A, 20B), when the substrate request signal R is output for a conveyor (10D) which is closer to the component supplying unit (20b) prior to start of a transferring work of the new substrate (13), the new substrate (13) is carried into the conveyor (10D). Therefore, a substrate can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.
摘要翻译：本发明的目的是提供一种组件安装装置，其包括多个基板输送通道，并有效地控制基板的承载顺序，从而能够提高生产率，并且还提供一种基板输送方法安装装置。一种构造，其特征在于，包括：平行布置的包括输送机（10A，10B，10C，10D）的输送线横向的部件供给单元（20A，20B）以及基板分配单元（M3B），其被配置为在从所述元件供给单元（d）的输送器（10B，10C）输出基板请求信号（R）的情况下，分配从上游装置输送的基板（13）如图20A，20B所示，当在新的基板（13）的转印工作开始之前，对于靠近元件供给单元（20b）的输送机（10D）输出基板请求信号R时，新的基板）被输送到输送机（10D）中。因此，可以将基板优先地携带到在组件安装效率方面更有利的输送机中。

22. 发明申请

US20120272511A1 COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COMPONENT MOUNTING APPARATUS 有权
标题翻译：组件安装设备中的组件安装和底板输送方法
公开(公告)号：US20120272511A1
公开(公告)日：2012-11-01
申请号：US13511774
申请日：2010-11-29
申请人： Takeyuki Kawase , Yoshiyuki Kitagawa , Shuzo Yagi
发明人： Takeyuki Kawase , Yoshiyuki Kitagawa , Shuzo Yagi
IPC分类号： H05K13/02
CPC分类号： H05K13/0452 , H05K13/0061 , Y10T29/49002 , Y10T29/4913 , Y10T29/5137 , Y10T29/53052 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate (13) is carried in from the substrate distributing unit (M3B) into conveyors (10A, 10D) which are closest to the component supplying units (20A, 20B) among the conveyors (10A, 10B, 10C, 10D). Therefore, substrates can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.
摘要翻译：本发明的目的是提供一种组件安装装置，其包括多个基板输送通道，并有效地控制基板的承载顺序，从而能够提高生产率，并且还提供一种基板输送方法安装装置。一种构造，其特征在于，包括：平行布置的包括输送机（10A，10B，10C，10D）的输送线横向的部件供给单元（20A，20B）以及在从多个输送机输出基板请求信号（R）的情况下，配置成分配从上游装置输送的基板）的基板分配单元（M3B），新的基板（13）从所述基板分配单元（M3B）输送到输送机（10A，10B，10C，10D）中最靠近所述部件供应单元（20A，20B）的输送器（10A，10D）中。因此，可以将基板优先地携带到在组件安装效率方面更有利的输送机中。

23. 发明授权

US08136219B2 Electronic component mounter and mounting method 有权
标题翻译：电子元件安装器和安装方法
公开(公告)号：US08136219B2
公开(公告)日：2012-03-20
申请号：US11915982
申请日：2006-07-31
申请人： Tadashi Endo , Akira Noudo , Takeyuki Kawase , Osamu Okuda , Hiroshi Ogata
发明人： Tadashi Endo , Akira Noudo , Takeyuki Kawase , Osamu Okuda , Hiroshi Ogata
IPC分类号： H05K13/04
CPC分类号： H05K13/04 , Y10T29/49004 , Y10T29/49131 , Y10T29/53174 , Y10T29/53191
摘要： A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
摘要翻译：能够以高精度和高效率检测由喷嘴吸引和保持的电子部件的高度的方法是应用于具有转印头（8）的安装器（100）的部件高度测量方法，吸入保持喷嘴（21），用于传送部件P并将部件P安装到板（3）上，并且包括：将部件P降低到第一线传感器（13）的高精度范围内测量部件P的高度; 并使用第一线传感器（13）测量部件P的高度。

24. 发明申请

US20090300908A1 ELECTRONIC COMPONENT MOUNTER AND MOUNTING METHOD 有权
标题翻译：电子元件安装和安装方法
公开(公告)号：US20090300908A1
公开(公告)日：2009-12-10
申请号：US11915982
申请日：2006-07-31
申请人： Tadashi Endo , Akira Noudo , Takeyuki Kawase , Osamu Okuda , Hiroshi Ogata
发明人： Tadashi Endo , Akira Noudo , Takeyuki Kawase , Osamu Okuda , Hiroshi Ogata
IPC分类号： B23P19/00
CPC分类号： H05K13/04 , Y10T29/49004 , Y10T29/49131 , Y10T29/53174 , Y10T29/53191
摘要： It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency.This method is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
摘要翻译：本发明的目的是提供一种能够以高精度和高效率检测由喷嘴吸住并保持的电子部件的高度的方法。该方法是应用于配备有具有分量吸持喷嘴（21）的转印头（8）的安装器（100）的部件高度测量方法，用于传送部件P并将部件P安装到板上（3），并且包括：将部件P降低到用于测量部件P的高度的第一线传感器（13）的高精度范围内; 并使用第一线传感器（13）测量部件P的高度。

25. 发明授权

US08595920B2 Component mounting device in which a device type changing operation is performed in one mounting lane without stopping another mounting lane 有权
标题翻译：在一个安装车道中执行装置类型改变操作而不停止另一安装车道的部件安装装置
公开(公告)号：US08595920B2
公开(公告)日：2013-12-03
申请号：US13578382
申请日：2011-11-25
申请人： Satoshi Yamauchi , Takeyuki Kawase
发明人： Satoshi Yamauchi , Takeyuki Kawase
IPC分类号： H05K13/04
CPC分类号： H05K13/0452 , H05K13/085 , Y10T29/49133 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178
摘要： In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a “file operation” (35e) which are displayed by selecting a “device type changing” (33c) which is displayed in an operation screen (30) on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch (36) is prohibited so that a second mounting lane (L2) which is producing will not become an object of the inputting of operations.
摘要翻译：在通过选择显示在操作画面（33c）中显示的“文件操作”（35e）等操作操作开关进行操作的操作执行步骤中， 30）在操作面板上，当除了操作对象之外的非物体安装通道执行操作动作时，允许用操作开关输入操作，并且禁止用车道指定开关（36）进行的操作的输入正在生产的第二安装通道（L2）将不会成为操作输入的对象。

26. 发明申请

US20130247369A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US20130247369A1
公开(公告)日：2013-09-26
申请号：US13992090
申请日：2011-12-07
申请人： Takeyuki Kawase , Kazuhiko Itose
发明人： Takeyuki Kawase , Kazuhiko Itose
IPC分类号： H05K13/04
CPC分类号： H05K13/04 , H05K13/0452 , H05K13/085 , Y10T29/4913 , Y10T29/53174
摘要： An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the electronic component mounting apparatus (M5*) equipped with a tray feeder (30) is brought into the second operation mode.
摘要翻译：通过将多个具有第一安装通道（L1）和第二安装通道（L2）的电子部件安装装置（M2）连接到（M5 *）而构成的电子部件安装系统被构造成能够执行从使一个操作性能机构的第一操作模式中选择的任何一个执行操作性能，同时仅将作为对应于操作性能机构的基板传送机构的基板作为目标，并且其中一个操作性能机构可以在将由多个基板输送机构输送的多个基板全部作为目标的同时进行操作性能，并且只有配备有托盘进给器（30）的电子部件安装装置（M5 *）进入第二操作模式。

27. 发明申请

US20120311854A1 COMPONENT MOUNTING DEVICE AND A DEVICE TYPE CHANGING METHOD IN THE COMPONENT MOUNTING DEVICE 有权
标题翻译：组件安装设备和组件安装设备中的设备类型更改方法
公开(公告)号：US20120311854A1
公开(公告)日：2012-12-13
申请号：US13578382
申请日：2011-11-25
申请人： Satoshi Yamauchi , Takeyuki Kawase
发明人： Satoshi Yamauchi , Takeyuki Kawase
IPC分类号： H05K13/04
CPC分类号： H05K13/0452 , H05K13/085 , Y10T29/49133 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178
摘要： In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a “file operation” (35e) which are displayed by selecting a “device type changing” (33c) which is displayed in an operation screen (30) on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch (36) is prohibited so that a second mounting lane (L2) which is producing will not become an object of the inputting of operations.
摘要翻译：在通过选择在操作画面（30）中显示的设备类型改变（33c）而显示的文件操作（35e）等操作操作开关（35e）进行与设备类型相关联的操作的操作的操作执行步骤中，操作面板，当除了操作对象之外的非物体安装通道执行操作动作时，允许用操作开关输入操作，并且禁止用车道指定开关（36）进行的操作的输入，使得第二安装生产线（L2）不会成为操作输入的对象。

28. 发明申请

US20120285012A1 COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COMPONENT MOUNTING APPARATUS 有权
标题翻译：组件安装设备中的组件安装和底板输送方法
公开(公告)号：US20120285012A1
公开(公告)日：2012-11-15
申请号：US13511789
申请日：2010-11-29
申请人： Takeyuki Kawase , Yoshiyuki Kitagawa , Shuzo Yagi
发明人： Takeyuki Kawase , Yoshiyuki Kitagawa , Shuzo Yagi
IPC分类号： H05K3/30
CPC分类号： H05K13/0061 , H05K13/0452 , Y10T29/4913 , Y10T29/53174 , Y10T29/53265
摘要： An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (10B, 10C) which are farther from the component supplying units (20A, 20B), when the substrate request signal R is output for a conveyor (10D) which is closer to the component supplying unit (20b) prior to start of a transferring work of the new substrate (13), the new substrate (13) is carried into the conveyor (10D). Therefore, a substrate can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.
摘要翻译：本发明的目的是提供一种组件安装装置，其包括多个基板输送通道，并有效地控制基板的承载顺序，从而能够提高生产率，并且还提供一种基板输送方法安装装置。一种构造，其特征在于，包括：平行布置的包括输送机（10A，10B，10C，10D）的输送线横向的部件供给单元（20A，20B）以及基板分配单元（M3B），其被配置为在从所述元件供给单元（d）的输送器（10B，10C）输出基板请求信号（R）的情况下，分配从上游装置输送的基板（13）如图20A，20B所示，当在新的基板（13）的转印工作开始之前，对于靠近元件供给单元（20b）的输送机（10D）输出基板请求信号R时，新的基板）被输送到输送机（10D）中。因此，可以将基板优先地携带到在组件安装效率方面更有利的输送机中。

29. 发明授权

US07337533B2 Device for mounting component 有权
标题翻译：用于安装组件的设备
公开(公告)号：US07337533B2
公开(公告)日：2008-03-04
申请号：US10553588
申请日：2004-04-12
申请人： Shigeki Imafuku , Takeyuki Kawase , Yoichi Tanaka , Osamu Okuda , Takanori Yoshitake , Toshiyuki Kino
发明人： Shigeki Imafuku , Takeyuki Kawase , Yoichi Tanaka , Osamu Okuda , Takanori Yoshitake , Toshiyuki Kino
IPC分类号： B23P19/00
CPC分类号： H05K13/0413 , H05K13/0853 , Y10T29/49133 , Y10T29/4984 , Y10T29/53039 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved.There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (5). In addition, the nozzle can be elevated in an arc trajectory.
摘要翻译：本发明的目的是提供一种可以缩短喷嘴移动时间的部件安装装置和部件安装方法，从而可以提高生产效率。提供了一种用于控制喷嘴升降装置和喷嘴移动装置的运动位置和运动定时的控制装置。控制装置预先存储位于元件供应单元和电路板之间的障碍物的位置和高度。控制装置与喷嘴在通过部件相机拍摄电子部件之后已经完成通过每个障碍物的时间同步地向下移动喷嘴。或者，控制装置使喷嘴沿路径移动以避免障碍物。此外，在部件安装区域中，喷嘴以部件安装区域移动高度移动，并且部件通过喷嘴从部件安装区域移动高度向下移动而安装。因此，能够缩短喷嘴（5）的升降行程。此外，喷嘴可以以弧形轨迹升高。

30. 发明授权

US08950064B2 Component mounting device and component mounting method 有权
标题翻译：组件安装装置和组件安装方法
公开(公告)号：US08950064B2
公开(公告)日：2015-02-10
申请号：US13581688
申请日：2012-01-19
申请人： Yoshiyuki Kitagawa , Shuzo Yagi , Takeyuki Kawase
发明人： Yoshiyuki Kitagawa , Shuzo Yagi , Takeyuki Kawase
IPC分类号： H05K3/30 , H05K13/04 , H05K13/08
CPC分类号： H05K13/0452 , H05K13/08 , H05K13/085 , Y10S901/20 , Y10T29/4913 , Y10T29/49155 , Y10T29/49904 , Y10T29/49998 , Y10T29/53091 , Y10T29/5313 , Y10T29/53174
摘要： In a component mounting device (1) which has a first mounting lane (L1) and a second mounting lane (L2) and which is structured so as to be able to select either an independence mounting mode or an alternation mounting mode, when device type changing operation is performed with change of the type of boards which are the mounted objects, if a tape feeder float detecting sensor (17) that is provided in proximity of an opening (19) through which a part of the body or the foreign object enters in the component supplying part is, detects a part of the body such as a finger (26) of the operator or the foreign object, operation of the component mounting mechanism which belong to the mounting lane opposite to the mounting lane to which the component supplying part, in which the optical sensor is provided, belongs is stopped.
摘要翻译：在具有第一安装通道（L1）和第二安装通道（L2）的部件安装装置（1）中，其构造为能够选择独立安装模式或交替安装模式，当装置类型如果设置在开口（19）附近的带状供料器浮子检测传感器（17），身体或异物的一部分通过该进给器浮动检测传感器（17）进入，则改变作为安装对象的板类型的改变操作在部件供给部中，检测身体的一部分，例如操作者的手指（26）或异物，属于与安装车道相对的安装车道的部件安装机构的操作，设置有光学传感器的部件被停止。

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