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1. 发明授权

US08136219B2 Electronic component mounter and mounting method 有权
标题翻译：电子元件安装器和安装方法
公开(公告)号：US08136219B2
公开(公告)日：2012-03-20
申请号：US11915982
申请日：2006-07-31
申请人： Tadashi Endo , Akira Noudo , Takeyuki Kawase , Osamu Okuda , Hiroshi Ogata
发明人： Tadashi Endo , Akira Noudo , Takeyuki Kawase , Osamu Okuda , Hiroshi Ogata
IPC分类号： H05K13/04
CPC分类号： H05K13/04 , Y10T29/49004 , Y10T29/49131 , Y10T29/53174 , Y10T29/53191
摘要： A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
摘要翻译：能够以高精度和高效率检测由喷嘴吸引和保持的电子部件的高度的方法是应用于具有转印头（8）的安装器（100）的部件高度测量方法，吸入保持喷嘴（21），用于传送部件P并将部件P安装到板（3）上，并且包括：将部件P降低到第一线传感器（13）的高精度范围内测量部件P的高度; 并使用第一线传感器（13）测量部件P的高度。

2. 发明申请

US20090300908A1 ELECTRONIC COMPONENT MOUNTER AND MOUNTING METHOD 有权
标题翻译：电子元件安装和安装方法
公开(公告)号：US20090300908A1
公开(公告)日：2009-12-10
申请号：US11915982
申请日：2006-07-31
申请人： Tadashi Endo , Akira Noudo , Takeyuki Kawase , Osamu Okuda , Hiroshi Ogata
发明人： Tadashi Endo , Akira Noudo , Takeyuki Kawase , Osamu Okuda , Hiroshi Ogata
IPC分类号： B23P19/00
CPC分类号： H05K13/04 , Y10T29/49004 , Y10T29/49131 , Y10T29/53174 , Y10T29/53191
摘要： It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency.This method is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
摘要翻译：本发明的目的是提供一种能够以高精度和高效率检测由喷嘴吸住并保持的电子部件的高度的方法。该方法是应用于配备有具有分量吸持喷嘴（21）的转印头（8）的安装器（100）的部件高度测量方法，用于传送部件P并将部件P安装到板上（3），并且包括：将部件P降低到用于测量部件P的高度的第一线传感器（13）的高精度范围内; 并使用第一线传感器（13）测量部件P的高度。

3. 发明授权

US08553080B2 Component placement apparatus 有权
标题翻译：组件放置装置
公开(公告)号：US08553080B2
公开(公告)日：2013-10-08
申请号：US12668102
申请日：2008-08-27
申请人： Tadashi Endo , Akira Noudo , Kazuhide Nagao
发明人： Tadashi Endo , Akira Noudo , Kazuhide Nagao
IPC分类号： H04N7/18
CPC分类号： H05K13/041 , H05K13/0812 , Y10T29/49131
摘要： To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time.A component placement apparatus 1 comprising a line sensor camera 23 composed of a projector 21 for projecting inspection light in horizontal direction and a line sensor 22 for receiving the inspection light projected by the projector 21, the component placement apparatus 1 designed to move a mounting head 7 to allow a component P sucked to the suction nozzle 9 of the mounting head 7 before being mounted onto a substrate 10 to horizontally cross the optical axis 20 of the inspection light of the line sensor camera 23 to cause the line sensor camera 23 to perform imaging of the component and to determine the propriety of suction attitude of the component P with respect to the suction nozzle 9 based on the image DP of the component P obtained through imaging of the component P by the line sensor camera 23, characterized in that the projector 21 and the line sensor 22 constituting the line sensor camera 23 are arranged outside the movable region R of the mounting head 7 with respect to the base 2.
摘要翻译：提供一种能够防止可移动区域内的安装头的自由操作受到限制以及改善安装节拍时间的部件放置装置。一种组件放置设备1，包括由用于在水平方向上投射检查光的投影仪21和用于接收由投影仪21投影的检查光的行传感器22构成的行传感器照相机23，该设备将移动安装头如图7所示，在被安装到基板10上之前，将部件P吸附到安装头7的吸嘴9上，以水平地交叉线传感器相机23的检查光的光轴20，以使线传感器相机23执行基于通过线传感器相机23对部件P的成像获得的部件P的图像DP，确定部件P相对于吸嘴9的抽吸姿态的合适性，其特征在于，构成线传感器摄像机23的投影仪21和线传感器22相对于安装头7的可动区域R配置在外侧 e基地2。

4. 发明申请

US20100321487A1 COMPONENT PLACEMENT APPARATUS 有权
标题翻译：组件放置设备
公开(公告)号：US20100321487A1
公开(公告)日：2010-12-23
申请号：US12668102
申请日：2008-08-27
申请人： Tadashi Endo , Akira Noudo , Kazuhide Nagao
发明人： Tadashi Endo , Akira Noudo , Kazuhide Nagao
IPC分类号： H04N7/18
CPC分类号： H05K13/041 , H05K13/0812 , Y10T29/49131
摘要： To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time.A component placement apparatus 1 comprising a line sensor camera 23 composed of a projector 21 for projecting inspection light in horizontal direction and a line sensor 22 for receiving the inspection light projected by the projector 21, the component placement apparatus 1 designed to move a mounting head 7 to allow a component P sucked to the suction nozzle 9 of the mounting head 7 before being mounted onto a substrate 10 to horizontally cross the optical axis 20 of the inspection light of the line sensor camera 23 to cause the line sensor camera 23 to perform imaging of the component and to determine the propriety of suction attitude of the component P with respect to the suction nozzle 9 based on the image DP of the component P obtained through imaging of the component P by the line sensor camera 23, characterized in that the projector 21 and the line sensor 22 constituting the line sensor camera 23 are arranged outside the movable region R of the mounting head 7 with respect to the base 2.
摘要翻译：提供一种能够防止可移动区域内的安装头的自由操作受到限制以及改善安装节拍时间的部件放置装置。一种组件放置设备1，包括由用于在水平方向上投射检查光的投影仪21和用于接收由投影仪21投影的检查光的行传感器22构成的行传感器照相机23，该设备将移动安装头如图7所示，在被安装到基板10上之前，将部件P吸附到安装头7的吸嘴9上，以水平地交叉线传感器相机23的检查光的光轴20，以使线传感器相机23执行基于通过线传感器相机23对部件P的成像获得的部件P的图像DP，确定部件P相对于吸嘴9的抽吸姿态的合适性，其特征在于，构成线传感器摄像机23的投影仪21和线传感器22相对于安装头7的可动区域R配置在外侧 e基地2。

5. 发明申请

US20090125141A1 WORKING APPARATUS AND WORKING METHOD FOR CIRCUIT BOARD 有权
标题翻译：电路板的工作装置和工作方法
公开(公告)号：US20090125141A1
公开(公告)日：2009-05-14
申请号：US12095083
申请日：2006-11-24
申请人： Takahiro Noda , Tadashi Endo , Osamu Okuda , Kazuhide Nagao
发明人： Takahiro Noda , Tadashi Endo , Osamu Okuda , Kazuhide Nagao
IPC分类号： G06F19/00
CPC分类号： H05K13/0812 , H05K13/0815 , Y10T29/53091 , Y10T29/53178 , Y10T29/53261
摘要： In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height.
摘要翻译：在通过近似电路板的板表面的形状来估计曲面模型时，辅助测量点被设置在板表面以外的测量点上，在估计曲面模型中作为取样位移量的合格性根据位移幅度与工件参考表面的差异。当取样位移量值被确定为不合格时，重新设定一个新的测量点。通过这种操作，由于板表面的不连续性引起的位移幅度的局部增加和减小对曲面模型的估计没有影响，并且与实际板表面的形状更接近的曲面模型是估计，导致工作质量的提高，工作高度调整到适当的高度。

6. 发明授权

US07809461B2 Working apparatus and working method for circuit board 有权
标题翻译：电路板工作装置及工作方法
公开(公告)号：US07809461B2
公开(公告)日：2010-10-05
申请号：US12095083
申请日：2006-11-24
申请人： Takahiro Noda , Tadashi Endo , Osamu Okuda , Kazuhide Nagao
发明人： Takahiro Noda , Tadashi Endo , Osamu Okuda , Kazuhide Nagao
IPC分类号： H01L31/00 , H01L21/00 , G06F19/00 , G01R31/26 , H01R13/648 , B23P21/00 , B23P19/00 , B29C65/00
CPC分类号： H05K13/0812 , H05K13/0815 , Y10T29/53091 , Y10T29/53178 , Y10T29/53261
摘要： In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height.
摘要翻译：在通过近似电路板的板表面的形状来估计曲面模型时，辅助测量点被设置在板表面以外的测量点上，在估计曲面模型中作为取样位移量的合格性根据位移幅度与工件参考表面的差异。当取样位移量值被确定为不合格时，重新设定一个新的测量点。通过这种操作，由于板表面的不连续性引起的位移幅度的局部增加和减小对曲面模型的估计没有影响，并且与实际板表面的形状更接近的曲面模型是估计，导致工作质量的提高，工作高度调整到适当的高度。

7. 发明申请

US20060228199A1 Electronic component feeder and electronic component feeding method 审中-公开
标题翻译：电子元件馈线和电子元件馈电方式
公开(公告)号：US20060228199A1
公开(公告)日：2006-10-12
申请号：US10553515
申请日：2004-05-12
申请人： Tadashi Endo , Kazuo Kido , Hideki Uchida , Osamu Okuda , Nobuyuki Kakita
发明人： Tadashi Endo , Kazuo Kido , Hideki Uchida , Osamu Okuda , Nobuyuki Kakita
IPC分类号： B65B69/00
CPC分类号： H05K13/0434
摘要： There are provided a forward-side regulating member for regulating the support positions of the pallets loaded in a magazine on the forward side in a pallet feed direction, a rearward-side regulating member that is movable along the direction, for regulating the support positions of the pallets regulated by the forward-side regulating member on the rearward side in the direction, and a horizontal posture regulating member that can be arranged between the pallets, for regulating the pallet support posture so as to maintain the roughly horizontal support posture of the pallets supported by one pair of the support sections by virtue of the arrangement.
摘要翻译：设置有用于调节装载在托盘进给方向前侧的料仓中的托盘的支撑位置的前侧调节构件，可沿着该方向移动的后侧调节构件，用于调节支撑位置由向前侧调节构件在方向后侧调节的托盘和可布置在托盘之间的水平姿势调节构件，用于调节托盘支撑姿势，以便保持托盘的大致水平的支撑姿势由一对支撑部分借助于该装置支撑。

8. 发明申请

US20120317804A1 ELECTRONIC COMPONENT MOUNTING DEVICE AND AN OPERATION PERFORMING METHOD FOR MOUNTING ELECTRONIC COMPONENTS 有权
标题翻译：电子元件安装设备和安装电子元件的操作执行方法
公开(公告)号：US20120317804A1
公开(公告)日：2012-12-20
申请号：US13581845
申请日：2011-07-27
申请人： Tadashi Endo , Hiroshi Ogata , Tomohiro Kimura , Takaaki Yokoi
发明人： Tadashi Endo , Hiroshi Ogata , Tomohiro Kimura , Takaaki Yokoi
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0452 , H01L2224/81 , H05K13/0413 , H05K13/0812 , H05K13/083 , Y10T29/49128 , Y10T29/4913 , Y10T29/49904 , Y10T29/53013 , Y10T29/53174 , Y10T29/53178
摘要： It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. Height precision division information that divide the height precision required for up and down movements of operating heads into the first division which indicates a normal height precision and the second division which indicates that a high height precision is required based on the type of electronic components are stored as operation data beforehand. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.
摘要翻译：旨在提供一种电子部件安装装置和用于安装电子部件的操作执行方法，从而可以提高操作质量和生产率。存储高精度分割信息，其将操作头的上下运动所需的高度精度分成表示正常高度精度的第一分区，以及基于电子部件的类型指示需要高高度精度的第二分割作为操作数据。在操作执行过程中，当电子部件属于第一分割时，操作头基于从通过使用计算出的板的顶面的大致曲面导出的近似操作位置高度而上下移动通过测量板的表面上的多个高度测量点而获得的高度测量结果，并且当电子部件属于第二分割时，操作头基于通过以下获得的各个操作位置高度而上下移动：单独测量操作位置的板高度。

9. 发明授权

US08925190B2 Electronic component mounting device and an operation performing method for mounting electronic components 有权
标题翻译：电子部件安装装置和电子部件的安装动作执行方法
公开(公告)号：US08925190B2
公开(公告)日：2015-01-06
申请号：US13581845
申请日：2011-07-27
申请人： Tadashi Endo , Hiroshi Ogata , Tomohiro Kimura , Takaaki Yokoi
发明人： Tadashi Endo , Hiroshi Ogata , Tomohiro Kimura , Takaaki Yokoi
IPC分类号： H05K3/30 , H05K13/04
CPC分类号： H05K13/0452 , H01L2224/81 , H05K13/0413 , H05K13/0812 , H05K13/083 , Y10T29/49128 , Y10T29/4913 , Y10T29/49904 , Y10T29/53013 , Y10T29/53174 , Y10T29/53178
摘要： It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.
摘要翻译：旨在提供一种电子部件安装装置和用于安装电子部件的操作执行方法，从而可以提高操作质量和生产率。在操作执行过程中，当电子部件属于第一分割时，操作头基于从通过使用计算出的板的顶面的大致曲面导出的近似操作位置高度而上下移动通过测量板的表面上的多个高度测量点而获得的高度测量结果，并且当电子部件属于第二分割时，操作头基于通过以下获得的各个操作位置高度而上下移动：单独测量操作位置的板高度。

10. 发明申请

US20130298382A1 BOTTOM RECEPTION PIN MODULE FOR ELECTRONIC COMPONENT MOUNTING DEVICE, SUBSTRATE BOTTOM RECEPTION DEVICE, AND SUBSTRATE BOTTOM RECEPTION METHOD 有权
标题翻译：用于电子元件安装装置的底部接收引脚模块，底板底部接收装置和底板底部接收方法
公开(公告)号：US20130298382A1
公开(公告)日：2013-11-14
申请号：US13980140
申请日：2012-08-02
申请人： Shirou Yamashita , Tadashi Endo , Koji Kishita
发明人： Shirou Yamashita , Tadashi Endo , Koji Kishita
IPC分类号： H05K13/00 , H05K13/04
CPC分类号： H05K13/0061 , H05K13/04 , Y10T29/49998
摘要： A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface to support the substrate includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the substrate to support the substrate. By a vacuum suction from a suction hole 25c, the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.
摘要翻译：在具有设置在上表面上的用于支撑基板的具有磁性构件21a的底部接收基座部分21上竖立的底部接收销模块22包括：基部23，其具有内置的磁性构件26，以便自由地在磁铁部件26下降的状态下，通过磁化力升降并固定在底部接收基部21上，从基部23向上延伸的中空轴部件24，顶部部件25的上端抵接在衬底的下表面上以支撑衬底。通过从抽吸孔25c的真空抽吸，磁体构件26下降并提升以相对于底部接收基部21固定和固定基部23。

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