专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US08393935B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US08393935B2
公开(公告)日：2013-03-12
申请号：US12673294
申请日：2008-07-23
申请人： Norio Kimura , Kenya Ito , Tamami Takahashi , Masaya Seki
发明人： Norio Kimura , Kenya Ito , Tamami Takahashi , Masaya Seki
IPC分类号： B24B9/00 , B24B21/00
CPC分类号： B24B9/065
摘要： A polishing apparatus polishes a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate by bringing a polishing tool into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder configured to hold the substrate, and a polishing head configured to polish the periphery of the substrate held by the substrate holder using the polishing tool. The polishing head includes a press pad for pressing the polishing tool against the periphery of the substrate, and a linear motor configured to reciprocate the press pad.
摘要翻译：抛光装置通过使抛光工具与基板的周边滑动接触来抛光基板的周边（斜面部分，切口部分，边缘切割部分）。抛光装置包括：被配置为保持基板的基板保持器，以及抛光头，其被构造成使用抛光工具抛光由基板保持器保持的基板的周边。抛光头包括用于将抛光工具压靠在基板的周边上的压垫，以及配置成使压垫往复运动的线性电动机。

22. 发明申请

US20080274670A1 Substrate Peripheral Portion Measuring Device, and Substrate Peripheral Portion Polishing Apparatus 审中-公开
标题翻译：基板外围部分测量装置和基板外围部分抛光装置
公开(公告)号：US20080274670A1
公开(公告)日：2008-11-06
申请号：US11596714
申请日：2005-05-23
申请人： Mitsuo Tada , Yasunari Suto , Hirofumi Ichihara , Kenya Ito , Tamami Takahashi
发明人： Mitsuo Tada , Yasunari Suto , Hirofumi Ichihara , Kenya Ito , Tamami Takahashi
IPC分类号： B24B49/12
CPC分类号： H01L21/67242 , B24B9/065 , B24B49/12 , G01N21/9501 , G01N29/44 , H01L21/67023 , H01L21/67075
摘要： A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
摘要翻译：投射/接收单元（52）将激光投射到周边部分（30）并且在液体被供给到基板（14）的同时接收反射光并在周边部分（30）上流动。信号处理控制器（54）处理反射光的电信号以决定周边部分（30）的状态。监视被抛光的周边部分的状态。此外，检测到抛光终点。也可以使用激光以外的透射波。周边部分（30）也可以由通道形成部件包围，从而适当地形成通道。即使在液体在基板周边部分上流动的情况下，也可以适当地测量周边部分。

23. 发明申请

US20110256811A1 POLISHING METHOD 审中-公开
标题翻译：抛光方法
公开(公告)号：US20110256811A1
公开(公告)日：2011-10-20
申请号：US13080821
申请日：2011-04-06
申请人： Masayuki NAKANISHI , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki NAKANISHI , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： B24B1/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/04 , B24B37/042
摘要： A polishing method can obtain a good polishing profile which, for example, will not cause peeling of a semiconductor layer from a silicon substrate. The polishing method includes: positioning a polishing head at a position above a polishing start position in an edge portion of a rotating substrate; lowering a polishing tool of the polishing head until the polishing tool comes into contact with the polishing start position in the edge portion of the rotating substrate and a pressure between the polishing tool and the polishing start position reaches a set pressure; allowing the polishing tool to stay at the polishing start position for a predetermined amount of time; and then moving the polishing head toward a peripheral end of the substrate while keeping the polishing tool in contact with the edge portion of the rotating substrate at the set pressure.
摘要翻译：抛光方法可以获得良好的抛光轮廓，其例如不会导致半导体层从硅衬底剥离。抛光方法包括：将抛光头定位在旋转基板的边缘部分中的抛光开始位置上方的位置; 降低抛光头的抛光工具，直到研磨工具与旋转基板的边缘部分中的抛光开始位置接触，并且抛光工具和抛光开始位置之间的压力达到设定压力; 允许抛光工具在抛光开始位置停留预定的时间量; 然后将抛光头朝向基板的周缘移动，同时保持抛光工具在旋转基板的边缘部分处于设定压力。

24. 发明申请

US20110217906A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20110217906A1
公开(公告)日：2011-09-08
申请号：US13036114
申请日：2011-02-28
申请人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota , Takeshi Nishioka
发明人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota , Takeshi Nishioka
IPC分类号： B24B1/00 , B24B55/00
CPC分类号： B24B1/00 , B24B55/00
摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.
摘要翻译：抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。

25. 发明授权

US08641480B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08641480B2
公开(公告)日：2014-02-04
申请号：US13036114
申请日：2011-02-28
申请人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota , Takeshi Nishioka
发明人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota , Takeshi Nishioka
IPC分类号： B24B1/00
CPC分类号： B24B1/00 , B24B55/00
摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.
摘要翻译：抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。

26. 发明授权

US08445360B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08445360B2
公开(公告)日：2013-05-21
申请号：US13027551
申请日：2011-02-15
申请人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： H01L21/46 , H01L21/30 , H01L21/78 , H01L21/301
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
摘要翻译：一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜，暴露下面的硅。在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。

27. 发明申请

US20110207294A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20110207294A1
公开(公告)日：2011-08-25
申请号：US13027551
申请日：2011-02-15
申请人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： H01L21/762
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
摘要翻译：一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。该方法包括：在第一旋转速度旋转器件基板的同时，将第一研磨带压在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板周边部分的沉积膜并暴露下面的硅; 并且在第二旋转速度旋转所述装置基板的同时将第二研磨带压靠在所述装置基板的周边部分中的暴露的硅上，从而将所述硅抛光至预定的深度。

28. 发明授权

US09199352B2 Polishing apparatus, polishing method and pressing member for pressing a polishing tool 有权
标题翻译：抛光装置，抛光方法和用于按压抛光工具的按压构件
公开(公告)号：US09199352B2
公开(公告)日：2015-12-01
申请号：US12986481
申请日：2011-01-07
申请人： Masaya Seki , Kenya Ito , Masayuki Nakanishi
发明人： Masaya Seki , Kenya Ito , Masayuki Nakanishi
IPC分类号： B24B9/00 , B24B9/06 , B24B21/00 , B24B37/27
CPC分类号： B24B9/065 , B24B21/004 , B24B37/27
摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.
摘要翻译：抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。抛光装置包括旋转保持机构，其构造成水平地保持基板并旋转基板和设置在基板的周边部分附近的至少一个抛光头。抛光头具有沿着基板周向延伸的至少一个突出部，并且抛光头构造成通过突起抵靠基板的周边部分从上方或下方按压抛光带的抛光表面。

29. 发明授权

US08840992B2 Curable resin composition and optical film 有权
标题翻译：可固化树脂组合物和光学膜
公开(公告)号：US08840992B2
公开(公告)日：2014-09-23
申请号：US12908187
申请日：2010-10-20
申请人： Hiroyuki Iizuka , Kenya Ito , Koji Ohguma , Mikio Yamahiro
发明人： Hiroyuki Iizuka , Kenya Ito , Koji Ohguma , Mikio Yamahiro
IPC分类号： G11B5/708 , C09D133/08 , B32B5/16
CPC分类号： B32B5/16 , C09D133/08 , Y10T428/25 , Y10T428/257 , Y10T428/265
摘要： The curable resin composition of the present invention contains inorganic particles and a curable resin. The inorganic particles includes an inorganic particle (a-1) having a Mohs hardness of 7 or more and an average particle diameter of 1 μm or less, an inorganic particle (a-2) having a Mohs hardness of 4 or more to less than 7 and an average particle diameter of 1 μm or less, and an inorganic particle (a-3) having a Mohs hardness of less than 4 and an average particle diameter of 1 μm or less. The curable resin is at least one selected from a group consisting of a thermosetting resin and an active energy ray-curable resin.
摘要翻译：本发明的固化性树脂组合物含有无机粒子和固化性树脂。无机粒子包括莫氏硬度为7以上，平均粒径为1μm以下的无机粒子（a-1），莫氏硬度为4以上的无机粒子（a-2） 7，平均粒径为1μm以下，以及莫氏硬度小于4，平均粒径为1μm以下的无机粒子（a-3）。可固化树脂是选自热固性树脂和活性能量射线固化树脂中的至少一种。

30. 发明申请

US20140113115A1 TRANSFER FILM FOR IN-MOLD MOLDING AND METHOD FOR PRODUCING SAME 有权
标题翻译：用于模内成型的转印膜及其制造方法
公开(公告)号：US20140113115A1
公开(公告)日：2014-04-24
申请号：US14127964
申请日：2012-06-18
申请人： Kenya Ito , Koji Ohguma , Takuro Tanaka , Yuka Takahashi , Aki Kuromatsu , Mikio Yamahiro
发明人： Kenya Ito , Koji Ohguma , Takuro Tanaka , Yuka Takahashi , Aki Kuromatsu , Mikio Yamahiro
IPC分类号： B29C45/14 , B32B38/00
CPC分类号： B29C45/14688 , B29C45/14 , B29C45/14811 , B29C45/14827 , B32B7/06 , B32B27/16 , B32B38/0036 , B32B2270/00 , B32B2451/00 , B44C1/1729 , Y10T428/24851 , Y10T428/31511 , Y10T428/31515 , Y10T428/31551 , Y10T428/31554 , Y10T428/31598 , Y10T428/31663 , Y10T428/31946
摘要： Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer (11) which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L0). The transfer layer (11) comprises an IMD layer (L2) laminated on the substrate (L0) and to be arranged on the outermost surface of the molded body after the in-mold molding. The TMD layer (L2) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.
摘要翻译：提供了一种模内成型用转印膜，其耐溶剂性，耐热性，耐久性，耐粘连性和成型性优异，并且能够抑制栅极流动的产生，并且还提供了制造这种膜的方法。膜设置有：转印层（11），其被转印到模内成型体中，并且在转印后用活性能量射线照射时被固化; 和薄膜状基板（L0）。转印层（11）包括层叠在基板（L0）上的IMD层（L2），并且在模内成型之后布置在成形体的最外表面上。 TMD层（L2）由含有至少一种活性能固化树脂和至少一种热固性树脂的混合物组合物构成。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式