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21. 发明授权

US06276777B1 Variable maximum operating temperature for a printhead 失效
标题翻译：打印头的可变最大工作温度
公开(公告)号：US06276777B1
公开(公告)日：2001-08-21
申请号：US09120682
申请日：1998-07-21
申请人： Stefano Schiaffino , Sebastia Castelltort , David H. Donovan
发明人： Stefano Schiaffino , Sebastia Castelltort , David H. Donovan
IPC分类号： B41J2938
CPC分类号： B41J2/17546 , B41J2/04515 , B41J2/0454 , B41J2/04551 , B41J2/04563 , B41J2/0458 , B41J29/393
摘要： A variable maximum operating temperature for a printhead is defined and utilized within both a system and a method. The variable maximum operating temperature varies according to one or more operating conditions within a printer into which the printhead may be installed. If a detected temperature of the printhead is greater than the variable maximum operating temperature for a detected operating condition, the printer will be shut down to prevent overheating. Accordingly, the system and method extend the useful life of the printhead and reduce paper waste.
摘要翻译：打印头的可变最大工作温度在系统和方法中均被定义和使用。可变最大工作温度根据可以安装打印头的打印机内的一个或多个操作条件而变化。如果检测到的打印头的检测温度大于检测到的操作条件的可变最大工作温度，则打印机将被关闭以防止过热。因此，该系统和方法延长了打印头的使用寿命并减少了纸张浪费。

22. 发明授权

US09093630B2 Light emitting device with reduced EPI stress 有权
标题翻译：具有降低EPI应力的发光器件
公开(公告)号：US09093630B2
公开(公告)日：2015-07-28
申请号：US13878837
申请日：2011-10-07
申请人： Frederic Stephane Diana , Yajun Wei , Stefano Schiaffino , Brendan Jude Moran
发明人： Frederic Stephane Diana , Yajun Wei , Stefano Schiaffino , Brendan Jude Moran
IPC分类号： H01L33/00 , H01L33/64 , H01L33/40 , H01L33/62 , H01L23/495
CPC分类号： H01L33/641 , H01L33/12 , H01L33/40 , H01L33/486 , H01L33/56 , H01L33/62 , H01L33/642 , H01L33/644 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： Elements are added to a light emitting device to reduce the stress within the light emitting device caused by thermal cycling. Alternatively, or additionally, materials are selected for forming contacts within a light emitting device based on their coefficient of thermal expansion and their relative cost, copper alloys being less expensive than gold, and providing a lower coefficient of thermal expansion than copper. Elements of the light emitting device may also be structured to distribute the stress during thermal cycling.
摘要翻译：将元件添加到发光器件中以减少由热循环引起的发光器件内的应力。或者或另外，根据它们的热膨胀系数及其相对成本选择用于在发光器件内形成触点的材料，铜合金比金更便宜，并且提供比铜更低的热膨胀系数。发光器件的元件也可以被构造成在热循环期间分布应力。

23. 发明授权

US06367903B1 Alignment of ink dots in an inkjet printer 失效
标题翻译：喷墨打印机中的墨点对准
公开(公告)号：US06367903B1
公开(公告)日：2002-04-09
申请号：US09199882
申请日：1998-11-24
申请人： Paul D. Gast , James L. McCullough , Albert Serra , Xavier Gros , Jose J Doval , Stefano Schiaffino , Ronald A. Askeland , Clayton L. Holstun , Scott Norum
发明人： Paul D. Gast , James L. McCullough , Albert Serra , Xavier Gros , Jose J Doval , Stefano Schiaffino , Ronald A. Askeland , Clayton L. Holstun , Scott Norum
IPC分类号： B41J2938
CPC分类号： B41J2/2135 , B41J2/04505 , B41J2/04543 , B41J2/0458 , B41J2202/17 , G06K15/102 , G06K2215/006
摘要： A misalignment compensation technique for a dot printer is disclosed. This technique first supplies printing instructions to a printhead for energizing printing elements in various groups (primitives) to print a pattern on a medium. The printed pattern is then detected by optical sensors in the printer. Based on the detection, a position offset error for each primitive is determined. These errors are used to generate a separate time correction for each of the primitives such that, when the printer is used normally, the time period for printing a dot will be advanced or delayed for each primitive so as to align the dots printed by the primitives. In another embodiment, alignment data taken by a manufacturing line sensor is stored in a memory on the print cartridge. After the print cartridge is installed in the printer, a second optical test completes the data needed to create timing correction values.
摘要翻译：公开了一种点打印机的对准补偿技术。该技术首先将打印指令提供给打印头，用于激励各种组（原始图案）中的打印元件以在介质上打印图案。然后通过打印机中的光学传感器检测印刷图案。基于检测，确定每个图元的位置偏移误差。这些错误用于为每个图元生成单独的时间校正，使得当正常使用打印机时，对于每个图元，打印点的时间段将被提前或延迟，以便对准由图元打印的点。在另一个实施例中，由生产线传感器获取的对准数据被存储在打印盒上的存储器中。打印墨盒安装在打印机中后，第二次光学测试完成创建定时校正值所需的数据。

24. 发明授权

US06364447B1 Correction system for droplet placement errors in the scan axis in inkjet printers 失效
标题翻译：喷墨打印机中扫描轴上液滴放置误差的校正系统
公开(公告)号：US06364447B1
公开(公告)日：2002-04-02
申请号：US09506736
申请日：2000-02-18
申请人： Miguel Boleda , Stefano Schiaffino , Albert Serra
发明人： Miguel Boleda , Stefano Schiaffino , Albert Serra
IPC分类号： B41J201
CPC分类号： B41J19/145
摘要： A method and apparatus for correcting for drop placement errors due to relative rotation between an inkjet printhead mounted in a printer carriage and the print media to be printed on comprises first determining the relative contribution to the drop placement error due to rotation of the printhead about the scan axis (Y axis error), then, with respect to any determined Y axis error, applying the same magnitude and sense of correction for drop placement errors while printing in both a first scanning direction of the carriage and while printing in a second scanning direction of the carriage. Errors due to rotation about the Z axis are also corrected for. Preferably the errors are determined by printing and scanning a test pattern.
摘要翻译：用于校正由于安装在打印机托架中的喷墨打印头和要打印的打印介质之间的相对旋转引起的墨滴放置误差的方法和装置包括首先确定由于打印头围绕着打印头的旋转而引起的落放位置误差的相对贡献扫描轴（Y轴误差），然后相对于任何确定的Y轴误差，在打印在滑架的第一扫描方向上并且在第二扫描方向上打印时施加相同的幅度和校正误差感的马车。由于绕Z轴旋转的错误也会被修正。优选地，通过打印和扫描测试图案来确定错误。

25. 发明申请

US20130334563A1 LED HAVING VERTICAL CONTACTS REDISTRUTED FOR FLIP CHIP MOUNTING 有权
标题翻译： LED具有垂直接触件，用于翻转芯片安装
公开(公告)号：US20130334563A1
公开(公告)日：2013-12-19
申请号：US14001878
申请日：2012-02-28
申请人： Jipu Lei , Kwong-Hin Henry Choy , Yajun Wei , Stefano Schiaffino , Danel Alexander Steigerwald
发明人： Jipu Lei , Kwong-Hin Henry Choy , Yajun Wei , Stefano Schiaffino , Danel Alexander Steigerwald
IPC分类号： H01L33/38
CPC分类号： H01L33/0079 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L25/167 , H01L33/0095 , H01L33/38 , H01L33/62 , H01L2224/0401 , H01L2224/05552 , H01L2224/05568 , H01L2224/06102 , H01L2224/13144 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
摘要： A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-Type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface though which light is emitted. A copper layer has a first portion electrically connected to and opposing the bottom surface of the p-type layer. A dielectric wall extends through the copper layer to isolate a second portion of the copper layer from the first portion. A metal shunt electrically connects the second portion of the copper layer to the top surface of the n-type layer. P-metal electrodes electrically connect to the first portion, and n-metal electrodes electrically connect to the second portion, wherein the LED structure forms a flip chip. Other embodiments of the methods and structures are also described.
摘要翻译：发光二极管（LED）结构具有半导体层，包括p型层，有源层和n型层。 p型层具有底面，n型层具有通过哪个光发射的顶面。铜层具有电连接到p型层的底表面并与之相对的第一部分。电介质壁延伸穿过铜层以将铜层的第二部分与第一部分隔离。金属分流器将铜层的第二部分电连接到n型层的顶表面。 P金属电极电连接到第一部分，并且n金属电极电连接到第二部分，其中LED结构形成倒装芯片。还描述了方法和结构的其他实施例。

26. 发明申请

US20130193476A1 LIGHT EMITTING DEVICE WITH REDUCE EPI STRESS 有权
标题翻译：具有降低EPI应力的发光装置
公开(公告)号：US20130193476A1
公开(公告)日：2013-08-01
申请号：US13878837
申请日：2011-10-07
申请人： Frederic Stephane Diana , Yajun Wei , Stefano Schiaffino , Brendan Jude Moran
发明人： Frederic Stephane Diana , Yajun Wei , Stefano Schiaffino , Brendan Jude Moran
IPC分类号： H01L33/64
CPC分类号： H01L33/641 , H01L33/12 , H01L33/40 , H01L33/486 , H01L33/56 , H01L33/62 , H01L33/642 , H01L33/644 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： Elements are added to a light emitting device to reduce the stress within the light emitting device caused by thermal cycling. Alternatively, or additionally, materials are selected for forming contacts within a light emitting device based on their coefficient of thermal expansion and their relative cost, copper alloys being less expensive than gold, and providing a lower coefficient of thermal expansion than copper. Elements of the light emitting device may also be structured to distribute the stress during thermal cycling.
摘要翻译：将元件添加到发光器件中以减少由热循环引起的发光器件内的应力。或者或另外，根据它们的热膨胀系数及其相对成本选择用于在发光器件内形成触点的材料，铜合金比金更便宜，并且提供比铜更低的热膨胀系数。发光器件的元件也可以被构造成在热循环期间分布应力。

27. 发明授权

US08053905B2 Compliant bonding structures for semiconductor devices 有权
标题翻译：适用于半导体器件的接合结构
公开(公告)号：US08053905B2
公开(公告)日：2011-11-08
申请号：US12897866
申请日：2010-10-05
申请人： John E. Epler , Michael R. Krames , James G. Neff , Stefano Schiaffino
发明人： John E. Epler , Michael R. Krames , James G. Neff , Stefano Schiaffino
IPC分类号： H01L23/48
CPC分类号： H01L33/38 , H01L33/0079 , H01L33/62 , H01L2224/0401 , H01L2224/0603 , H01L2224/1403
摘要： A light emitting device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region, a metal p-contact disposed on the p-type region, and a metal n-contact disposed on the n-type region. The metal p-contact and the metal n-contact are both formed on the same side of the semiconductor structure. The light emitting device is connected to a mount by a bonding structure. The bonding structure includes a plurality of metal regions separated by gaps and a metal structure disposed between the light emitting device and the mount proximate to an edge of the light emitting device. The metal structure is configured such that during bonding, the metal structure forms a continuous seal between the light emitting device and the mount.
摘要翻译：发光器件包括：半导体结构，包括设置在n型区域和p型区域之间的发光层，设置在p型区域上的金属p型触点和设置在n型区域上的金属n型触点型区域。金属p型接触和金属n型接触都形成在半导体结构的同一侧。发光器件通过接合结构连接到安装件。接合结构包括由间隙隔开的多个金属区域和设置在发光器件和靠近发光器件的边缘的安装件之间的金属结构。金属结构构造成使得在接合期间，金属结构在发光器件和安装座之间形成连续的密封。

28. 发明授权

US07842963B2 Electrical contacts for a semiconductor light emitting apparatus 有权
标题翻译：用于半导体发光装置的电触头
公开(公告)号：US07842963B2
公开(公告)日：2010-11-30
申请号：US11550488
申请日：2006-10-18
申请人： Stefano Schiaffino , John Julian Uebbing
发明人： Stefano Schiaffino , John Julian Uebbing
IPC分类号： H01L33/62
CPC分类号： H01L33/382 , H01L33/20
摘要： A process for forming electrical contacts for a semiconductor light emitting apparatus is disclosed. The light emitting apparatus has a first layer of first conductivity type, an active layer for generating light overlying the first layer, and a second layer of second conductivity type overlying the active layer. The process involves forming at least a first and a second elongate electrical contact through the second layer and the active layer to provide electrical connection to the first layer, the first and second contacts oriented at an angle to each other, the first contact having a first end in proximity with the second contact, the first end being sufficiently spaced apart from the second contact such that when current is supplied to the first layer through the contacts, current contributions from the first end of the first contact and the second contact in an area generally between the first end and the second contact cause a current density in the area that is approximately equal to a current density elsewhere along the first and second contacts.
摘要翻译：公开了一种用于形成用于半导体发光装置的电触头的工艺。发光装置具有第一导电类型的第一层，用于产生覆盖第一层的光的有源层和覆盖有源层的第二导电类型的第二层。该方法包括通过第二层和有源层至少形成第一和第二细长电接触以提供与第一层的电连接，第一和第二接触彼此成一定角度，第一接触具有第一在第二触点附近端部，第一端与第二触点充分隔开，使得当电流通过触点供应到第一层时，来自第一触点的第一端和第一触点的区域中的电流贡献通常在第一端和第二接触之间引起区域中的电流密度近似等于沿着第一和第二接触件的其他地方的电流密度。

29. 发明申请

US20070057271A1 Interconnects for semiconductor light emitting devices 有权
标题翻译：互连用于半导体发光器件
公开(公告)号：US20070057271A1
公开(公告)日：2007-03-15
申请号：US11226151
申请日：2005-09-13
申请人： Stefano Schiaffino , Ashim Haque , Paul Martin , Daniel Steigerwald , Decai Sun
发明人： Stefano Schiaffino , Ashim Haque , Paul Martin , Daniel Steigerwald , Decai Sun
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/0095 , H01L33/20 , H01L33/38 , H01L2224/0603 , H01L2224/06102 , H01L2224/48091 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor light emitting device including a light emitting layer disposed between an n-type region and a p-type region and contacts electrically connected to the n-type region and the p-type region is connected to a mount. A metal layer arbitrarily patterned to cover at least 20% of the area of the semiconductor light emitting device is plated on either a metal layer formed on the mount or a metal layer formed on one of the contacts. The plated metal layer may replace other known interconnecting techniques such as stud bumps. The semiconductor light emitting device is physically connected to the mount by causing interdiffusion between the contact surfaces of the metal layers. In some embodiments, a layer of solder is formed over the plated metal layer, and then the semiconductor light emitting device is physically connected to the mount by heating the solder.
摘要翻译：包括设置在n型区域和p型区域之间的发光层和与n型区域和p型区域电连接的触点的半导体发光器件连接到安装件。任意图案化以覆盖半导体发光器件的面积的至少20％的金属层被镀在形成在安装件上的金属层或形成在其中一个触点上的金属层上。电镀金属层可以替代其他已知的互连技术，例如柱状凸块。半导体发光器件通过引起金属层的接触表面之间的相互扩散而物理连接到安装座。在一些实施例中，在电镀金属层上形成焊料层，然后半导体发光器件通过加热焊料物理连接到安装座。

30. 发明授权

US06390585B1 Selectively warming a printhead for optimized performance 失效
标题翻译：选择性地加热打印头以优化性能
公开(公告)号：US06390585B1
公开(公告)日：2002-05-21
申请号：US09120858
申请日：1998-07-21
申请人： Stefano Schiaffino , Sebastia Castelltort , David H. Donovan
发明人： Stefano Schiaffino , Sebastia Castelltort , David H. Donovan
IPC分类号： B41J2938
CPC分类号： B41J29/377
摘要： A system and method are provided for selectively warming a printhead in response to a relatively sudden change in one or more operating conditions of a printer. These operating conditions may include, for example, duty cycle, print density, print speed, and the like, which can be empirically detected, calculated, or predicted. Because sudden changes in printing conditions generally do not occur frequently, the printhead will not be warmed at all for much of its operating time. This reduces dramatic fluctuations in drop volume, to prevent thermal banding, while not maintaining the printhead at an undesirably high temperature.
摘要翻译：提供了一种系统和方法，用于响应于打印机的一个或多个操作条件中的相对突然的变化来选择性地加热打印头。这些操作条件可以包括例如占空比，打印浓度，打印速度等，其可以经验检测，计算或预测。由于打印条件的突然变化通常不会频繁出现，所以打印头在大部分时间内都不会变暖。这可以减少液滴体积的剧烈波动，以防止热带化，同时不将打印头保持在不期望的高温下。

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