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21. 发明授权

US06781508B2 Radio frequency data communications device with adjustable receiver sensitivity and method 失效
标题翻译：射频数据通信设备具有可调接收灵敏度和方法
公开(公告)号：US06781508B2
公开(公告)日：2004-08-24
申请号：US10315427
申请日：2002-12-09
申请人： Mark E. Tuttle , John R. Tuttle
发明人： Mark E. Tuttle , John R. Tuttle
IPC分类号： H04Q100
CPC分类号： H01Q1/2225 , G01S13/767 , G01S13/78 , G06K7/10346 , G06K19/0723 , G06K19/0726 , G06K19/07749 , H01Q1/22 , H01Q7/00
摘要： An adjustable radio frequency data communications device has a monolithic semiconductor integrated circuit with integrated circuitry, interrogation receiving circuitry provided on the monolithic integrated circuit forming at least part of the integrated circuitry and configured to receive an interrogation signal from the interrogator unit, an antenna electrically coupled to the interrogation receiving circuitry and configured to communicate with the remote interrogator unit, a power source electrically coupled to the integrated circuitry and configured to generate operating power for the communications device, and at least one of the antenna and the interrogation receiving circuitry having reconfigurable electrical characteristics, the electrical characteristics being reconfigurable to selectively tune the at least one of the antenna and the interrogation receiving circuitry within a range of tuned and detuned states to realize a desired receiver sensitivity of the communications device.
摘要翻译：一种可调节射频数据通信设备具有集成电路的单片半导体集成电路，在单片集成电路上提供的询问接收电路，其形成集成电路的至少一部分并且被配置为从询问器单元接收询问信号，天线电耦合所述询问接收电路被配置为与所述远程询问器单元通信;电源，其耦合到所述集成电路并且被配置为生成所述通信设备的操作功率，并且所述天线和所述询问接收电路中的至少一个具有可重新配置的电特性，电特性是可重构的，以在调谐和失谐状态的范围内选择性地调谐天线和询问接收电路中的至少一个，以实现通信设备的期望接收机灵敏度 e。

22. 发明授权

US06492192B1 Method of making a Schottky diode in an integrated circuit 有权
标题翻译：在集成电路中制作肖特基二极管的方法
公开(公告)号：US06492192B1
公开(公告)日：2002-12-10
申请号：US09151936
申请日：1998-09-11
申请人： James E. O'Toole , John R. Tuttle , Mark E. Tuttle , Tyler Lowrey , Kevin M. Devereaux , George E. Pax , Brian P. Higgins , David K. Ovard , Shu-Sun Yu , Robert R. Rotzoll
发明人： James E. O'Toole , John R. Tuttle , Mark E. Tuttle , Tyler Lowrey , Kevin M. Devereaux , George E. Pax , Brian P. Higgins , David K. Ovard , Shu-Sun Yu , Robert R. Rotzoll
IPC分类号： H01L2100
CPC分类号： G06K19/0716 , G06K7/0008 , G06K7/10059 , G06K19/0707 , G06K19/0712 , G06K19/0723 , G06K19/0726 , G06K19/07749 , G06K19/07758 , G06K2017/0051 , H01Q1/2225 , H03L7/0995 , H03L7/148
摘要： A method of forming an integrated circuit including a Schottky diode includes providing a substrate of a first conductivity type, defining a region of a second conductivity type relative to the substrate and forming an insulator over the second conductivity type region. The method also includes removing an area of the insulator for definition of a contact hole, and removing an area encircling the contact hole and forming highly doped regions of the second conductivity type in second conductivity type regions encircling the contact hole. The method further includes depositing a Schottky metal in the contact hole and annealing the metal to form a suicide interface to the second conductivity type region.
摘要翻译：形成包括肖特基二极管的集成电路的方法包括提供第一导电类型的衬底，其限定相对于衬底的第二导电类型的区域，并在第二导电类型区域上形成绝缘体。该方法还包括去除用于定义接触孔的绝缘体的区域，以及去除围绕接触孔的区域，并且在围绕接触孔的第二导电类型区域中形成第二导电类型的高掺杂区域。该方法还包括在接触孔中沉积肖特基金属并退火金属以形成与第二导电类型区域的硅化物界面。

23. 发明授权

US06417561B1 Keepers for MRAM electrodes 有权
标题翻译： MRAM电极保管人
公开(公告)号：US06417561B1
公开(公告)日：2002-07-09
申请号：US09916884
申请日：2001-07-27
申请人： Mark E. Tuttle
发明人： Mark E. Tuttle
IPC分类号： H01L23552
CPC分类号： H01L27/222 , B82Y10/00 , H01L43/12
摘要： A magnetic memory device, preferably a magnetic random access memory (MRAM) and method for forming same are described wherein a bit region sensitive to magnetic fields and preferably comprising a tunneling magnetoresistance (TMR) structure is located between a top electrode with a magnetic keeper and a bottom electrode with a magnetic keeper. The top electrode is preferably made of copper using a damascene process. The magnetic keeper of the top electrode includes at least a magnetic material layer (e.g., Co—Fe) but in the illustrated embodiments also includes one or more barrier layer (e.g., Ta). Various embodiments describe structures wherein the magnetic keeper stack is in contact with one, two or three surfaces of the top electrode, which face outward from the device.
摘要翻译：描述了一种磁存储器件，优选磁性随机存取存储器（MRAM）及其形成方法，其中对磁场敏感并且优选地包括隧道磁阻（TMR）结构的位区位于具有磁力保持器的顶部电极之间，具有磁力保持器的底部电极。顶部电极优选使用镶嵌工艺由铜制成。顶部电极的磁力保持器至少包括磁性材料层（例如Co-Fe），但是在所示实施例中还包括一个或多个阻挡层（例如Ta）。各种实施例描述了其中磁力保持器堆叠与顶部电极的一个，两个或三个表面接触的结构，其面向设备的外部。

24. 发明授权

US06413788B1 Keepers for MRAM electrodes 有权
标题翻译： MRAM电极保管人
公开(公告)号：US06413788B1
公开(公告)日：2002-07-02
申请号：US09796326
申请日：2001-02-28
申请人： Mark E. Tuttle
发明人： Mark E. Tuttle
IPC分类号： H01L2100
CPC分类号： H01L27/222 , B82Y10/00 , H01L43/12
摘要： A magnetic memory device, preferably a magnetic random access memory (MRAM) and method for forming same are described wherein a bit region sensitive to magnetic fields and preferably comprising a tunneling magnetoresistance (TMR) structure is located between a top electrode with a magnetic keeper and a bottom electrode with a magnetic keeper. The top electrode is preferably made of copper using a damascene process. The magnetic keeper of the top electrode includes at least a magnetic laterial layer (e.g., Co—Fe) but in the illustrated embodiments also includes one or more barrier layer (e.g., Ta). Various embodiments describe structures wherein the magnetic keeper stack is in contact with one, two or three surfaces of the top electrode, which face outward from the device.
摘要翻译：描述了一种磁存储器件，优选磁性随机存取存储器（MRAM）及其形成方法，其中对磁场敏感并且优选地包括隧道磁阻（TMR）结构的位区位于具有磁力保持器的顶部电极之间，具有磁力保持器的底部电极。顶部电极优选使用镶嵌工艺由铜制成。顶部电极的磁力保持器至少包括磁性材料层（例如Co-Fe），但是在所示实施例中还包括一个或多个阻挡层（例如Ta）。各种实施例描述了其中磁力保持器堆叠与顶部电极的一个，两个或三个表面接触的结构，其面向设备的外部。

25. 发明授权

US06337634B1 Radio frequency data communications device 有权
标题翻译：射频数据通信设备
公开(公告)号：US06337634B1
公开(公告)日：2002-01-08
申请号：US09151358
申请日：1998-09-10
申请人： James E. O'Toole , John R. Tuttle , Mark E. Tuttle , Tyler Lowrey , Kevin M. Devereaux , George E. Pax , Brian P. Higgins , David K. Ovard , Shu-Sun Yu , Robert R. Rotzoll
发明人： James E. O'Toole , John R. Tuttle , Mark E. Tuttle , Tyler Lowrey , Kevin M. Devereaux , George E. Pax , Brian P. Higgins , David K. Ovard , Shu-Sun Yu , Robert R. Rotzoll
IPC分类号： H04Q100
CPC分类号： G06K19/0716 , G06K7/0008 , G06K7/10059 , G06K19/0707 , G06K19/0712 , G06K19/0723 , G06K19/0726 , G06K19/07749 , G06K19/07758 , G06K2017/0051 , H01Q1/2225 , H03L7/0995 , H03L7/148
摘要： A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.
摘要翻译：射频识别装置包括包括接收器，发射器和微处理器的集成电路。接收机和发射机一起定义了一个有效的应答器。集成电路优选地是包括接收器，发射器和微处理器的单片单片集成电路。由于该设备包括有源应答器，而不是依赖于磁耦合功率的转发器，该器件具有更大的范围。

26. 发明授权

US06329213B1 Methods for forming integrated circuits within substrates 失效
标题翻译：在基板内形成集成电路的方法
公开(公告)号：US06329213B1
公开(公告)日：2001-12-11
申请号：US08847123
申请日：1997-05-01
申请人： Mark E. Tuttle , Rickie C. Lake
发明人： Mark E. Tuttle , Rickie C. Lake
IPC分类号： H01L2100
CPC分类号： G06K19/0775 , G06K19/07749 , H01L2224/16225 , H01L2924/01078 , H01L2924/15153 , H01L2924/15165 , Y10T29/49155
摘要： The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an antenna within the recess; and c) providing an integrated circuit chip and a battery in electrical connection with the antenna. In another aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a substrate having a first recess and a second recess formed therein; b) printing a conductive film between the first and second recesses and within the first and second recesses, the conductive film forming electrical interconnects between and within the first and second recesses; c) providing a first electrical component within the first recess and in electrical connection with the electrical interconnects therein; d) providing a second electrical component within the second recess and in electrical connection with the electrical interconnects therein; and e) covering the first electrical component, the second electrical component and the conductive film with at least one protective cover. In another aspect, the invention includes an embedded circuit comprising: a) a substrate having a recess therein, the recess having a bottom surface and a sidewall surface joined to the bottom surface; b) interconnect circuitry formed on the bottom and sidewall surfaces; and c) an integrated circuit chip within the recess and operatively connected to the interconnect circuitry.
摘要翻译：本发明包括在衬底内形成集成电路的方法和嵌入式电路。一方面，本发明包括一种在衬底内形成集成电路的方法，包括：a）在衬底中设置凹陷; b）在凹槽内打印天线; 以及c）提供与天线电连接的集成电路芯片和电池。在另一方面，本发明包括在衬底内形成集成电路的方法，包括：a）提供具有形成在其中的第一凹部和第二凹部的衬底; b）在第一和第二凹部之间以及在第一和第二凹槽内印刷导电膜，导电膜在第一和第二凹槽内部和内部形成电互连; c）在所述第一凹槽内提供第一电气部件并与其中的电互连电连接; d）在所述第二凹槽内提供第二电气部件并与其中的电互连电连接; 以及e）用至少一个保护盖覆盖所述第一电气部件，所述第二电气部件和所述导电膜。在另一方面，本发明包括一种嵌入式电路，其包括：a）在其中具有凹部的衬底，所述凹部具有连接到所述底表面的底表面和侧壁表面; b）形成在底部和侧壁表面上的互连电路; 以及c）所述凹槽内的集成电路芯片并且可操作地连接到所述互连电路。

27. 发明授权

US06281799B1 Devices for sensing changes in environments proximate the devices, devices for sensing termites, and methods for sensing termites 有权
标题翻译：用于感测设备附近环境变化的设备，用于感测白蚁的设备以及用于感测白蚁的方法
公开(公告)号：US06281799B1
公开(公告)日：2001-08-28
申请号：US09373892
申请日：1999-08-12
申请人： Rickie C. Lake , Mark E. Tuttle
发明人： Rickie C. Lake , Mark E. Tuttle
IPC分类号： G08B2300
CPC分类号： A01M1/2011 , A01M1/026 , A01M2200/011
摘要： In one aspect, the invention encompasses a device for sensing a change in an environment proximate the device. The device includes a planar circuit of conductive material extending along a first plane and comprising at least two sub-circuits which are in parallel electrical configuration relative to one another. The conductive material comprises two ends. The sub-circuits are configured to be broken upon the change in the environment. The device further includes a pair of prongs. A first of the pair of prongs extends from one of the two ends of the conductive material, and a second of the pair of prongs extends from an other of the two ends of the conductive material. The first and second prongs extend along the first plane. Additionally, the device includes a circuit support having circuitry supported thereby and a pair of orifices extending therethrough. The prongs extend through the orifices to electrically connect the circuitry supported by the circuit support to the planar circuit of conductive material. In another aspect, the invention includes a method for sensing termites.
摘要翻译：在一个方面，本发明包括用于感测靠近设备的环境变化的设备。该装置包括沿着第一平面延伸的导电材料的平面电路，并且包括相对于彼此并联电构造的至少两个子电路。导电材料包括两端。子电路被配置为在环境变化时被破坏。该装置还包括一对插脚。一对插脚中的第一个从导电材料的两端之一延伸，并且一对插脚中的第二个从导电材料的两个端部中的另一个延伸。第一和第二分支沿第一平面延伸。此外，该装置包括具有由其支撑的电路的电路支架和一对延伸穿过其中的孔。插脚延伸穿过孔，以将由电路支撑件支撑的电路电连接到导电材料的平面电路。另一方面，本发明包括用于感测白蚁的方法。

28. 发明授权

US06271597B1 Methods for forming electrically conductive interconnections and electrically interconnected substrates 有权
标题翻译：形成导电互连和电互连基板的方法
公开(公告)号：US06271597B1
公开(公告)日：2001-08-07
申请号：US09429884
申请日：1999-10-29
申请人： Curtis M. Medlen , Mark E. Tuttle
发明人： Curtis M. Medlen , Mark E. Tuttle
IPC分类号： H01L2348
CPC分类号： H01L24/12 , B23K20/02 , B23K20/16 , B23K2101/38 , B23K2101/42 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01047 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/30105 , H05K3/321 , H05K2201/0382 , H05K2201/10674 , H05K2201/10984 , H05K2201/10992 , H01L2924/00
摘要： Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are formed within the layer of material and conductive masses are formed within the openings. A second substrate having conductive interconnect surfaces is provided. The conductive interconnect surfaces are then contacted with the conductive masses and deformed thereby. In one aspect, the interconnect surfaces are deformed in part by portions of the layer of material proximate the conductive masses. In another aspect, the layer of material is removed and the interconnect surfaces are deformed by the conductive masses themselves.
摘要翻译：描述形成导电互连和电互连基板的方法。在一个实施方式中，提供具有外表面的第一基板，并且在其上形成一层材料。开口形成在材料层内，导电块形成在开口内。提供具有导电互连表面的第二基板。然后导电互连表面与导电块接触并由此变形。在一个方面，互连表面部分地靠近导电块的材料层的一部分变形。另一方面，材料层被去除并且互连表面被导电块自身变形。

29. 发明授权

US06240625B1 Methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions 有权
标题翻译：形成薄型电池电路和结构的方法，以及形成钮扣式电池电路和结构的方法
公开(公告)号：US06240625B1
公开(公告)日：2001-06-05
申请号：US09429736
申请日：1999-10-27
申请人： Mark E. Tuttle
发明人： Mark E. Tuttle
IPC分类号： H01M642
CPC分类号： H01M2/1066 , H01M2/1044 , H01M2/204 , H01M6/42 , H02J7/0024 , H04B1/3883 , H05K3/321 , H05K2201/10037 , H05K2201/10515 , H05K2201/10643 , Y10T29/49108 , Y10T29/49114
摘要： Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.
摘要翻译：描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。电池包括相应的正极和负极。最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。电池可以并联或串联电连接。

30. 发明授权

US06220516B1 Method of manufacturing an enclosed transceiver 失效
标题翻译：封闭收发器的制造方法
公开(公告)号：US06220516B1
公开(公告)日：2001-04-24
申请号：US09008215
申请日：1998-01-16
申请人： Mark E. Tuttle , John R. Tuttle , Rickie C. Lake
发明人： Mark E. Tuttle , John R. Tuttle , Rickie C. Lake
IPC分类号： G06K1906
CPC分类号： H01Q1/2225 , G01S13/758 , G01S13/767 , G06K19/0702 , G06K19/0723 , G06K19/073 , G06K19/07749 , G06K19/07786 , H01L23/49855 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/16 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01Q1/22 , H01Q1/38 , H01Q9/28 , H01Q9/285 , H04L29/12254 , H04L29/12264 , H04L29/12311 , H04L29/1232 , H04L29/12783 , H04L29/12801 , H04L29/12839 , H04L61/2038 , H04L61/2046 , H04L61/2084 , H04L61/2092 , H04L61/35 , H04L61/6004 , H04L61/6022 , Y10T29/49171 , Y10T156/103 , H01L2924/00
摘要： The present invention teaches a method of manufacturing an enclosed transceiver, such as a radio frequency identification (“RFID”) tag. Structurally, in one embodiment, the tag comprises an integrated circuit (IC) chip, and an RF antenna mounted on a thin film substrate powered by a thin film battery. A variety of antenna geometries are compatible with the above tag construction. These include monopole antennas, dipole antennas, dual dipole antennas, a combination of dipole and loop antennas. Further, in another embodiment, the antennas are positioned either within the plane of the thin film battery or superjacent to the thin film battery.
摘要翻译：本发明教导了一种制造封闭收发器的方法，例如射频识别（RFID）标签。结构上，在一个实施例中，标签包括集成电路（IC）芯片和安装在由薄膜电池供电的薄膜基片上的RF天线。各种天线几何尺寸与上述标签结构兼容。这些包括单极天线，偶极天线，双偶极天线，偶极天线和环形天线的组合。此外，在另一个实施例中，天线位于薄膜电池的平面内或与薄膜电池相邻。

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