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21. 发明授权

US07186019B2 Thermal movement sensor 失效
标题翻译：热运动传感器
公开(公告)号：US07186019B2
公开(公告)日：2007-03-06
申请号：US10526052
申请日：2003-08-22
申请人： Gerd K. Binnig , Michel Despont , Mark A. Lantz , Peter Vettiger
发明人： Gerd K. Binnig , Michel Despont , Mark A. Lantz , Peter Vettiger
IPC分类号： G01N25/00
CPC分类号： G01Q60/58 , G11B9/1418
摘要： A transducer for detecting movement of an article mounted for movement in a plane, the transducer comprising: a heater facing the plane of movement of the article and having a temperature dependent resistance; and, an edge defined in the article between regions of different thermal conductivity; wherein, as the article describes the movement, the edge moves relative to the heater producing a corresponding variation in heat loss from the heater and a corresponding variation in resistance of the heater.
摘要翻译：一种用于检测安装成用于在平面中移动的物品的运动的换能器，所述换能器包括：加热器，其面向所述物品的运动平面并具有温度依赖性电阻; 以及在不同热导率的区域之间在物品中限定的边缘; 其中，当制品描述移动时，边缘相对于加热器移动，产生来自加热器的热损失的对应变化和加热器的相应的电阻变化。

22. 发明授权

US07146067B2 Microsystem switches 有权
公开(公告)号：US07146067B2
公开(公告)日：2006-12-05
申请号：US10482828
申请日：2002-06-07
申请人： Michel Despont , Ute Drechsler , Hugo E. Rothuizen , Peter Vettiger , Roland W. Widmer
发明人： Michel Despont , Ute Drechsler , Hugo E. Rothuizen , Peter Vettiger , Roland W. Widmer
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G11C23/00 , G02B6/122 , G02B6/3514 , G02B6/3518 , G02B6/3546 , G02B6/3576 , G02B6/358 , H01H1/0036 , H01H61/02 , H01H2001/0042 , H01H2001/0084 , H01H2061/006
摘要： A microsystem switch (1, 20, 25, 30, 33) has a support (2) defining a recess (3), and a flexible bridge (6) is mounted on the support (2) bridging the recess (3). The bridge (6) is shaped so as to hold selectively a concave stable state, in which the bridge bulges into the recess (3), and a convex stable state in which the bridge bulges out of the recess (3). The switch includes an actuator (8, 9; 26, 27) for effecting flexing of the bridge (6) between the stable states, and a switching element (7, 31, 34) is mounted on the bridge (6) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch (40, 55) has a support (41) defining a recess (42), and an elongate torsion member (44) is mounted on the support (41) bridging the recess (42). A flexible bridge (43, 56) is mounted on the support (41) bridging the recess (42) in a direction substantially perpendicular to the torsion member (44). The bridge (43, 56) is connected to the torsion member (44) at the cross-point thereof so that a first section of the bridge extends between the cross-point and one side of the recess (42) and a second section of the bridge extends between the cross-point and the opposite side of the recess (42). The bridge (43, 56) is shaped so as to hold selectively a first stable state, in which the first section of the bridge bulges into the recess and the second section of the bridge bulges out of the recess, and a second stable state in which this configuration is reversed. A switching element (45) is mounted at the cross-point of the bridge (43, 56) and torsion member (44), and an actuator (46a, 46b; 58a, 58b) is again provided for effecting flexing of the bridge (43, 56) between the stable states. Here, movement of the bridge (43, 56) between the stable states effects twisting of the torsion member (44) and rotation of the switching element (45) between an on position and an off position. Switching devices incorporating these switches, and switching apparatus comprising arrays of such switching devices, are also provided.

23. 发明授权

US06757125B2 Head suspension for disk-based data storage apparatus 失效
标题翻译：基于磁盘的数据存储设备的磁头悬架
公开(公告)号：US06757125B2
公开(公告)日：2004-06-29
申请号：US09917498
申请日：2001-07-27
申请人： Peter Vettiger , Walter Haeberle , Gerd Binnig
发明人： Peter Vettiger , Walter Haeberle , Gerd Binnig
IPC分类号： G11B2102
CPC分类号： G11B21/21 , G11B5/6064 , G11B5/607 , G11B5/6082
摘要： A head suspension for maintaining a gap between a read-write head and a data storage disk comprises a heater for heating gas in the gap; and a sensor for generating an output indicative of the thickness of the gap. The sensor generates the output in dependence on thermal conductance across the gap. The apparatus can be used to control the thickness of the gap.
摘要翻译：用于在读写头和数据存储盘之间保持间隙的磁头悬架包括用于加热间隙中的气体的加热器; 以及用于产生指示间隙的厚度的输出的传感器。传感器根据跨越间隙的导热产生输出。该装置可用于控制间隙的厚度。

24. 发明授权

US5739425A Cantilever with integrated deflection sensor 失效
标题翻译：悬臂与集成偏转传感器
公开(公告)号：US5739425A
公开(公告)日：1998-04-14
申请号：US699810
申请日：1996-08-19
申请人： Gerd Karl Binnig , Heinrich Rohrer , Peter Vettiger
发明人： Gerd Karl Binnig , Heinrich Rohrer , Peter Vettiger
IPC分类号： G01B21/30 , G01B7/34 , G01N27/00 , G01N37/00 , G01Q20/04 , G01Q70/10
CPC分类号： G01Q20/04 , B82Y35/00 , G01Q70/10 , Y10S977/873
摘要： A cantilever for scanning probe microscopy and other force or deflection measurements is described. The cantilever includes at least one one integrated strain sensing element within a constriction section (62) . The cantilever is improved over known cantilevers by reducing the longitudinal extension of the constriction, such that its contribution to the total deflection of the cantilever is reduced. The design of the cantilever is further improved by applying a beam (63) with an essentially triangular cross section in either a vertical or a horizontal plane or both.
摘要翻译：描述了用于扫描探针显微镜和其他力或偏转测量的悬臂。悬臂在收缩部分（62）内包括至少一个集成的应变感测元件。悬臂通过减小收缩部的纵向延伸而比已知的悬臂更大，从而减小其对悬臂的总挠度的贡献。通过在垂直或水平面或两者中施加具有基本三角形横截面的梁（63）来进一步改善悬臂的设计。

25. 发明授权

US5376587A Method for making cooling structures for directly cooling an active layer of a semiconductor chip 失效
标题翻译：制造用于直接冷却半导体芯片的有源层的冷却结构的方法
公开(公告)号：US5376587A
公开(公告)日：1994-12-27
申请号：US103363
申请日：1993-08-09
申请人： Peter Buchmann , Peter Unger , Peter Vettiger , Otto Voegeli
发明人： Peter Buchmann , Peter Unger , Peter Vettiger , Otto Voegeli
IPC分类号： G12B15/06 , H01L23/34 , H01L23/433 , H01L31/024 , H01L33/48 , H01L33/64 , H01S5/024 , H01L21/60
CPC分类号： H01L31/024 , H01L23/433 , H01L24/72 , H01L33/483 , H01L33/642 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48137 , H01L2224/4823 , H01L2224/48471 , H01L2224/73251 , H01L2224/73253 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/10329 , H01L2924/10336 , H01L2924/12042 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/19041 , H01L2924/3025 , H01S5/0071 , H01S5/02248 , H01S5/02264 , H01S5/02469 , H01S5/02476
摘要： Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink are disclosed. The inventive cooling structure consists of a current/voltage supply level, with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge is in thermal connection with the heat transfer structure that provides for heat flux between the inventive cooling structure and the heat sink. The inventive cooling structure of this invention can be used with semiconductor devices and/or with opto-electronic devices.
摘要翻译：公开了在其中形成电气元件的芯片的有源层和散热器之间进行直接传热的冷却结构。本发明的冷却结构包括电流/电压供应水平，其中金属结构和绝缘间隔物和/或层，部分被绝缘层覆盖并且随后是传热结构。传热桥与传热结构热连接，该传热结构在本发明的冷却结构和散热器之间提供热通量。本发明的本发明的冷却结构可以与半导体器件和/或光电器件一起使用。

26. 发明授权

US5247597A Optical fiber alignment 失效
标题翻译：光纤对准
公开(公告)号：US5247597A
公开(公告)日：1993-09-21
申请号：US898866
申请日：1992-06-15
申请人： Armin Blacha , Fritz Gfeller , Peter Vettiger
发明人： Armin Blacha , Fritz Gfeller , Peter Vettiger
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/00 , H01S5/00
CPC分类号： G02B6/4232 , G02B6/4202 , G02B6/4214
摘要： Alignment of an optical fiber coupled to a surface emitting or surface receiving optical element situated on a substrate wherein the optical fiber is situated in a via hole on an alignment chip. The alignment is bonded to the substrate using at least one solder bond.

27. 发明授权

US5177031A Method of passivating etched mirror facets of semiconductor laser diodes 失效
标题翻译：钝化半导体激光二极管的刻蚀镜面的方法
公开(公告)号：US5177031A
公开(公告)日：1993-01-05
申请号：US707557
申请日：1991-05-30
申请人： Peter L. Buchmann , David J. Webb , Peter Vettiger
发明人： Peter L. Buchmann , David J. Webb , Peter Vettiger
IPC分类号： H01L21/308 , H01L21/306 , H01L21/314 , H01L21/316 , H01L21/318 , H01S5/00 , H01S5/02 , H01S5/028
CPC分类号： H01L21/02052 , H01L21/02178 , H01L21/02266 , H01L21/02307 , H01L21/314 , H01L21/31616 , H01L21/3185 , H01S5/028 , H01S5/0203 , H01S5/0282 , Y10S438/958
摘要： A method of passivating etched mirror facets of semiconductor laser diodes which enhances device reliability.The etched mirror facet is first subjected to a weet-etch process to substantially remove any native oxide as well as any surface layer which may have been mechanically damaged during the preceding mirror etch process. Then, a passivation pre-treatment is applied whereby any residual oxygen is removed and a sub-monolayer is formed which permanently reduces the non-radiative recombination of minority carriers at the mirror facet. Finally, the pre-treated mirror surface is coated with a passivation layer to avoid any environmental effect on the mirror.
摘要翻译：钝化半导体激光二极管的蚀刻镜面的方法，这增强了器件的可靠性。蚀刻的镜面首先经受蚀刻蚀刻工艺，以基本上除去任何自然氧化物以及在前面的镜蚀刻工艺期间可能被机械损坏的任何表面层。然后，施加钝化预处理，由此除去任何残留的氧，并且形成亚单层，其永久地减少在镜面处的少数载流子的非辐射复合。最后，预处理的镜面涂有钝化层，以避免对镜子产生任何环境影响。

28. 发明授权

US4525730A Buried junction Josephson interferometer 失效
标题翻译：埋地约瑟夫逊干涉仪
公开(公告)号：US4525730A
公开(公告)日：1985-06-25
申请号：US445331
申请日：1982-11-29
申请人： Johannes G. Beha , Heinz Jaeckel , Peter Vettiger
发明人： Johannes G. Beha , Heinz Jaeckel , Peter Vettiger
IPC分类号： H01L39/22 , H01L27/12 , H01L45/00 , H01L45/02
CPC分类号： H01L39/223 , Y10S505/874
摘要： Planar junction Josephson interferometer in which the junctions (24) are "buried" underneath the interferometer bridge (27) connecting the junction counter-electrodes (25). The insulation (26) that separates the common base electrode (22) from the bridge (27) is extended between the bridge and the upper surfaces of the counter-electrodes. This design permits, without decreasing the interferometer loop inductance, a reduction of the interferometer area and thus results in a higher packaging density in logic or memory applications.The buried junction concept can be applied in symmetric or asymmetric interferometer designs with virtually any number of junctions, any type of input current control or current feeding scheme.The interferometer can be produced using conventional evaporation, photo-resist, and etch processes based on optical lithography. Further area reduction is achieved in applying e-beam or x-ray technology.
摘要翻译：平面接合约瑟夫森干涉仪，其中连接（24）“接地”在连接相对电极（25）的干涉仪桥（27）下方。将公共基极（22）与桥接器（27）分离的绝缘体（26）在桥接器和对置电极的上表面之间延伸。该设计允许在不降低干涉仪环路电感的情况下减少干涉仪面积，从而导致逻辑或存储器应用中更高的封装密度。掩埋连接点概念可以应用于对称或非对称干涉仪设计中，具有任何数量的连接点，任何类型的输入电流控制或电流馈送方案。干涉仪可以使用基于光学光刻的常规蒸发，光刻胶和蚀刻工艺制造。在应用电子束或x射线技术方面实现了进一步的面积减少。

29. 发明授权

US07928565B2 Semiconductor device with a high thermal dissipation efficiency 有权
标题翻译：具有高散热效率的半导体器件
公开(公告)号：US07928565B2
公开(公告)日：2011-04-19
申请号：US12709674
申请日：2010-02-22
申请人： Thomas J. Brunschwiler , Michel Despont , Mark A. Lantz , Bruno Michel , Peter Vettiger
发明人： Thomas J. Brunschwiler , Michel Despont , Mark A. Lantz , Bruno Michel , Peter Vettiger
IPC分类号： H01L23/34
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译：具有较高散热效率的半导体器件包括通过焊接附接到半导体器件的表面的导热结构。导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。

30. 发明授权

US07474602B2 Data storage device comprising write head with carbon element 有权
标题翻译：数据存储装置包括具有碳元素的写头
公开(公告)号：US07474602B2
公开(公告)日：2009-01-06
申请号：US10852668
申请日：2004-05-24
申请人： Urs T. Duerig , Bernd W. Gotsmann , Mark A. Lantz , Peter Vettiger
发明人： Urs T. Duerig , Bernd W. Gotsmann , Mark A. Lantz , Peter Vettiger
IPC分类号： G11B7/00 , G11B9/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G11B3/001
摘要： A data storage device is introduced. The data storage device comprises a write head. The write head comprises a heating element and a tip. The write head scans a data storage medium, wherein in an operation mode of the data storage device the tip is in contact with a surface of the data storage medium and heat is applied to the tip by means of the heating element. In order to achieve a good thermal contact between the tip and the data storage medium, the tip comprises a carbon element that is at least partially in contact with the surface in that operation mode. Such a write head can also be applied in the field of scanning probe lithography.
摘要翻译：引入数据存储装置。数据存储装置包括写头。写头包括加热元件和尖端。写头扫描数据存储介质，其中在数据存储设备的操作模式中，尖端与数据存储介质的表面接触，并且借助于加热元件将热量施加到尖端。为了在尖端和数据存储介质之间实现良好的热接触，尖端包括在该操作模式下至少部分地与表面接触的碳元素。这样的写头也可以应用于扫描探针光刻领域。

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