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    • 25. 发明授权
    • Method, apparatus, and system for flash memory
    • 闪存的方法,设备和系统
    • US07808053B2
    • 2010-10-05
    • US11618658
    • 2006-12-29
    • Gordon HallerLuan C. Tran
    • Gordon HallerLuan C. Tran
    • H01L27/088
    • H01L27/105H01L27/11526H01L27/11531
    • Embodiments of the present invention provide apparatus, methods and systems that include a substrate including a central region and a peripheral region; a plurality of layers above a surface of the substrate, a first plurality of pitch-multiplied spacers on a top surface of the plurality of layer, the first plurality of pitch-multiplied spacers being above the central region of the substrate, and a second plurality of pitch-multiplied spacers on the top surface of the plurality of layers, the second plurality of pitch-multiplied spacers above the peripheral region and including at least one pitch-multiplied spacer having a surface at a distance from the at least one pitch multiplied spacer having a surface at the boundary.
    • 本发明的实施例提供了包括包括中心区域和外围区域的基板的装置,方法和系统; 在所述基板的表面上方的多个层,在所述多个层的顶表面上的第一多个间距倍数间隔件,所述第一多个间距倍数间隔件在所述基板的中心区域的上方,以及第二多个 在所述多个层的顶表面上的间距倍增间隔物,所述第二多个间距倍增间隔物在所述外围区域上方,并且包括至少一个间距倍增间隔物,所述间距倍增间隔物具有距所述至少一个间距倍数间隔物 在边界有一个表面。
    • 26. 发明申请
    • Semiconductor Memory Device
    • 半导体存储器件
    • US20100144107A1
    • 2010-06-10
    • US12703502
    • 2010-02-10
    • Gordon HallerSanh Dang TangSteve Cummings
    • Gordon HallerSanh Dang TangSteve Cummings
    • H01L21/8242
    • H01L21/823487H01L27/10817H01L27/10823H01L27/10876H01L27/10888
    • A memory device comprising a vertical transistor includes a digit line that is directly coupled to the source regions of each memory cell. Because an electrical plug is not used to form a contact between the digit line and the source regions, a number of fabrication steps may be reduced and the possibility for manufacturing defects may also be reduced. In some embodiments, a memory device may include a vertical transistor having gate regions that are recessed from an upper portion of a silicon substrate. With the gate regions recessed from the silicon substrate, the gate regions are spaced further from the source/drain regions and, accordingly, cross capacitance between the gate regions and the source/drain regions may be reduced.
    • 包括垂直晶体管的存储器件包括直接耦合到每个存储器单元的源极区域的数字线。 由于不使用电插头来形成数字线和源极区之间的接触,所以可以减少多个制造步骤,并且还可以减少制造缺陷的可能性。 在一些实施例中,存储器件可以包括垂直晶体管,其具有从硅衬底的上部凹陷的栅极区域。 随着从硅衬底凹入的栅极区域,栅极区域与源极/漏极区域进一步间隔开,因此,可以减小栅极区域和源极/漏极区域之间的交叉电容。
    • 28. 发明申请
    • METHOD, APPARATUS, AND SYSTEM FOR FLASH MEMORY
    • 闪存存储器的方法,装置和系统
    • US20080162781A1
    • 2008-07-03
    • US11618658
    • 2006-12-29
    • Gordon HallerLuan C. Tran
    • Gordon HallerLuan C. Tran
    • G11C5/02G06F12/00H01L21/8239
    • H01L27/105H01L27/11526H01L27/11531
    • Embodiments of the present invention provide apparatus, methods and systems that include a substrate including a central region and a peripheral region; a plurality of layers above a surface of the substrate, a first plurality of pitch-multiplied spacers on a top surface of the plurality of layer, the first plurality of pitch-multiplied spacers being above the central region of the substrate, and a second plurality of pitch-multiplied spacers on the top surface of the plurality of layers, the second plurality of pitch-multiplied spacers above the peripheral region and including at least one pitch-multiplied spacer having a surface at a distance from the at least one pitch multiplied spacer having a surface at the boundary.
    • 本发明的实施例提供了包括包括中心区域和外围区域的基板的装置,方法和系统; 在所述基板的表面上方的多个层,在所述多个层的顶表面上的第一多个间距倍数间隔件,所述第一多个间距倍数间隔件在所述基板的中心区域的上方,以及第二多个 在所述多个层的顶表面上的间距倍增间隔物,所述第二多个间距倍增间隔物在所述外围区域上方,并且包括至少一个间距倍增间隔物,所述间距倍增间隔物具有距所述至少一个间距倍数间隔物 在边界有一个表面。
    • 30. 发明授权
    • Integrated circuits and methods of forming a field effect transistor
    • 集成电路和形成场效应晶体管的方法
    • US07329924B2
    • 2008-02-12
    • US11704487
    • 2007-02-09
    • Sanh D. TangGordon Haller
    • Sanh D. TangGordon Haller
    • H01L27/12
    • H01L29/0653H01L21/0237H01L21/02532H01L21/02595H01L21/0262H01L21/823412H01L21/823418H01L21/823481H01L21/84H01L27/1203
    • Integrated circuits and methods of forming field effect transistors are disclosed. In one aspect, an integrated circuit includes a semiconductor substrate comprising bulk semiconductive material. Electrically insulative material is received within the bulk semiconductive material. Semiconductor material is formed on the insulative material. A field effect transistor is included and comprises a gate, a channel region, and a pair of source/drain regions. In one implementation, one of the source/drain regions is formed in the semiconductor material, and the other of the source/drain regions is formed in the bulk semiconductive material. In one implementation, the electrically insulative material extends from beneath one of the source/drain regions to beneath only a portion of the channel region. Other aspects and implementations, including methodical aspects, are disclosed.
    • 公开了形成场效应晶体管的集成电路和方法。 在一个方面,集成电路包括包括本体半导体材料的半导体衬底。 电绝缘材料容纳在本体半导体材料内。 在绝缘材料上形成半导体材料。 包括场效应晶体管,并包括栅极,沟道区和一对源极/漏极区。 在一个实施方案中,源/漏区中的一个形成在半导体材料中,并且源/漏区中的另一个在体半导体材料中形成。 在一个实施方案中,电绝缘材料从源极/漏极区域之一延伸到仅沟道区域的仅一部分的下方。 公开了其他方面和实施方式,包括方法方面。