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    • 21. 发明授权
    • Ultraviolet light reflectance method for evaluating the surface
characteristics of opaque materials
    • 用于评估不透明材料表面特性的紫外光反射率法
    • US5825498A
    • 1998-10-20
    • US596469
    • 1996-02-05
    • Randhir P. S. ThakurMichael NuttallJ. Brett RolfsonRobert James Burke
    • Randhir P. S. ThakurMichael NuttallJ. Brett RolfsonRobert James Burke
    • G01B11/30G01B11/00
    • G01B11/303
    • Disclosed is a process for analyzing the surface characteristics of opaque materials. The method comprises in one embodiment the use of a UV reflectometer to build a calibration matrix of data from a set of control samples and correlating a desired surface characteristic such as roughness or surface area to the set of reflectances of the control samples. The UV reflectometer is then used to measure the reflectances of a test sample of unknown surface characteristics. Reflectances are taken at a variety of wavelengths, preferably between about 250 nanometers to about 400 nanometers. These reflectances are then compared against the reflectances of the calibration matrix in order to correlate the closest data in the calibration matrix. By so doing, a variety of information is thereby concluded, due to the broad spectrum of wavelengths used. This includes information pertaining to the roughness and surface area, as well as other surface characteristics such as grain size, grain density, grain shape, and boundary size between the grains. Surface characteristic evaluation can be conducted in-process in a manner which is non-destructive to the test sample. The method is particularly useful for determining the capacitance of highly granular polysilicon test samples used in the construction of capacitator plates in integrated circuit technology.
    • 公开了一种用于分析不透明材料的表面特性的方法。 该方法在一个实施方案中包括使用UV反射计来构建来自一组对照样品的数据的校准矩阵,并将期望的表面特性如粗糙度或表面积与对照样品的一组反射率相关联。 然后使用UV反射计测量未知表面特性的测试样品的反射率。 反射率以各种波长进行,优选在约250纳米至约400纳米之间。 然后将这些反射率与校准矩阵的反射率进行比较,以便将校准矩阵中最接近的数据相关联。 通过这样做,由于所使用的波长范围广,因此得出各种信息。 这包括关于粗糙度和表面积的信息,以及晶粒之间的其他表面特性,例如晶粒尺寸,晶粒密度,晶粒形状和边界尺寸。 表面特性评估可以以对测试样品非破坏性的方式进行。 该方法对于确定集成电路技术中用于构造电容器板的高度粒状多晶硅测试样品的电容特别有用。
    • 23. 发明授权
    • Reflectance method for evaluating the surface characteristics of opaque materials
    • 用于评估不透明材料表面特性的反射方法
    • US06452678B2
    • 2002-09-17
    • US09928286
    • 2001-08-10
    • Randhir P. S. ThakurMichael NuttallJ. Brett RolfsonRobert James Burke
    • Randhir P. S. ThakurMichael NuttallJ. Brett RolfsonRobert James Burke
    • G01B1100
    • G01B11/303
    • Disclosed is a process for analyzing the surface characteristics of opaque materials. The method comprises in one embodiment the use of a UV reflectometer to build a calibration matrix of data from a set of control samples and correlating a desired surface characteristic such as rouglness or surface area to the set of reflectances of the control samples. The UV reflectometer is then used to measure the reflectances of a test sample of unknown surface characteristics. Reflectances are taken at a variety of angles of reflection for a variety of wavelengths, preferably between about 250 nanometers to about 400 nanometers. These reflectances are then compared against the reflectances of the calibration matrix in order to correlate the closest data in the calibration matrix. By so doing, a variety of information is thereby concluded, due to the broad spectrum of wavelengths and angles of reflection used. This includes information pertaining to the roughness and surface area, as well as other surface characteristics such as grain size, grain density, grain shape, and boundary size between the grains. Surface characteristic evaluation can be conducted in-process in a manner which is non-destructive to the test sample. The method is particularly useful for determining the capacitance of highly granular polysilicon test samples used in the construction of capacitator plates in integrated circuit technology, and can be used to determine the existence of flat smooth surfaces, and the presence of prismatic and hemispherical irregularities on flat smooth surfaces.
    • 公开了一种用于分析不透明材料的表面特性的方法。 该方法在一个实施例中包括使用UV反射计来构建来自一组控制样本的数据的校准矩阵,并将期望的表面特性(例如粗糙度或表面积)与对照样品的一组反射率相关联。 然后使用UV反射计来测量未知表面特性的测试样品的反射率。 对于各种波长,优选在约250纳米到约400纳米之间的各种反射角拍摄反射率。 然后将这些反射率与校准矩阵的反射率进行比较,以便将校准矩阵中最接近的数据相关联。 通过这样做,由于广泛的波长和使用的反射角度,从而得出各种信息。 这包括关于粗糙度和表面积的信息,以及晶粒之间的其他表面特性,例如晶粒尺寸,晶粒密度,晶粒形状和边界尺寸。 表面特性评估可以以对测试样品非破坏性的方式进行。 该方法对于确定集成电路技术中电容器板结构中使用的高度粒状多晶硅测试样品的电容特别有用,可用于确定平坦光滑表面的存在,以及平面上存在棱镜和半球形不规则 光滑的表面。
    • 25. 发明授权
    • Reflectance method for evaluating the surface characteristics of opaque materials
    • US06275292B1
    • 2001-08-14
    • US09517473
    • 2000-03-02
    • Randhir P. S. ThakurMichael NuttallJ. Brett RolfsonRobert James Burke
    • Randhir P. S. ThakurMichael NuttallJ. Brett RolfsonRobert James Burke
    • G01B1130
    • G01B11/303
    • Disclosed is a process for analyzing the surface characteristics of opaque materials. The method comprises in one embodiment the use of a UV reflectometer to build a calibration matrix of data from a set of control samples and correlating a desired surface characteristic such as roughness or surface area to the set of reflectances of the control samples. The UV reflectometer is then used to measure the reflectances of a test sample of unknown surface characteristics. Reflectances are taken at a variety of angles of reflection for a variety of wavelengths, preferably between about 250 nanometers to about 400 nanometers. These reflectances are then compared against the reflectances of the calibration matrix in order to correlate the closest data in the calibration matrix. By so doing, a variety of information is thereby concluded, due to the broad spectrum of wavelengths and angles of reflection used. This includes information pertaining to the roughness and surface area, as well as other surface characteristics such as grain size, grain density, grain shape, and boundary size between the grains. Surface characteristic evaluation can be conducted in-process in a manner which is non-destructive to the test sample. The method is particularly useful for determining the capacitance of highly granular polysilicon test samples used in the construction of capacitator plates in integrated circuit technology, and can be used to determine the existence of flat smooth surfaces, and the presence of prismatic and hemispherical irregularities on flat smooth surfaces.
    • 27. 发明授权
    • Semiconductor processing method of forming hemispherical grain polysilicon and a substrate having a hemispherical grain polysilicon layer
    • 形成半球形晶粒多晶硅的半导体加工方法和具有半球形晶粒多晶硅层的衬底
    • US06187628B1
    • 2001-02-13
    • US08803689
    • 1997-02-24
    • Randhir P. S. ThakurMichael NuttallJohn K. ZahurakJohn P. Friedenreich
    • Randhir P. S. ThakurMichael NuttallJohn K. ZahurakJohn P. Friedenreich
    • H01L2170
    • H01L28/84
    • A semiconductor processing method of depositing a hemispherical grain polysilicon layer on a substrate includes, a) chemical vapor depositing a layer of silicon atop a substrate within a chemical vapor deposition reactor at a selected temperature and at a selected pressure; b) without removing the substrate from the reactor after providing the silicon layer, and without exposing the substrate to surface cleaning conditions within the reactor after providing the silicon layer, in situ exposing the silicon layer to oxidizing conditions within the reactor effective to grow a layer of silicon dioxide to a thickness of at least 5 Angstroms; and c) without removing the substrate from the reactor after the oxidizing step, in situ chemical vapor depositing a layer of hemispherical grain polysilicon over the silicon dioxide layer. Alternately, an oxide layer is chemical vapor deposited as opposed to grown by oxidation. Substrates produced according to the method are also disclosed.
    • 在半导体衬底上沉积半球状晶粒多晶硅层的半导体处理方法包括:a)在化学气相沉积反应器中在选定温度和选定压力下化学气相沉积一层硅衬底; b)在提供硅层之后没有从反应器中除去衬底,并且在提供硅层之后不使衬底暴露于反应器内的表面清洁条件,将硅层原位暴露于反应器内的氧化条件以有效地生长层 的二氧化硅至至少5埃的厚度; 和c)在氧化步骤之后不从反应器中除去衬底,在二氧化硅层上原位化学气相沉积半球状晶粒多晶硅层。 或者,与通过氧化生长相反,氧化物层是化学气相沉积的。 还公开了根据该方法制备的基板。
    • 28. 发明授权
    • Using implants to lower anneal temperatures
    • 使用植入物降低退火温度
    • US6027990A
    • 2000-02-22
    • US131453
    • 1998-08-10
    • Randhir P. S. ThakurMichael Nuttall
    • Randhir P. S. ThakurMichael Nuttall
    • H01L21/285H01L21/425
    • H01L21/28518
    • A method for lowering the anneal temperature required to form a multi-component material, such as refractory metal silicide. A shallow layer of titanium is implanted in the bottom of the contact area after the contact area is defined. Titanium is then deposited over the contact area and annealed, forming titanium silicide. A second embodiment comprises depositing titanium over a defined contact area. Silicon is then implanted in the deposited titanium layer and annealed, forming titanium silicide. A third embodiment comprises combining the methods of the first and second embodiments. In further embodiment, nitrogen, cobalt, cesium, hydrogen, fluorine, and deuterium are also implanted at selected times.
    • 降低形成诸如难熔金属硅化物的多组分材料所需的退火温度的方法。 在定义接触区域之后,在接触区域的底部注入浅层的钛。 然后将钛沉积在接触区域上并退火,形成硅化钛。 第二实施例包括在限定的接触区域上沉积钛。 然后将硅注入沉积的钛层并退火,形成硅化钛。 第三实施例包括组合第一和第二实施例的方法。 在进一步的实施方案中,氮,钴,铯,氢,氟和氘也在选定的时间被植入。
    • 29. 发明授权
    • Using implants to lower anneal temperatures
    • 使用植入物降低退火温度
    • US5885896A
    • 1999-03-23
    • US676587
    • 1996-07-08
    • Randhir P. S. ThakurMichael Nuttall
    • Randhir P. S. ThakurMichael Nuttall
    • H01L21/285H01L21/425
    • H01L21/28518
    • A method for lowering the anneal temperature required to form a multi-component material, such as refractory metal silicide. A shallow layer of titanium is implanted in the bottom of the contact area after the contact area is defined. Titanium is then deposited over the contact area and annealed, forming titanium silicide. A second embodiment comprises depositing titanium over a defined contact area. Silicon is then implanted in the deposited titanium layer and annealed, forming titanium silicide. A third embodiment comprises combining the methods of the first and second embodiments. In further embodiment, nitrogen, cobalt, cesium, hydrogen, fluorine, and denterium are also implanted at selected times.
    • 降低形成诸如难熔金属硅化物的多组分材料所需的退火温度的方法。 在定义接触区域之后,在接触区域的底部注入浅层的钛。 然后将钛沉积在接触区域上并退火,形成硅化钛。 第二实施例包括在限定的接触区域上沉积钛。 然后将硅注入沉积的钛层并退火,形成硅化钛。 第三实施例包括组合第一和第二实施例的方法。 在另外的实施方案中,氮,钴,铯,氢,氟和enter也在选定的时间植入。