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    • 23. 发明授权
    • Predictive power gating with optional guard mechanism
    • 具有可选保​​护机构的预测电源门控
    • US08219834B2
    • 2012-07-10
    • US12539978
    • 2009-08-12
    • Jayanta BasakPradip BoseAlper BuyuktosunogluAnita Lungu
    • Jayanta BasakPradip BoseAlper BuyuktosunogluAnita Lungu
    • G06F1/00G06F1/26G06F1/32
    • G06F1/3203
    • A mechanism is provided for predictively power gating a set of units within the data processing system. A second-level power gating controller monitors a set of events for each unit in a set of units within the data processing system. The second-level power gating controller identifies idle sequences of a predetermined set of cycles within the events from each unit where the unit is idle. The second-level power gating controller determines preceding sequences of a predetermined length that precede the idle sequences. The second-level power gating controller determines an accuracy of the preceding sequences. Responsive to the accuracy being above a threshold, the second-level power gating controller sends a permit command to a first-level power gating mechanism associated with the unit to permit power gating of the unit.
    • 提供了用于在数据处理系统内预测性地选通一组单元的机构。 二级电源门控控制器监视数据处理系统内的一组单元中的每个单元的一组事件。 第二级电力门控控制器从单元空闲的每个单元的事件内识别预定的一组周期的空闲序列。 第二级电源门控控制器确定在空闲序列之前的预定长度的先前序列。 二级电源门控控制器确定前面的序列的精度。 响应于精度高于阈值,二级电源门控控制器向与该单元相关联的一级电源门控机构发送许可命令,以允许该单元的电源门控。
    • 24. 发明授权
    • Methods for thermal management of three-dimensional integrated circuits
    • 三维集成电路热管理方法
    • US07487012B2
    • 2009-02-03
    • US11747279
    • 2007-05-11
    • Pradip BoseAlper BuyuktosunogluEren Kursun
    • Pradip BoseAlper BuyuktosunogluEren Kursun
    • G05D23/00
    • G05D23/1932
    • A method of dynamic thermal management in a multi-dimensional integrated circuit or device is provided. The method includes monitoring on-chip temperatures, power dissipation, and performance of device layers. The method includes comparing on-chip temperatures to thermal thresholds, on-chip power dissipation to power thresholds and on-chip performance to performance thresholds. Also, the method includes analyzing interactions between temperatures, power, and performance of different device layers within the multi-dimensional integrated circuits. The method includes activating layer-specific thermal and power management within performance constraints on one or more device layers through actuators in the corresponding device layers, depending on the severity of heating.
    • 提供了一种多维集成电路或器件中的动态热管理方法。 该方法包括监测片上温度,功耗和器件层的性能。 该方法包括将片上温度与热阈值进行比较,将片上功耗降至功率阈值,并将片上性能与性能阈值进行比较。 此外,该方法包括分析多维集成电路内不同器件层的温度,功率和性能之间的相互作用。 该方法包括根据加热的严重程度,通过相应设备层中的致动器在一个或多个设备层上的性能约束内激活层特定的热和功率管理。