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21. 发明授权

US07666777B2 Electronic structure with components connected by way of solderable connecting elements and method 有权
标题翻译：具有通过可焊接连接元件连接的部件的电子结构和方法
公开(公告)号：US07666777B2
公开(公告)日：2010-02-23
申请号：US11601540
申请日：2006-11-17
申请人： Michael Bauer , Markus Brunnbauer , Irmgard Escher-Poeppel , Jens Pohl , Christian Stuempfl
发明人： Michael Bauer , Markus Brunnbauer , Irmgard Escher-Poeppel , Jens Pohl , Christian Stuempfl
IPC分类号： H01L21/00
CPC分类号： H05K3/4015 , H01L21/4853 , H01L23/49805 , H01L23/49816 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H05K3/3436 , H05K2201/0379 , H05K2201/10242 , H05K2201/10515 , H05K2203/0597 , Y02P70/613
摘要： For the vertical electrical connection of a number of components, an electronic structure with at least two components has solderable connecting elements, which include at least one socket element and a solder ball stacked on the socket element. The socket element has a cylindrical core of an electrically conducting first material with a lateral surface, a bottom surface and a top surface. The core is surrounded with a cladding of an electrically insulating second material in such a way that the lateral surface of the core is covered by the cladding and the top surface and the bottom surface are kept free of the cladding.
摘要翻译：对于多个部件的垂直电连接，具有至少两个部件的电子结构具有可焊接的连接元件，其包括堆叠在插座元件上的至少一个插座元件和焊球。插座元件具有导电的第一材料的圆柱形芯，其具有侧表面，底表面和顶表面。芯被电绝缘的第二材料的包层围绕，使得芯的侧表面被包层覆盖，并且顶表面和底表面保持没有包层。

22. 发明授权

US07662664B2 Electronic circuit in a package-on-package configuration and method for producing the same 有权
标题翻译：电子封装的封装配置及其制造方法
公开(公告)号：US07662664B2
公开(公告)日：2010-02-16
申请号：US11780786
申请日：2007-07-20
申请人： Michael Bauer , Ludwig Heitzer , Jens Pohl , Peter Strobel , Christian Stuempfl
发明人： Michael Bauer , Ludwig Heitzer , Jens Pohl , Peter Strobel , Christian Stuempfl
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H05K1/141 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83191 , H01L2224/83192 , H01L2224/8388 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19043 , H01L2924/3025 , H05K3/3436 , H05K2201/049 , H05K2201/10515 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2924/3512
摘要： An electronic circuit in a package-on-package configuration includes: a lower subassembly with a first electronic element, a first wiring carrier, a first housing with a first redistribution layer and an arrangement of solder balls disposed on the first redistribution layer and an upper subassembly with a second electronic element mounted on the lower subassembly. A method for producing the electronic circuit in a package-on-package configuration includes: adhering an upper side of the first electronic element to an underside of the first redistribution layer via a radiation-crosslinking thermoplastic adhesive.
摘要翻译：封装在封装构造中的电子电路包括：具有第一电子元件的下部子组件，第一布线载体，具有第一再分布层的第一壳体和布置在第一再分布层上的焊球布置，以及上部子组件具有安装在下部子组件上的第二电子元件。一种封装在封装结构中的电子电路的制造方法，其特征在于，包括：通过辐射交联热塑性粘合剂将第一电子元件的上侧粘接到第一再分布层的下侧。

23. 发明申请

US20090079065A1 SEMICONDUCTOR DEVICE INCLUDING ELECTRONIC COMPONENT COUPLED TO A BACKSIDE OF A CHIP 有权
标题翻译：包括电子元件耦合到芯片背面的半导体器件
公开(公告)号：US20090079065A1
公开(公告)日：2009-03-26
申请号：US11859353
申请日：2007-09-21
申请人： Edward Furgut , Joachim Mahler , Michael Bauer
发明人： Edward Furgut , Joachim Mahler , Michael Bauer
IPC分类号： H01L23/488 , H01L21/66
CPC分类号： H01L23/49575 , H01L23/3121 , H01L23/481 , H01L23/552 , H01L24/13 , H01L24/16 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2224/02372 , H01L2224/05001 , H01L2224/05008 , H01L2224/05025 , H01L2224/051 , H01L2224/13025 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2225/06527 , H01L2225/06541 , H01L2225/06596 , H01L2924/00014 , H01L2924/01029 , H01L2924/01068 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/30107 , H01L2924/3025 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package includes a substrate, at least one chip including a first side and a backside opposite of the first side, the first side electrically coupled to the substrate, a conductive layer coupled to the backside of the at least one chip, and at least one electronic component coupled to the conductive layer and in electrical communication with the substrate.
摘要翻译：半导体封装包括衬底，至少一个芯片，包括第一侧和与第一侧相对的背面，第一侧电耦合到衬底，耦合到至少一个芯片的背面的导电层，并且至少耦合到导电层并与衬底电连通的一个电子部件。

24. 发明申请

US20090026558A1 SEMICONDUCTOR DEVICE HAVING A SENSOR CHIP, AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：具有传感器芯片的半导体器件及其制造方法
公开(公告)号：US20090026558A1
公开(公告)日：2009-01-29
申请号：US11574861
申请日：2005-08-18
申请人： Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
发明人： Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
IPC分类号： H01L23/04 , H01L21/56
CPC分类号： H01L31/0203 , H01L23/24 , H01L23/49861 , H01L24/83 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8314 , H01L2224/83192 , H01L2224/85385 , H01L2224/92247 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
摘要翻译：公开了一种半导体传感器装置和方法。在一个实施例中，半导体器件包括空腔壳体和传感器芯片。在一个实施例中，空腔壳体具有到周围的开口。传感器芯片的传感器区域面向所述开口。传感器芯片与空腔外壳机械分离。在一个实施例中，传感器芯片被嵌入到空腔壳体的空腔中的所有侧面上的橡胶弹性组合物中。

25. 发明授权

US07471639B1 Method and system for modulating media packets 有权
标题翻译：用于调制媒体包的方法和系统
公开(公告)号：US07471639B1
公开(公告)日：2008-12-30
申请号：US10421257
申请日：2003-04-22
申请人： Michael Bauer , Swaminatha V. Vasudevan , Biren Sood , Ran M. Oz
发明人： Michael Bauer , Swaminatha V. Vasudevan , Biren Sood , Ran M. Oz
IPC分类号： H04J9/00 , H04H20/30
CPC分类号： H04H20/42 , H04H20/33 , H04H20/38
摘要： A system and method for modulating a service conveying stream to be transmitted over a medium, the method includes: (i) receiving a service conveying packet belonging to the service conveying stream; and (ii) determining at least one modulation parameter for the modulation of the service conveying packet in response to at least one network topology characteristic and in response to at least one client related parameter. The system includes input ports and a management entity capable of determining modulation parameters.
摘要翻译：一种用于调制要通过介质发送的服务传送流的系统和方法，所述方法包括：（i）接收属于所述服务传送流的传送分组的服务; 以及（ii）响应于至少一个网络拓扑特性以及响应于至少一个客户端相关参数，确定用于所述服务传送分组的调制的至少一个调制参数。该系统包括输入端口和能够确定调制参数的管理实体。

26. 发明申请

US20080315438A1 SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER 有权
标题翻译：包含应力缓冲器的半导体器件
公开(公告)号：US20080315438A1
公开(公告)日：2008-12-25
申请号：US11766404
申请日：2007-06-21
申请人： Joachim Mahler , Alfred Haimerl , Angela Wieneke Kessler , Michael Bauer
发明人： Joachim Mahler , Alfred Haimerl , Angela Wieneke Kessler , Michael Bauer
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/85 , H01L23/29 , H01L23/3171 , H01L24/02 , H01L24/11 , H01L24/48 , H01L2224/0401 , H01L2224/05553 , H01L2224/13099 , H01L2224/48227 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/19042 , H01L2924/00 , H01L2224/45099
摘要： An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in electrical communication with the active area, and a ceramic inorganic stress-buffering layer disposed between the active area and the bond pad.
摘要翻译：集成电路包括被配置为安装到载体的第一表面，与第一表面间隔开的集成电路的有效区域，设置在有源区域上并与有源区域电连通的接合焊盘以及设置在陶瓷无机应力缓冲层在活动区域和键合垫之间。

27. 发明申请

US20080224301A1 Lead Structure for a Semiconductor Component and Method for Producing the Same 有权
标题翻译：半导体元件的引线结构及其制造方法
公开(公告)号：US20080224301A1
公开(公告)日：2008-09-18
申请号：US11927239
申请日：2007-10-29
申请人： Michael Bauer , Angela Kessler , Wolfgang Schober , Alfred Haimerl , Joachim Mahler
发明人： Michael Bauer , Angela Kessler , Wolfgang Schober , Alfred Haimerl , Joachim Mahler
IPC分类号： H01L23/04 , H01L21/00
CPC分类号： H01L23/49513 , H01L23/3107 , H01L23/3142 , H01L23/49586 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/83136 , H01L2224/83192 , H01L2224/838 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , Y10S977/938 , H01L2924/00012 , H01L2224/48227 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.
摘要翻译：用于半导体部件的引线结构包括：用于在塑料外壳组合物外部的外部连接的外部引线，用于塑料外壳组合物内的电连接的内部引线以及由引线材料构成的芯片安装岛。在离开内部引线的自由接触垫的同时，芯片安装岛的顶侧和内部引线配备有作为锚定层的纳米管。塑料外壳组合物布置在布置在内部引线上的纳米管之间的间隙中，而用于半导体芯片的粘合剂组合物布置在布置在芯片安装岛上的纳米管之间的间隙中。粘合剂组合物和塑料外壳组合物以无空隙的方式填充空隙。

28. 发明申请

US20080173998A1 CHIP ARRANGEMENT AND METHOD FOR PRODUCING A CHIP ARRANGEMENT 有权
标题翻译：芯片布置及生产芯片布置方法
公开(公告)号：US20080173998A1
公开(公告)日：2008-07-24
申请号：US11675956
申请日：2007-02-16
申请人： Joachim Mahler , Alfred Haimerl , Michael Bauer
发明人： Joachim Mahler , Alfred Haimerl , Michael Bauer
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L23/48 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip arrangement includes semiconductor chips coupled to opposing sides of an insulating layer. The arrangement includes a first semiconductor chip having a first chip surface presenting a first chip conductive region. An electrically insulating layer includes a first layer surface presenting a first layer conductive region, and a second, opposing surface presenting a second layer conductive region. The electrically insulating layer is coupled to the first semiconductor chip by applying the first layer conductive region to the first chip conductive region. The electrically insulating layer is then coupled to the second chip conductive region by applying the second layer conductive region to the second chip conductive region.
摘要翻译：芯片布置包括耦合到绝缘层的相对侧的半导体芯片。该装置包括具有呈现第一芯片导电区域的第一芯片表面的第一半导体芯片。电绝缘层包括呈现第一层导电区域的第一层表面和呈现第二层导电区域的第二相对表面。电绝缘层通过将第一层导电区域施加到第一芯片导电区域而耦合到第一半导体芯片。然后通过将第二层导电区域施加到第二芯片导电区域将电绝缘层耦合到第二芯片导电区域。

29. 发明申请

US20080093484A1 Injection Nozzle 审中-公开
标题翻译：注射喷嘴
公开(公告)号：US20080093484A1
公开(公告)日：2008-04-24
申请号：US11813794
申请日：2005-12-21
申请人： Wolfgang Stoecklein , Andreas Rau , Michael Bauer , Andreas Gruenberger
发明人： Wolfgang Stoecklein , Andreas Rau , Michael Bauer , Andreas Gruenberger
IPC分类号： F02M51/06
CPC分类号： F02M47/027 , F02M47/02 , F02M51/0603
摘要： An injection nozzle for an internal combustion engine, in particular in a motor vehicle, the nozzle including a nozzle body having at least one injection port, a nozzle needle supported to execute a stroke inside the nozzle body to control an injection of fuel through the at least one injection port, a booster piston that is drive-coupled to an actuator and having a booster surface, the nozzle needle or a needle unit including the nozzle needle having a control surface that is hydraulically coupled to the booster surface. A bypass piston is supported to execute a stroke inside the booster piston, the bypass piston having a bypass surface that is hydraulically coupled to the booster surface, the bypass piston resting against a stop that is stationary in relation to the nozzle body, in an initial state in which the nozzle needle closes the at least one injection port, and the bypass piston having a reservoir surface that delimits a reservoir provided inside the booster piston.
摘要翻译：一种用于内燃机，特别是机动车辆的喷嘴，所述喷嘴包括具有至少一个喷射口的喷嘴主体，所述喷嘴主体被支撑以执行所述喷嘴体内的行程，以控制燃料通过所述喷嘴至少一个注射口，一个与致动器驱动耦合并具有助力表面的助力器活塞，该喷嘴针或一个针单元，其包括具有液压耦合到助力表面的控制表面的喷嘴针。旁路活塞被支撑以执行增压活塞内的冲程，旁路活塞具有液压耦合到增压器表面的旁路表面，旁路活塞以相对于喷嘴主体静止的止挡件为基础，初始位置所述喷嘴针关闭所述至少一个喷射口的状态，所述旁路活塞具有限定设置在所述增压活塞内的储存器的储存器表面。

30. 发明申请

US20080017972A1 ELECTRONIC CIRCUIT IN A PACKAGE-IN-PACKAGE CONFIGURATION AND PRODUCTION METHOD 有权
标题翻译：包装配置和生产方法中的电子电路
公开(公告)号：US20080017972A1
公开(公告)日：2008-01-24
申请号：US11780767
申请日：2007-07-20
申请人： Michael Bauer , Ludwig Heitzer , Christian Stuempfl
发明人： Michael Bauer , Ludwig Heitzer , Christian Stuempfl
IPC分类号： H01L23/04 , H01L21/02
CPC分类号： H01L23/49551 , H01L24/48 , H01L25/105 , H01L25/16 , H01L2224/48091 , H01L2224/48247 , H01L2225/1029 , H01L2225/1088 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic circuit in a package-in-package configuration and a production method is disclosed. One embodiment provides an arrangement enveloped by an encapsulation and composed of at least one semiconductor element on an element carrier, at least one leadframe with at least one inner contact-connection, at least one inner lead running within the encapsulation, and at least one outer contact-connection led out from the encapsulation. The inner lead has an exposed inner lead section which can be contact-connected from the outer side of the package-in-package configuration.
摘要翻译：公开了一种封装形式的电子电路及制造方法。一个实施例提供了由封装包围并由元件载体上的至少一个半导体元件组成的布置，至少一个引线框架，其具有至少一个内部接触连接，至少一个内部引线，位于封装内，以及至少一个外部接头连接从封装引出。内引线具有暴露的内引线部分，其可以从封装形式的封装构造的外侧接触连接。

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