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1. 发明授权

US07471639B1 Method and system for modulating media packets 有权
标题翻译：用于调制媒体包的方法和系统
公开(公告)号：US07471639B1
公开(公告)日：2008-12-30
申请号：US10421257
申请日：2003-04-22
申请人： Michael Bauer , Swaminatha V. Vasudevan , Biren Sood , Ran M. Oz
发明人： Michael Bauer , Swaminatha V. Vasudevan , Biren Sood , Ran M. Oz
IPC分类号： H04J9/00 , H04H20/30
CPC分类号： H04H20/42 , H04H20/33 , H04H20/38
摘要： A system and method for modulating a service conveying stream to be transmitted over a medium, the method includes: (i) receiving a service conveying packet belonging to the service conveying stream; and (ii) determining at least one modulation parameter for the modulation of the service conveying packet in response to at least one network topology characteristic and in response to at least one client related parameter. The system includes input ports and a management entity capable of determining modulation parameters.
摘要翻译：一种用于调制要通过介质发送的服务传送流的系统和方法，所述方法包括：（i）接收属于所述服务传送流的传送分组的服务; 以及（ii）响应于至少一个网络拓扑特性以及响应于至少一个客户端相关参数，确定用于所述服务传送分组的调制的至少一个调制参数。该系统包括输入端口和能够确定调制参数的管理实体。

2. 发明授权

US08877328B2 Value document with printed areas partly covered with foil 有权
标题翻译：印刷区域的价值文件部分覆盖着箔
公开(公告)号：US08877328B2
公开(公告)日：2014-11-04
申请号：US10531389
申请日：2003-10-16
申请人： Michael Bauer , Werner Bochmann
发明人： Michael Bauer , Werner Bochmann
IPC分类号： B32B3/00 , B42D25/00
CPC分类号： B42D25/465 , B42D15/00 , B42D25/00 , B42D25/21 , B42D25/23 , B42D25/24 , B42D25/29 , B42D25/324 , B42D25/328 , Y10T428/24876
摘要： The invention relates to a data carrier having at least one printed area produced by intaglio printing and partly covered with a film, and to a method for producing said data carrier.
摘要翻译：本发明涉及一种具有至少一个印刷区域的数据载体，该打印区域由凹版印刷产生并且部分地被膜覆盖，并且涉及一种用于生成所述数据载体的方法。

3. 发明申请

US20130187482A1 ELECTRONIC RELAY, ELECTRONIC SYSTEM AND METHOD FOR SWITCHING A POWER CURRENT 审中-公开
标题翻译：电子继电器，电子系统和切换电源电流的方法
公开(公告)号：US20130187482A1
公开(公告)日：2013-07-25
申请号：US13512552
申请日：2010-11-26
申请人： Michael Bauer , Marc Brodbeck
发明人： Michael Bauer , Marc Brodbeck
IPC分类号： H03K17/00
CPC分类号： H03K17/005 , G08C17/02 , G08C2201/40 , H03K17/18 , Y10T307/773
摘要： The invention relates to an electronic relay with an input plug-in contact (30) and at least one output plug-in contact (87, 87a) for a current to be switched, an electronic component (104) for processing data and for actuating a semiconductor switch (116) for switching the current, a wireless communications interface (106, 108) for connection to a wireless communications network (150), wherein the wireless communications interface is embodied for receiving a first data signal (118, 126) and for receiving a first switching signal (120), a control plug-in contact (15) for receiving a second switching signal (122), wherein the electronic component is embodied such that the semiconductor switch is actuated for switching the current based upon the reception of the first or second switching signal, and such that the first data signal received via the wireless communications interface is processed and, based upon a result of the data processing of the first data signal, the semiconductor switch is actuated for switching the current.
摘要翻译：本发明涉及一种具有输入插入式触点（30）和用于切换电流的至少一个输出插入式触头（87,87a）的电子继电器，用于处理数据并致动的电子部件（104）用于切换电流的半导体开关（116），用于连接到无线通信网络（150）的无线通信接口（106,108），其中所述无线通信接口被实现为用于接收第一数据信号（118,126）和用于接收第一切换信号（120），用于接收第二切换信号（122）的控制插入式触点（15），其中所述电子部件被实施为使得所述半导体开关被致动以基于所述接收来切换所述电流并且使得经由无线通信接口接收的第一数据信号被处理，并且基于第一数据信号的数据处理的结果，半导体swi 手柄用于切换电流。

4. 发明申请

US20130068295A1 PROCESS AND APPARATUS FOR PRODUCING A GLASS SHEET COATED WITH A SEMICONDUCTOR MATERIAL 有权
标题翻译：用半导体材料制作玻璃板的方法和装置
公开(公告)号：US20130068295A1
公开(公告)日：2013-03-21
申请号：US13695167
申请日：2011-04-20
申请人： Frank Becker , John Bohland , Hubert Joachim Frenck , Michael Bauer , Robert Fischer , Kenneth R. Kormanyos , Norman W. Johnston
发明人： Frank Becker , John Bohland , Hubert Joachim Frenck , Michael Bauer , Robert Fischer , Kenneth R. Kormanyos , Norman W. Johnston
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/022425 , C03C17/002 , C03C17/22 , C03C17/347 , C03C17/3476 , C03C17/36 , C03C17/3678 , C03C2217/288 , C03C2217/289 , C03C2218/15 , C23C14/0629 , C23C14/5846 , H01L31/022466 , H01L31/03925 , H01L31/1828 , H01L31/206 , Y02E10/50 , Y02P70/521
摘要： The invention relates to a process for producing a glass sheet 10, 21 coated with a semiconductor material, which comprises the steps (a) production of a glass strip in a float bath 3 containing liquid tin; (b) discharge of the glass strip from the float bath 3 and optionally coating of the glass strip with a transparent, electrically conductive intermediate layer; (c) transfer of the uncoated or coated glass strip into a deposition chamber 5 for the physical deposition of the semiconductor material from the gas phase; and (d) coating of the coated or uncoated glass strip from step (c) with the semiconductor material by physical deposition of the semiconductor material from the gas phase at a gas pressure of at least 0.1 bar. The invention additionally relates to an apparatus for producing a glass strip coated with a semiconductor material, a process for producing a solar cell or a solar module and also a solar cell or a solar module which can be obtained by this process.
摘要翻译：本发明涉及一种涂覆有半导体材料的玻璃板10,21的制造方法，该方法包括以下步骤：（a）在含有液体锡的浮法槽3中制备玻璃带; （b）从浮液槽3排出玻璃带，并且可选地用透明的导电中间层涂覆玻璃带; （c）将未涂覆或涂覆的玻璃带转移到沉积室5中，用于从气相物理沉积半导体材料; 和（d）通过在至少0.1巴的气体压力下从气相物理沉积半导体材料，用半导体材料将步骤（c）中的涂覆或未涂覆的玻璃带涂覆。本发明还涉及一种用于制造涂覆有半导体材料的玻璃带的装置，一种太阳能电池或太阳能组件的制造方法，以及可以通过该方法获得的太阳能电池或太阳能组件。

5. 发明申请

US20120280349A1 PHOTOVOLTAIC MODULE STRUCTURE AND METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION BETWEEN TWO CONTACT LAYERS SPACED APART FROM ONE ANOTHER, IN PARTICULAR IN THE PHOTOVOLTAIC MODULE STRUCTURE 有权
标题翻译：光伏模块结构和方法，用于生产两个接触层之间的电导通连接，其中一个另外一个，特别是在光伏模块结构中
公开(公告)号：US20120280349A1
公开(公告)日：2012-11-08
申请号：US13512134
申请日：2010-11-10
申请人： Frank Becker , Michael Bauer , Jochen Frenck , Robert Fischer
发明人： Frank Becker , Michael Bauer , Jochen Frenck , Robert Fischer
IPC分类号： H01L27/14 , H01L31/18
CPC分类号： H01L31/1828 , H01L27/142 , H01L27/1421 , H01L31/022466 , H01L31/0392 , H01L31/03923 , H01L31/0463 , H01L31/0465 , H01L31/073 , Y02E10/541 , Y02E10/543 , Y02P70/521
摘要： The present invention relates to a photovoltaic module structure 1 and to a method for establishing an electrically conductive connection between two spaced contact layers 4″, 6′, in particular in the photovoltaic module structure 1 according to the invention. The production method is particularly simple and economical and the photovoltaic module structure 1 according to the invention enables a significant gain in efficiency.
摘要翻译：本发明涉及一种光伏模块结构1和一种用于在两个间隔开的接触层4“，6'之间，特别是在根据本发明的光伏组件结构1中建立导电连接的方法。制造方法特别简单且经济，根据本发明的光伏模块结构1能够显着提高效率。

6. 发明申请

US20120255493A1 GAS EVAPORATOR FOR COATING PLANTS 审中-公开
标题翻译：用于涂装植物的气体蒸发器
公开(公告)号：US20120255493A1
公开(公告)日：2012-10-11
申请号：US13502190
申请日：2010-10-12
申请人： Michael Bauer , Frank Becker , Jochen Frenck , Ingo Dannenberg , Michael Schlauch , Thomas Etzrodt , John Bohland , Jonas Knothe
发明人： Michael Bauer , Frank Becker , Jochen Frenck , Ingo Dannenberg , Michael Schlauch , Thomas Etzrodt , John Bohland , Jonas Knothe
IPC分类号： C23C16/448 , F25B29/00
CPC分类号： C23C16/4481 , C23C14/228
摘要： The present invention relates to gas evaporator devices (1) and methods for operating them. By virtue of the improvements according to the invention, the service life of conventional gas evaporator devices can be significantly improved, such that the maintenance and material outlay and hence the costs of the coating method are reduced. This is achieved by virtue of the fact that a shielding element (5) impermeable at least to passage of the material is provided at least between the mixture of gas and material flowing in the section (4), in which material to be evaporated is guided in a gas flow and is heated by the heating element (2), and the heating element (2).
摘要翻译：本发明涉及气体蒸发装置（1）及其操作方法。通过根据本发明的改进，可以显着改善常规气体蒸发器装置的使用寿命，从而降低了维护和材料费用以及因此降低了涂覆方法的成本。这是通过以下事实来实现的：至少在材料通过时不可渗透的屏蔽元件（5）至少设置在气体和在部分（4）中流动的材料的混合物之间，在该部分中，待蒸发的材料被引导在气流中并被加热元件（2）和加热元件（2）加热。

7. 发明申请

US20120178218A1 SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR THE PRODUCTION THEREOF 有权
标题翻译：具有半导体芯片的半导体器件及其制造方法
公开(公告)号：US20120178218A1
公开(公告)日：2012-07-12
申请号：US13423347
申请日：2012-03-19
申请人： Michael Bauer , Edward Fuergut
发明人： Michael Bauer , Edward Fuergut
IPC分类号： H01L21/60 , H01L21/56
CPC分类号： H01L23/3157 , H01L21/563 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/73 , H01L2224/05571 , H01L2224/05573 , H01L2224/274 , H01L2224/27618 , H01L2224/27831 , H01L2224/29011 , H01L2224/73104 , H01L2224/81191 , H01L2224/83191 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2224/05599
摘要： A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. The flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer having a UV B-stageable material. The UV B-stageable material is applied on the active surface of the semiconductor wafer.
摘要翻译：公开了一种半导体器件，其具有具有倒装芯片触点和钝化表面的有源表面的半导体芯片。倒装芯片触点由作为底部填充材料的电绝缘层包围，该层具有UVB级材料。将UV B级材料施加在半导体晶片的有源表面上。

8. 发明授权

US08168472B2 Semiconductor device having a semiconductor chip, and method for the production thereof 有权
标题翻译：具有半导体芯片的半导体装置及其制造方法
公开(公告)号：US08168472B2
公开(公告)日：2012-05-01
申请号：US13270265
申请日：2011-10-11
申请人： Michael Bauer , Edward Fuergut
发明人： Michael Bauer , Edward Fuergut
IPC分类号： H01L21/00
CPC分类号： H01L23/3157 , H01L21/563 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/73 , H01L2224/05571 , H01L2224/05573 , H01L2224/274 , H01L2224/27618 , H01L2224/27831 , H01L2224/29011 , H01L2224/73104 , H01L2224/81191 , H01L2224/83191 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2224/05599
摘要： A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer having a UV B-stageable material. The UV B-stageable material is applied on the active surface of the semiconductor wafer.
摘要翻译：公开了一种半导体器件，其具有具有倒装芯片触点和钝化表面的有源表面的半导体芯片。在一个实施例中，倒装芯片触点被作为底部填充材料的电绝缘层包围，该层具有UVB级材料。将UV B级材料施加在半导体晶片的有源表面上。

9. 发明授权

US07880300B2 Semiconductor chip comprising a metal coating structure and associated production method 有权
标题翻译：半导体芯片包括金属涂层结构和相关联的制造方法
公开(公告)号：US07880300B2
公开(公告)日：2011-02-01
申请号：US11692530
申请日：2007-03-28
申请人： Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
发明人： Michael Bauer , Alfred Haimerl , Angela Kessler , Joachim Mahler , Wolfgang Schober
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , H01L23/3142 , H01L23/53238 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05017 , H01L2224/05557 , H01L2224/05562 , H01L2224/05664 , H01L2224/1147 , H01L2224/13099 , H01L2224/45124 , H01L2224/48764 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/48 , H01L2224/05552
摘要： A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).
摘要翻译：半导体芯片（1）具有在半导体芯片（1）的有源上侧（3）上具有至少一个具有铜或铜合金的下金属层（8）的金属涂层结构（2），在其上具有中心配置有镍的金属层（9）。金属涂层结构（2）由钯和/或贵金属的上金属层（10）封端。具有镍和/或镍磷化物的中心金属层（9）相对于围绕金属涂层结构（2）的塑料封装模塑料具有粗糙界面（11）。

10. 发明授权

US07843055B2 Semiconductor device having an adhesion promoting layer and method for producing it 有权
标题翻译：具有粘附促进层的半导体装置及其制造方法
公开(公告)号：US07843055B2
公开(公告)日：2010-11-30
申请号：US11733555
申请日：2007-04-10
申请人： Michael Bauer , Markus Brunnbauer , Edward Fuergut , Joachim Mahler
发明人： Michael Bauer , Markus Brunnbauer , Edward Fuergut , Joachim Mahler
IPC分类号： H01L23/48 , H01L23/14
CPC分类号： H01L23/3142 , H01L23/49586 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/85399 , H01L2924/00014 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , Y10S977/902 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device and a method for producing it is disclosed. In one embodiment, an adhesion-promoting layer having nanoparticles is arranged between a circuit carrier and a plastic housing composition for the purpose of enhanced adhesion.
摘要翻译：公开了半导体器件及其制造方法。在一个实施方案中，为了增强附着力，在电路载体和塑料外壳组合物之间布置具有纳米颗粒的粘附促进层。

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