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    • 23. 发明授权
    • Method of sintering an injection-molded article
    • 烧结注塑制品的方法
    • US4836980A
    • 1989-06-06
    • US147345
    • 1988-01-22
    • Nobuo KashiwadaniHitoshi Ohta
    • Nobuo KashiwadaniHitoshi Ohta
    • B22F3/10
    • B22F3/1017
    • In a method of sintering an injection-molded article of raw material powder and organic binder, the injection-molded article already debinderized is initially heated up to a certain reaction temperature at which residual binder is removed from it. In subsequent decarburizing step, the residual binder is removed from the molded article under atmospheric or reduced pressure, while being supplied with H.sub.2 gas. Thereafter, in a reducing and sintering step, the molded article is heated up to a sintering temperature and is held at this temperature under reduced pressure for a predetermined period, with H.sub.2 gas being supplied. H.sub.2 content of the atmosphere in the decarburizing step is kept higher than that in the reducing and sintering step.
    • 在烧结原料粉末和有机粘合剂的注射成型制品的方法中,已经脱胶的注射成型制品最初被加热到从其中除去残留粘合剂的一定反应温度。 在随后的脱碳步骤中,在大气压或减压下,将剩余的粘合剂从模制品中除去,同时供给H 2气体。 然后,在还原烧结工序中,将成型体加热至烧结温度,在该温度下,在供给H2气的同时,在该温度下保持规定时间。 脱碳工序中的气氛的H 2含量保持高于还原烧结工序。
    • 25. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20130015915A1
    • 2013-01-17
    • US13547373
    • 2012-07-12
    • Yukio KOMATSUHitoshi OhtaDaisuke Awano
    • Yukio KOMATSUHitoshi OhtaDaisuke Awano
    • H01L25/00
    • G11C29/12005G11C16/00G11C16/0483G11C29/48G11C2029/1202
    • A semiconductor device including: a first pad to receive first and second test commands supplied from the outside; a voltage generator circuit to generate a test target voltage on the basis of the first and second test commands; a second pad to receive first and second monitor voltages supplied from the outside in response to respective of the first and second test commands, the first and second monitor voltages corresponding to respective lower and upper limit voltages of the test target voltage; and a comparator to output a first output signal at one of first and second logical levels by comparing the test target voltage with the first monitor voltage, and to output a second output signal at one of the first and second logical levels by comparing the test target voltage with the second monitor voltage.
    • 一种半导体器件,包括:第一焊盘,用于接收从外部提供的第一和第二测试命令; 电压发生器电路,用于基于第一和第二测试命令产生测试目标电压; 响应于第一和第二测试命令的相应而接收从外部提供的第一和第二监视电压的第二焊盘,第一和第二监视电压对应于测试目标电压的相应的下限和上限电压; 以及比较器,用于通过将测试目标电压与第一监视电压进行比较来输出第一和第二逻辑电平中的一个的第一输出信号,并且通过将测试目标进行比较来输出第一和第二逻辑电平之一的第二输出信号 电压与第二显示器电压。