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    • 23. 发明授权
    • Curable resin composition
    • 可固化树脂组合物
    • US07576167B2
    • 2009-08-18
    • US10564843
    • 2004-07-16
    • Shigeki MoriYukihiro NomuraKazuhiro IyoShinichi Sato
    • Shigeki MoriYukihiro NomuraKazuhiro IyoShinichi Sato
    • C08G77/06
    • C08L101/10C08G18/10C08G18/4825C08G18/4837C08G18/755C09J175/08C08G18/289
    • Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX1X2X3 or —SiR1X1X2 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR1X1X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.
    • 公开了一种湿固化型固化性树脂组合物,其含有:分子内具有含硅官能团的固化性树脂; 路易斯酸或作为固化催化剂的路易斯酸的络合物,所述路易斯酸选自金属卤化物和卤化硼,其在室温下快速固化。 含硅官能团由以下通式表示:-SiX1X2X3或-SiR1X1X2(其中,X1,X2和X3分别表示水解基团,可以相同或不同,R1表示取代或未取代的有机物 具有1至20个碳的基团)。 如果含硅官能团为-SiR1X1X2,则固化性树脂还分子内含有作为氨基甲酸酯,硫代氨基甲酸酯,尿素,硫脲,取代的脲,取代的硫脲,酰胺和硫键的氨基的极性成分,羟基,仲氨基和 叔氨基。 两部分型粘合剂是可固化树脂与固化催化剂分离的组成成分。
    • 24. 发明授权
    • Coil component
    • 线圈组件
    • US07515028B1
    • 2009-04-07
    • US12213753
    • 2008-06-24
    • Shinichi SatoSatoshi KurimotoMakoto MoritaAkira TakashimaSumio TakahashiYoshiaki Kitajima
    • Shinichi SatoSatoshi KurimotoMakoto MoritaAkira TakashimaSumio TakahashiYoshiaki Kitajima
    • H01F5/00
    • H01F17/045H01F27/027H01F27/292H01F41/10
    • A coil component having a low profile and being conducive to high-density mounting. The coil component includes a core 2 having a coil winding portion, and first and second flanges disposed on either end of the coil winding portion. The second flange is adapted to be mounted on a circuit board, and is configured of a substantially octagonal bottom surface having first and second peripheral surfaces and first through fourth omitted peripheral surfaces. The first terminal electrode is disposed across the first omitted peripheral surface and a part of the bottom surface, and the second terminal electrode is disposed across the second omitted peripheral surface and part of the bottom surface separated from the first terminal electrode. A winding is wound over the coil winding portion and has a first end electrically connected to the first terminal electrode at the first omitted peripheral surface, and a second end electrically connected to the second terminal electrode at the second omitted peripheral surface.
    • 具有低轮廓并有利于高密度安装的线圈部件。 线圈部件包括具有线圈绕组部分的芯体2和设置在线圈绕组部分的任一端的第一和第二凸缘。 第二凸缘适于安装在电路板上,并且由具有第一和第二外围表面以及第一至第四省略的外围表面的基本上八边形的底表面构成。 第一端子电极跨越第一省略的外周表面和底表面的一部分,并且第二端子电极跨越第二省略的外围表面和与第一端子电极分离的底表面的一部分。 绕组缠绕在线圈绕组部分上,并且在第一省略的外围表面上具有与第一端子电连接的第一端,以及在第二省略的外围表面与第二端子电连接的第二端。