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    • 21. 发明授权
    • Semiconductor light emitting element and method of manufacturing the same
    • 半导体发光元件及其制造方法
    • US07611992B2
    • 2009-11-03
    • US11942316
    • 2007-11-19
    • Atsuo Tsunoda
    • Atsuo Tsunoda
    • H01L21/306
    • H01L33/0079H01L33/22H01L33/32H01L33/405H01L33/44
    • A semiconductor light emitting element including a conductive substrate, a bonding metal layer formed on the conductive substrate, a barrier layer formed on the bonding metal layer, a reflective layer formed on the barrier layer, an ohmic electrode layer formed on the reflective layer, a second conductivity type semiconductor layer formed on the ohmic electrode layer, a light emitting layer formed on the second conductivity type semiconductor layer, and a first conductivity type semiconductor layer formed on the light emitting layer, wherein outer peripheries of the second conductivity type semiconductor layer, the light emitting layer, and the first conductivity type semiconductor layer are removed, and a method of manufacturing the same are provided.
    • 一种半导体发光元件,包括导电衬底,形成在导电衬底上的接合金属层,形成在接合金属层上的阻挡层,形成在阻挡层上的反射层,形成在反射层上的欧姆电极层, 形成在欧姆电极层上的第二导电类型半导体层,形成在第二导电类型半导体层上的发光层和形成在发光层上的第一导电类型半导体层,其中第二导电类型半导体层的外周, 去除发光层和第一导电型半导体层,并且提供其制造方法。
    • 22. 发明授权
    • Method for manufacturing semiconductor laser device
    • 制造半导体激光器件的方法
    • US07371595B2
    • 2008-05-13
    • US11262548
    • 2005-10-28
    • Atsuo TsunodaAkiyoshi Sugahara
    • Atsuo TsunodaAkiyoshi Sugahara
    • H01L21/00
    • H01S5/0425B82Y20/00H01S5/2086H01S5/22H01S5/3211H01S5/34326
    • A method for manufacturing a semiconductor laser device is provided in which deformation of a cap layer and a third cladding layer is inhibited and a protruding portion of an intermediate layer is removed. By coating outer peripheral portions facing an intermediate layer of a third cladding layer and an etching stop layer with a resist, inevitably removing at least the third cladding layer, and etching the intermediate layer and a cap layer in a second etching step, a protruding portion of the intermediate layer is removed, and the cap layer is prevented from being etched undesirably, whereby a ridge portion without irregularities with respect to a direction substantially perpendicular to a lamination direction is produced, and increase of an operation voltage and decrease of external differential quantum efficiency are prevented.
    • 提供了一种制造半导体激光器件的方法,其中抑制了盖层和第三覆层的变形,并且去除了中间层的突出部分。 通过涂覆面对第三包覆层的中间层的外周部分和具有抗蚀剂的蚀刻停止层,不可避免地至少去除第三包层,并且在第二蚀刻步骤中蚀刻中间层和覆盖层,突出部分 除去中间层,并且防止盖层被不期望地蚀刻,由此产生相对于基本上垂直于层叠方向的方向没有凹凸的脊部,并且增加操作电压并减小外部微分量子 防止效率。