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21. 发明授权

US5501943A Method of patterning an inorganic overcoat for a liquid crystal display electrode 失效
标题翻译：图案化用于液晶显示电极的无机外涂层的方法
公开(公告)号：US5501943A
公开(公告)日：1996-03-26
申请号：US391816
申请日：1995-02-21
申请人： Thomas J. Swirbel
发明人： Thomas J. Swirbel
IPC分类号： G02F1/1333 , G03F7/00 , B44C1/22
CPC分类号： G03F7/0007 , G02F1/133345
摘要： A method of photodefining a hardcoat material to cover electrodes on a substrate. The substrate and the circuit pattern are coated (10) with a thin film of a tetramethoxy silane or tetraisopropoxy titanate hardcoat material. A positive photoresist is applied (30) over the thin film of hardcoat material and selectively exposed to actinic radiation(40). The photoresist is developed (50) to expose portions of the underlying hardcoat film, and the hardcoat film is etched (50) with an alkaline etchant solution to form a pattern. The etching and developing take place in the same step. The photoresist is then removed (60), and the patterned hardcoat material is baked (70).
摘要翻译：确定硬涂层材料以覆盖基板上的电极的方法。用四甲氧基硅烷或四异丙氧基钛酸酯硬涂层材料的薄膜将衬底和电路图案涂覆（10）。将正性光致抗蚀剂（30）施加在硬涂层材料的薄膜上并选择性地暴露于光化辐射（40）。将光致抗蚀剂显影（50）以暴露下面的硬涂层的部分，并用碱性蚀刻剂溶液蚀刻（50）硬涂层以形成图案。蚀刻和显影发生在相同的步骤中。然后去除光致抗蚀剂（60），并烘烤图案化的硬涂层材料（70）。

22. 发明授权

US5436744A Flexible liquid crystal display with integrated driver circuit and display electrodes formed on opposite sides of folded substrate 失效
标题翻译：具有集成驱动电路的柔性液晶显示器和形成在折叠基板的相对侧上的显示电极
公开(公告)号：US5436744A
公开(公告)日：1995-07-25
申请号：US115625
申请日：1993-09-03
申请人： John K. Arledge , Thomas J. Swirbel
发明人： John K. Arledge , Thomas J. Swirbel
IPC分类号： G02F1/13 , G02F1/1333 , G02F1/1345
CPC分类号： G02F1/13452
摘要： A liquid crystal display (LCD) package (10) is made by creating an indium/tin oxide electrode (64) on the surface of a flexible substrate (60). The electrode is connected to conductive vias (68) in the flexible substrate by conductive runners (66) that are also indium/tin oxide with an overlayer of copper. The indium/tin oxide is typically sputtered, and the copper is sputtered or plated on selected portions of the runners. The conductive vias are further connected to a circuitry pattern (62) on an opposite side of the flexible substrate. A display driver (70) is attached to the circuitry pattern to drive the LCD (5). A second substrate (80), also with a film electrode (82) on it, is arranged in mutually opposing planar relationship to the flexible substrate in order to form a liquid crystal display. A liquid crystal material (86) is then filled in the gap between the two substrates creating an LCD module (10). The LCD module can be folded about a portion (72) of the flexible substrate so that the display driver circuit is directly underneath the film electrode. An adhesive bonding agent (77) is used to retain the flexible substrate in the folded position.
摘要翻译：通过在柔性基板（60）的表面上形成铟/锡氧化物电极（64）制成液晶显示器（LCD）封装（10）。电极通过也是具有铜覆盖层的铟/锡氧化物的导电流道（66）连接到柔性基板中的导电通孔（68）。铟/锡氧化物通常被溅射，并且铜被溅射或镀在选定的流道部分上。导电通孔进一步连接到柔性基板的相对侧上的电路图案（62）。显示驱动器（70）附接到电路图案以驱动LCD（5）。为了形成液晶显示器，与柔性基板相对的平面关系，配置有与其上的膜电极（82）相对的第二基板（80）。然后将液晶材料（86）填充在两个基板之间的间隙中，形成LCD模块（10）。 LCD模块可围绕柔性基板的一部分（72）折叠，使得显示驱动电路直接位于薄膜电极下方。使用粘合剂（77）将柔性基材保持在折叠位置。

23. 发明授权

US5153385A Transfer molded semiconductor package with improved adhesion 失效
标题翻译：转印模塑半导体封装具有改进的附着力
公开(公告)号：US5153385A
公开(公告)日：1992-10-06
申请号：US670648
申请日：1991-03-18
申请人： Frank J. Juskey , Lonnie L. Bernardoni , Thomas J. Swirbel , Barry M. Miles
发明人： Frank J. Juskey , Lonnie L. Bernardoni , Thomas J. Swirbel , Barry M. Miles
IPC分类号： B29C45/02 , B29L31/34 , H01L21/56 , H01L21/58 , H01L23/00 , H01L23/12 , H01L23/29 , H01L23/31 , H01L23/556
CPC分类号： H01L23/564 , H01L23/3121 , H01L23/556 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2224/8592 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/01092 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , Y10S428/901
摘要： A transfer molded pad array chip carrier is formed by mounting and wirebonding a semiconductor device (12) on a printed circuit board (10). The bottom side of the printed circuit board may have an array of solderable surfaces (24). A polymer coating (18) is applied over the semiconductor device (12), the wirebonds (16), and the top side of the printed circuit board (10) and cured. The coating (18) is then sputter etched in a partial vacuum to enhance the adhesion of the transfer molding compound (20) to the printed circuit board (10). The semiconductor device is encapsulated by a transfer molding process. The polymer coating (18) also provides a barrier to alpha particle emission, improves the moisture resistance of the completed package and reduces stress at the surface of the device.
摘要翻译：通过将半导体器件（12）安装和引线接合在印刷电路板（10）上而形成传送模压焊盘阵列芯片载体。印刷电路板的底侧可以具有可焊接表面（24）的阵列。将聚合物涂层（18）施加在半导体器件（12），引线键（16）和印刷电路板（10）的顶侧上并固化。然后在部分真空中溅射蚀刻涂层（18），以增强传递模塑料（20）与印刷电路板（10）的粘合性。半导体器件通过传递模制工艺进行封装。聚合物涂层（18）还提供了对α粒子发射的屏障，提高了完成的封装的耐湿性，并降低了器件表面的应力。

24. 发明授权

US08102667B2 Method and apparatus for spatially optimizing surface mount pads on a ball grid array package 有权
标题翻译：用于空间优化球栅阵列封装上的表面安装焊盘的方法和装置
公开(公告)号：US08102667B2
公开(公告)日：2012-01-24
申请号：US12259250
申请日：2008-10-27
申请人： Jeffrey A. Underwood , Thomas J. Swirbel , Michael J. Watkins
发明人： Jeffrey A. Underwood , Thomas J. Swirbel , Michael J. Watkins
IPC分类号： H05K7/10 , H05K7/12 , H05K1/02
CPC分类号： G06F17/5072 , G06F2217/40 , H01L23/49816 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： Method and apparatus for spatially optimizing the arrangement of surface mount pads on a ball grid array package. An array containing T surface mount pads with a diameter less than or equal to 0.4 millimeter is arranged in an array of rows and columns less than or equal to 0.5 millimeters center-to-center. The array of pads is subdivided into N groups of pads respectively numbered Gx (for X from 1 to N), each group containing Px pads (for X from 1 to N). Each pad in each group is located so as to maximize the number of empty spaces Sz that are adjacent to each pad, where Sz=(Gx−1). The number of fanout possibilities for each group (Px*Sz) is calculated, and then the total number of fanout possibilities, FP, is calculated using the function Σ1N (Px*Sz). The resulting spatially optimized pattern has a quality score, FP/T, that is equal to or greater than 2.
摘要翻译：用于空间优化球栅阵列封装上的表面安装焊盘布置的方法和装置。具有直径小于或等于0.4毫米的T表面安装焊盘的阵列以小于或等于中心到中心的0.5毫米的行和列的阵列布置。焊盘阵列被细分为N组焊盘，分别编号为Gx（X为1至N），每组包含Px焊盘（X为1至N）。每个组中的每个焊盘被定位成使与每个焊盘相邻的空白空间Sz的数量最大化，其中Sz =（Gx-1）。计算每个组（Px * Sz）的扇出可能性的数量，然后使用函数＆Sgr; 1N（Px * Sz）计算出扇出可能性的总数FP。得到的空间优化图案具有等于或大于2的质量得分FP / T。

25. 发明授权

US06388202B1 Multi layer printed circuit board 失效
标题翻译：多层印刷电路板
公开(公告)号：US06388202B1
公开(公告)日：2002-05-14
申请号：US08944192
申请日：1997-10-06
申请人： Thomas J. Swirbel , John K. Arledge , Joaquin Barreto
发明人： Thomas J. Swirbel , John K. Arledge , Joaquin Barreto
IPC分类号： H01R909
CPC分类号： H05K3/4644 , H05K3/0023 , H05K3/0035 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K3/4688 , H05K2201/0358
摘要： A high density multi-layer printed circuit board (100) is formed by building additional dielectric and metallization layers over a central core (110) of conventional PCB laminate construction. The central core has a metallization pattern (113, 114) on at least one surface. A photoimaged dielectric layer (130) is deposited on one side of the central core and overlies the metallization pattern. Vias (136) are formed in this dielectric layer by a photoimaging process, and an additional metallization pattern (133) on this layer is electrically connected to the underlying metallization pattern through these vias. A non-photoimageable dielectric layer (120) is deposited on the other side of the central core. Vias (126) are formed in this dielectric layer by a laser drilling process, and an additional metallization pattern (123) on this layer is electrically connected to an underlying metallization pattern through these laser drilled vias.
摘要翻译：通过在常规PCB叠层结构的中心芯（110）上建立附加的电介质和金属化层来形成高密度多层印刷电路板（100）。中心芯在至少一个表面上具有金属化图案（113,114）。光电介质层（130）沉积在中心芯的一侧上并覆盖金属化图案。通过光成像工艺在该电介质层中形成通孔（136），并且通过这些通孔将该层上的附加金属化图案（133）电连接到下面的金属化图案。不可光成像的介电层（120）沉积在中心芯的另一侧上。通过激光钻孔工艺在该电介质层中形成通孔（126），并且在该层上的另外的金属化图案（123）通过这些激光钻孔通孔电连接到下面的金属化图案。

26. 发明授权

US6000120A Method of making coaxial transmission lines on a printed circuit board 失效
标题翻译：在印刷电路板上制造同轴传输线的方法
公开(公告)号：US6000120A
公开(公告)日：1999-12-14
申请号：US61112
申请日：1998-04-16
申请人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
发明人： John K. Arledge , Joaquin Barreto , Thomas J. Swirbel , Jeffrey A. Underwood
IPC分类号： H01P11/00 , H05K1/02 , H05K3/00 , H05K3/46
CPC分类号： H05K1/0221 , H01P11/005 , H05K2201/09036 , H05K2201/09809 , H05K2201/09981 , H05K3/0023 , H05K3/4644 , Y10T29/49016 , Y10T29/49117
摘要： A method of forming a coaxial transmission line on a high density PCB. A metal strip (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.
摘要翻译：一种在高密度PCB上形成同轴传输线的方法。 PCB（104）上的金属条（102）形成屏蔽的底部，并被第一电介质（112）覆盖。在第一电介质中形成两个平行的沟槽（122），以露出金属条的部分（123）。信号导体（132）然后形成在第一电介质上。第二电介质（142）覆盖信号导体和第一电介质。第二组两个平行的沟槽（172）形成在紧邻第一两个沟槽上方的第二电介质中。金属（182）电镀在平行的沟槽中以接触金属条，并且还覆盖位于沟槽之间的第二电介质的一部分，以形成屏蔽。所得到的同轴传输线具有通过电介质与屏蔽层绝缘的中心导体。

27. 发明授权

US5631120A Method of forming a pattern with step features in a photopolymer 失效
标题翻译：在光聚合物中形成具有阶梯特征的图案的方法
公开(公告)号：US5631120A
公开(公告)日：1997-05-20
申请号：US619113
申请日：1996-03-20
申请人： Thomas J. Swirbel , Dale W. Dorinski
发明人： Thomas J. Swirbel , Dale W. Dorinski
IPC分类号： G03F7/16 , H05K3/00 , G03C5/00 , G03C5/16
CPC分类号： G03F7/168 , H05K3/0073 , H05K3/0082 , Y10S430/146
摘要： A stepped pattern is formed in a photoresist film (10) by heating the photoresist at a first temperature to soft bake it, and then heating only a selected portion (15) of the photoresist. That portion of the photoresist film is then heated at a temperature sufficient to partially degrade the photoresist. Another portion (22) of the photoresist film is then exposed to ultraviolet light to degrade it more fully than in the earlier step. The photoresist film is then developed under conditions sufficient to completely remove the portion exposed to ultraviolet light, and to partially remove the portion heated in the first step, thereby creating a stepped feature in the photoresist film.
摘要翻译：在光致抗蚀剂膜（10）中通过在第一温度下加热光致抗蚀剂来软化烘烤它，然后仅加热光刻胶的选定部分（15），形成阶梯图案。然后在足以使光致抗蚀剂部分降解的温度下加热光致抗蚀剂膜的那部分。然后光致抗蚀剂膜的另一部分（22）暴露于紫外光以使其比前面的步骤更完全地降解。然后在足以完全去除暴露于紫外线的部分的条件下显影光致抗蚀剂膜，并部分去除在第一步骤中加热的部分，从而在光致抗蚀剂膜中形成台阶特征。

28. 发明授权

US5457610A Low profile mechanical interconnect system having metalized loop and hoop area 失效
标题翻译：薄型机械互连系统具有金属化环和环面
公开(公告)号：US5457610A
公开(公告)日：1995-10-10
申请号：US69318
申请日：1993-06-01
申请人： Lonnie L. Bernardoni , Thomas J. Swirbel
发明人： Lonnie L. Bernardoni , Thomas J. Swirbel
IPC分类号： H05K3/30 , H05K3/32 , H05K9/00 , H05K1/14
CPC分类号： H05K3/325 , H05K3/303 , H05K2201/10371 , H05K2201/10568 , H05K2201/209 , Y02P70/613
摘要： A substrate (100) includes a surface (102) having a hook and loop fastener area (106). The area (106) is selectively metallized to produce interconnect points (108). The area (106) is used to attach a connector, another substrate, or a flex circuit to the substrate (100) without the use of solder or other conductive adhesives. The area (106) provides for the mechanical coupling. The selectively metallized areas (108) provide for the electrical coupling of the two substrates.
摘要翻译：衬底（100）包括具有钩和环紧固件区域（106）的表面（102）。区域（106）被选择性地金属化以产生互连点（108）。区域（106）用于将连接器，另一衬底或柔性电路连接到衬底（100），而不使用焊料或其它导电粘合剂。区域（106）提供机械联接。选择性金属化区域（108）提供两个基板的电耦合。

29. 发明授权

US5437941A Thin film electrical energy storage device 失效
标题翻译：薄膜电能储存装置
公开(公告)号：US5437941A
公开(公告)日：1995-08-01
申请号：US373903
申请日：1995-01-17
申请人： John K. Arledge , James L. Davis , Thomas J. Swirbel
发明人： John K. Arledge , James L. Davis , Thomas J. Swirbel
IPC分类号： H01G9/00 , H01G9/145 , H01M2/02 , H01M2/08 , H01M2/18 , H01M2/14
CPC分类号： H01G9/145 , H01M2/0212 , H01M2/08 , H01M2/18
摘要： An electrical energy storage device (10). An electrode (12) consisting of a thin film of metal or metal oxide is deposited on a substrate (24), preferably by sputtering. Spherical plastic spacers (16) are uniformly dispersed on the electrode at a maximum density of about 1000 spacers per square millimeter of the electrode area. A second substrate also has an electrode (14) formed of a thin film of metal or metal oxide deposited on it, similar to the first substrate. The first and second substrates are arranged so that the electrodes face each other and are separated by the spherical plastic spacers to form a gap (18) of about 20 microns between the electrodes. An electrolyte (20) is filled in the gap, and the edges of the gap are optionally sealed (22) to form the electrical energy storage device. The device may also be formed by using metal foils, and eliminating one or more of the substrates. In both cases, the use of an electrolyte is optional.
摘要翻译：一种电能存储装置（10）。优选通过溅射将由金属或金属氧化物薄膜组成的电极（12）沉积在基板（24）上。球形塑料间隔物（16）以电极面积每平方毫米约1000个间隔物的最大密度均匀分散在电极上。类似于第一衬底，第二衬底还具有由沉积在其上的金属或金属氧化物薄膜形成的电极（14）。第一和第二基板被布置成使得电极彼此面对并且被球形塑料间隔物隔开，以在电极之间形成约20微米的间隙（18）。电解质（20）填充在间隙中，并且间隙的边缘任选地被密封（22）以形成电能存储装置。该装置还可以通过使用金属箔形成，并且消除一个或多个基板。在这两种情况下，使用电解质都是可选的。

30. 发明授权

US5388025A Rechargeable electrical energy storage device having organometallic electrodes 失效
标题翻译：具有有机金属电极的可充电电能储存装置
公开(公告)号：US5388025A
公开(公告)日：1995-02-07
申请号：US937776
申请日：1992-09-01
申请人： James L. Davis , John K. Arledge , Thomas J. Swirbel , Melanie Williams
发明人： James L. Davis , John K. Arledge , Thomas J. Swirbel , Melanie Williams
IPC分类号： H01G9/058 , H01M4/60 , H01M10/36 , H01G9/00
CPC分类号： H01M4/60 , H01M10/36
摘要： A rechargeable electrical energy storage device (20). The cell has two electrodes (28, 36) constructed from a similar organometallic compound (30), and the electrodes are electrically connected by an ion carrying electrolyte (32). The electrodes are also physically separated from each other by a barrier (34) that will pass ions but not electrons. In one embodiment of the invention, the electrodes are ferrocene, and the electrolyte is sulfuric acid.
摘要翻译：一种可充电电能存储装置（20）。电池具有由类似的有机金属化合物（30）构成的两个电极（28,36），并且电极通过离子载体电解质（32）电连接。电极也通过将通过离子而不是电子的屏障（34）在物理上彼此分离。在本发明的一个实施方案中，电极是二茂铁，电解质是硫酸。

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