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    • 23. 发明授权
    • Manufacturing method of semiconductor integrated circuit devices and mask manufacturing methods
    • 半导体集成电路器件的制造方法和掩模制造方法
    • US06548312B1
    • 2003-04-15
    • US09640721
    • 2000-08-18
    • Katsuya HayanoNorio HasegawaAkira ImaiNaoko AsaiEiji TsujimotoTakahiro Watanabe
    • Katsuya HayanoNorio HasegawaAkira ImaiNaoko AsaiEiji TsujimotoTakahiro Watanabe
    • H01L2100
    • G03F7/70433
    • In order to inhibit or prevent a pattern abnormality such as the deformation or misalignment of a pattern of a semiconductor integrated circuit device, a light intensity is calculated based on the pattern data DBP of a mask and the aberration data DBL of a lens of a pattern exposure device (step 101) and then the results of the light intensity calculation is compared with the results of the light intensity calculated on condition that the lens of the pattern exposure device has no aberration (step 102), and then a pattern data exceeding an allowable level, of the pattern data of the mask, is corrected according to the amount of correction calculated on the basis of the results of the comparison such that the pattern data does not exceed the allowable level (step 104). The mask is manufactured by using the mask making data DBM after the correction and then is mounted on the pattern exposure device to transfer a predetermined pattern to a semiconductor wafer.
    • 为了抑制或防止诸如半导体集成电路器件的图案的变形或未对准的图案异常,基于掩模的图案数据DBP和图案的透镜的像差数据DBL计算光强度 曝光装置(步骤101),然后将光强度计算的结果与在图案曝光装置的透镜没有像差的条件下计算的光强度的结果进行比较(步骤102),然后模式数据超过 根据比较结果计算出的校正量,使图案数据不超过允许值(步骤104),对掩模的图案数据的允许电平进行校正。 通过在校正后使用掩模制作数据DBM来制造掩模,然后安装在图案曝光装置上以将预定图案转印到半导体晶片。
    • 28. 发明申请
    • Pattern Measuring Apparatus and Computer Program
    • 图案测量仪器和计算机程序
    • US20120267528A1
    • 2012-10-25
    • US13518706
    • 2010-12-01
    • Kei SakaiYafeng ZhangNorio Hasegawa
    • Kei SakaiYafeng ZhangNorio Hasegawa
    • H01J37/28
    • G03F7/70466G01B2210/56G06T7/001G06T2207/10061G06T2207/30148H01J2237/2817
    • A pattern measuring apparatus which can identify a kind of gaps formed by a manufacturing process having a plurality of exposing steps such as SADP, particularly, which can suitably access a gap even if a sample has the gap that is not easily accessed is disclosed. A feature amount regarding one end side of a pattern having a plurality of patterns arranged therein and a plurality of kinds of feature amounts regarding the other end side of the pattern are extracted from a signal detected on the basis of scanning of a charged particle beam. With respect to proper kinds of feature amounts among the plurality of kinds of feature amounts, the feature amount on one side of the pattern and that on the other end side of the pattern are compared. On the basis of the comparison, the kinds of spaces among the patterns are determined.
    • 公开了一种图案测量装置,其可以识别由具有多个曝光步骤的制造工艺形成的间隙,例如SADP,特别是即使样品具有不容易接近的间隙也能适当地接近间隙。 从基于扫描带电粒子束检测的信号中提取关于其中布置有多个图案的图案的一端侧的特征量和关于图案的另一端的多种特征量。 对于多种特征量中的适当种类的特征量,比较图案的一侧的特征量和图案的另一端的特征量。 在比较的基础上,确定了图案间的空间种类。