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    • 22. 发明授权
    • Memory device
    • 内存设备
    • US07242049B2
    • 2007-07-10
    • US10461593
    • 2003-06-11
    • Leonard ForbesJoseph E. Geusic
    • Leonard ForbesJoseph E. Geusic
    • H10L29/788
    • H01L29/66825H01L21/28273H01L27/10805H01L27/10873
    • A floating gate transistor has a reduced barrier energy at an interface with an adjacent gate insulator, allowing faster charge transfer across the gate insulator at lower voltages. Data is stored as charge on the floating gate. The data charge retention time on the floating gate is reduced. The data stored on the floating gate is dynamically refreshed. The floating gate transistor provides a dense and planar dynamic electrically alterable and programmable read only memory (DEAPROM) cell adapted for uses such as for a dynamic random access memory (DRAM) or a dynamically refreshed flash EEPROM memory. The floating gate transistor provides a high gain memory cell and low voltage operation.
    • 浮栅晶体管在与相邻栅极绝缘体的界面处具有降低的势垒能,允许在较低电压下跨越栅极绝缘体的更快的电荷转移。 数据作为电荷存储在浮动栅极上。 浮动栅极上的数据电荷保留时间减少。 存储在浮动门上的数据被动态刷新。 浮栅晶体管提供了适用于诸如用于动态随机存取存储器(DRAM)或动态刷新的快闪EEPROM存储器的密集且平面的动态电可更改和可编程只读存储器(DEAPROM)单元。 浮栅晶体管提供高增益存储单元和低电压工作。
    • 25. 发明授权
    • Method and structure for textured surfaces in floating gate tunneling oxide devices
    • 浮栅隧道氧化器件中纹理表面的方法和结构
    • US06476441B2
    • 2002-11-05
    • US09873701
    • 2001-06-04
    • Joseph E. GeusicLeonard Forbes
    • Joseph E. GeusicLeonard Forbes
    • H01L29788
    • H01L21/28273H01L29/511H01L29/7883
    • A method and structure for textured surfaces in non volatile floating gate tunneling oxide (FLOTOX) devices, e.g. FLOTOX transistors, are provided. The present invention capitalizes on using “self-structured masks” and a controlled etch to form nanometer scale microtip arrays in the textured surfaces. The microtips in the array of microtips have a more uniform size and shape and higher density (˜1012/cm2) at the substrate/tunnel oxide (Si/SiO2) interface than in current generation FLOTOX transistors. This higher density is four orders of magnitude greater than that which has been in use with FLOTOX transistor technology. In result, the new method and structure produce significantly larger tunneling currents for a given voltage than attained in prior work. The new method and structure are advantageously suited for the much higher density, non volatile FLOTOX transistors desired for use in flash memories and in electronically erasable and programmable read only memories (EEPROMs). These FLOTOX transistors are candidates for replacing the low power operation transistors found in DRAMs.
    • 非挥发性浮栅隧道氧化物(FLOTOX)器件中的纹理表面的方法和结构,例如。 FLOTOX晶体管。 本发明利用“自组织掩模”和受控蚀刻在纹理化表面中形成纳米级微尖头阵列。 微尖端阵列中的微尖端在衬底/隧道氧化物(Si / SiO 2)界面处具有比当前一代FLOTOX晶体管更大的尺寸和形状以及更高的密度(〜1012 / cm2)。 这种更高的密度比使用FLOTOX晶体管技术的密度高四个数量级。 结果,对于给定的电压,新的方法和结构产生明显较大的隧道电流,这在以前的工作中获得。 新的方法和结构有利地适用于期望用于闪存和电可擦除和可编程只读存储器(EEPROM)的更高密度,非易失性FLOTOX晶体管。 这些FLOTOX晶体管是替代在DRAM中发现的低功率运算晶体管的候选者。
    • 26. 发明授权
    • Memory using insulator traps
    • 内存使用绝缘子陷阱
    • US06351411B2
    • 2002-02-26
    • US09879453
    • 2001-06-12
    • Leonard ForbesJoseph E. Geusic
    • Leonard ForbesJoseph E. Geusic
    • G11C1134
    • G11C11/5671B82Y10/00G11C16/0458G11C2216/08H01L29/7887H01L29/7888H01L29/792H01L29/7923
    • A memory cell provides point defect trap sites in an insulator for storing data charges. Single electrons are stored on respective point defect trap sites and a resulting parameter, such as transistor drain current, is detected. By adjusting the density of the point defect trap sites, more uniform step changes in drain current are obtained as single electrons are stored on or removed from respective trap sites. By also adjusting the trapping energy of the point defect trap sites, the memory cell provides either volatile data storage, similar to a dynamic random access memory (DRAM), or nonvolatile data storage, similar to an electrically erasable and programmable read only memory (EEPROM). The memory cell is used for storing binary or multi-state data.
    • 存储单元在绝缘体中提供用于存储数据电荷的点缺陷陷阱位置。 单个电子存储在相应的点缺陷陷阱位置,并且检测到所得到的参数,例如晶体管漏极电流。 通过调整点缺陷陷阱位置的密度,可以获得漏极电流的更均匀的阶跃变化,因为单个电子存储在相应的陷阱位置上或从各陷阱位置移除。 通过调整点缺陷陷阱位点的捕获能量,存储单元提供类似于动态随机存取存储器(DRAM)的易失性数据存储器,或类似于电可擦除和可编程只读存储器(EEPROM)的非易失性数据存储器 )。 存储单元用于存储二进制或多状态数据。