专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20130183456A1 ANTI-MICROBIAL AND ANTI-STATIC SURFACE TREATMENT AGENT WITH QUATERNARY AMMONIUM SALT AS ACTIVE INGREDIENT AND METHOD FOR PREVENTING STATIC ELECTRICITY IN POLYMER FIBERS USING SAME 有权
标题翻译：具有季铵盐作为活性成分的抗微生物和抗静电表面处理剂以及使用该聚合物纤维预防静电力的方法
公开(公告)号：US20130183456A1
公开(公告)日：2013-07-18
申请号：US13824130
申请日：2011-08-10
申请人： Seong Cheol Kim
发明人： Seong Cheol Kim
IPC分类号： C07C211/63
CPC分类号： C07C211/63 , C08L77/06
摘要： Provided are an anti-static and anti-microbial surface treatment agent including a quaternary ammonium salt compound as an active ingredient and a method of preventing a polymer fiber from developing static electricity by using the surface treatment agent. The quaternary ammonium salt compound has excellent anti-static and anti-microbial effects for the prevention or improvement of static electricity in a polymer fiber. Accordingly, the quaternary ammonium salt compound is suitable for use as a fabric softener, or an anti-static agent, and also, provides anti-microbial effects to a polymer fiber.
摘要翻译：提供了包含季铵盐化合物作为活性成分的抗静电和抗微生物表面处理剂以及通过使用表面处理剂防止聚合物纤维发生静电的方法。季铵盐化合物具有优异的抗静电和抗微生物效果，用于防止或改善聚合物纤维中的静电。因此，季铵盐化合物适合用作织物柔软剂或抗静电剂，并且还对聚合物纤维提供抗微生物作用。

22. 发明授权

US08395245B2 Semiconductor package module 有权
标题翻译：半导体封装模块
公开(公告)号：US08395245B2
公开(公告)日：2013-03-12
申请号：US11953967
申请日：2007-12-11
申请人： Jong Hoon Kim , Min Suk Suh , Seong Cheol Kim , Seung Taek Yang , Seung Hyun Lee
发明人： Jong Hoon Kim , Min Suk Suh , Seong Cheol Kim , Seung Taek Yang , Seung Hyun Lee
IPC分类号： H01L23/495
CPC分类号： H05K1/141 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73253 , H01L2225/107 , H01L2225/1088 , H01L2225/1094 , H05K1/021 , H05K1/182 , H05K1/183 , H05K3/0061 , H05K2201/10371 , H05K2201/10545 , H05K2201/10674 , H05K2203/1572
摘要： A semiconductor package module includes a circuit board including a board body having a receiving portion and conductive patterns formed on the board body; a semiconductor package received in the receiving portion and having conductive terminals electrically connected to the conductive patterns and an s semiconductor chip electrically connected to the conductive terminals; and a connection member electrically connecting the conductive patterns and the conductive terminals. In the present invention, after a receiving portion having a receiving space is formed in the board body of a circuit board and a semiconductor package is received in the receiving portion, and a connection terminal of the semiconductor package and a conductive pattern of the board body are electrically connected using a connection member, a plurality of semiconductor packages can be stacked in a single circuit board without increasing the thickness thereby significantly improving data storage capacity and data processing speed of the semiconductor package module.
摘要翻译：一种半导体封装模块，包括：电路板，包括具有接收部分的基板主体和形成在所述基板主体上的导电图案; 接收在所述接收部分中并且具有电连接到所述导电图案的导电端子和与所述导电端子电连接的半导体芯片的半导体封装; 以及电连接导电图案和导电端子的连接构件。在本发明中，在电路基板的基板主体中形成具有接收空间的接收部分，并且在接收部分中接收半导体封装的接收部分，以及半导体封装的连接端子和板体的导电图案使用连接构件电连接，多个半导体封装可以堆叠在单个电路板中而不增加厚度，从而显着提高半导体封装模块的数据存储容量和数据处理速度。

23. 发明授权

US09029602B2 Anti-microbial and anti-static surface treatment agent with quaternary ammonium salt as active ingredient and method for preventing static electricity in polymer fibers using same 有权
标题翻译：具有季铵盐作为有效成分的抗微生物和抗静电表面处理剂以及使用该聚合物纤维防止静电的方法
公开(公告)号：US09029602B2
公开(公告)日：2015-05-12
申请号：US13824130
申请日：2011-08-10
申请人： Seong Cheol Kim
发明人： Seong Cheol Kim
IPC分类号： C07C213/00 , C07C215/00 , C07C217/00 , C07C211/63 , C08L77/06
CPC分类号： C07C211/63 , C08L77/06
摘要： Provided are an anti-static and anti-microbial surface treatment agent including a quaternary ammonium salt compound as an active ingredient and a method of preventing a polymer fiber from developing static electricity by using the surface treatment agent. The quaternary ammonium salt compound has excellent anti-static and anti-microbial effects for the prevention or improvement of static electricity in a polymer fiber. Accordingly, the quaternary ammonium salt compound is suitable for use as a fabric softener, or an anti-static agent, and also, provides anti-microbial effects to a polymer fiber.
摘要翻译：提供了包含季铵盐化合物作为活性成分的抗静电和抗微生物表面处理剂以及通过使用表面处理剂防止聚合物纤维发生静电的方法。季铵盐化合物具有优异的抗静电和抗微生物效果，用于防止或改善聚合物纤维中的静电。因此，季铵盐化合物适合用作织物柔软剂或抗静电剂，并且还对聚合物纤维提供抗微生物作用。

24. 发明授权

US08803325B2 Stacked semiconductor package 有权
标题翻译：堆叠半导体封装
公开(公告)号：US08803325B2
公开(公告)日：2014-08-12
申请号：US13613983
申请日：2012-09-13
申请人： Seong Cheol Kim
发明人： Seong Cheol Kim
IPC分类号： H01L23/538
CPC分类号： H01L23/5384 , H01L23/3114 , H01L23/3128 , H01L23/3178 , H01L23/481 , H01L23/49811 , H01L23/525 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/73 , H01L25/0657 , H01L2224/02372 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/05567 , H01L2224/0557 , H01L2224/06155 , H01L2224/06156 , H01L2224/06181 , H01L2224/06183 , H01L2224/12105 , H01L2224/13022 , H01L2224/13025 , H01L2224/131 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/24051 , H01L2224/24105 , H01L2224/24146 , H01L2224/244 , H01L2224/245 , H01L2224/25105 , H01L2224/2518 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06565 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/014 , H01L2224/05552
摘要： A stacked semiconductor package includes a plurality of semiconductor chips each including a substrate having one surface, the other surface which faces away from the one surface and side surfaces which connect the one surface and the other surface, through-silicon vias which pass through the one surface and the other surface of the substrate, repair pads which are exposed on the side surfaces of the substrate, and wiring lines which electrically connect the through-silicon vias with the repair pads, the plurality of semiconductor chips being stacked such that through-silicon vias of the semiconductor chips are connected with one another; and interconnections electrically connecting the repair pads of the semiconductor chips.
摘要翻译：堆叠的半导体封装包括多个半导体芯片，每个半导体芯片包括具有一个表面的基板，另一个表面背离该一个表面以及连接一个表面和另一个表面的侧表面，穿过一个表面的通孔硅通孔衬底的表面和另一个表面，暴露在衬底的侧表面上的修补焊盘以及将穿硅通孔与修补焊盘电连接的布线，多个半导体芯片被堆叠成使得通过硅半导体芯片的通孔彼此连接; 以及电连接半导体芯片的修补焊盘的互连。

25. 发明授权

US07595255B2 Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same 有权
标题翻译：制造没有翘曲的带状基材的方法以及使用其制造半导体封装的方法
公开(公告)号：US07595255B2
公开(公告)日：2009-09-29
申请号：US11760048
申请日：2007-06-08
申请人： Seong Cheol Kim , Myung Geun Park
发明人： Seong Cheol Kim , Myung Geun Park
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H05K3/0052 , H01L21/561 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/83 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/28 , H05K2201/0909 , H05K2201/0989 , H01L2224/85 , H01L2224/81 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A strip level substrate is manufactured by: applying solder resist on a substrate including a plurality of unit substrate divided by a scribe line; and patterning the applied solder resist to expose an electrode terminal and a ball land in each unit substrate, wherein the patterning of the solder resist is performed to be removed together with a solder resist part applied on the scribe line in order to reduce an early warpage of the strip level substrate.
摘要翻译：通过以下步骤制造带状平面基板：将阻焊剂涂覆在包含由划线划分的多个单位基板的基板上; 以及对所施加的阻焊剂进行图案化以暴露每个单位基板中的电极端子和球状区域，其中进行阻焊剂的图案化以与施加在划线上的阻焊剂部件一起去除以减少早期翘曲的带状基底。

26. 发明授权

US08592952B2 Semiconductor chip and semiconductor package with stack chip structure 失效
标题翻译：半导体芯片和半导体封装具有堆叠芯片结构
公开(公告)号：US08592952B2
公开(公告)日：2013-11-26
申请号：US13096338
申请日：2011-04-28
申请人： Seung Hee Jo , Seong Cheol Kim
发明人： Seung Hee Jo , Seong Cheol Kim
IPC分类号： H01L29/40
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/50 , H01L2223/54426 , H01L2223/5446 , H01L2224/0401 , H01L2224/05009 , H01L2224/10165 , H01L2224/13009 , H01L2224/16146 , H01L2224/16238 , H01L2224/32146 , H01L2224/32225 , H01L2224/73204 , H01L2224/8113 , H01L2224/81132 , H01L2224/81201 , H01L2224/81903 , H01L2224/831 , H01L2225/06513 , H01L2225/06541 , H01L2225/06593 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： A semiconductor chip and semiconductor package with stack chip structure include align patterns. The align patterns are formed of magnetic materials having opposite polarities on the top and bottom of the semiconductor chip. Thus, when the plurality of chips are stacked on the substrate in order for the packaging, the semiconductor chips may be exactly aligned by the magnetic force between the align patterns of the vertically stacked chips. The semiconductor package includes a plurality of stacked semiconductor chips and a filling material. Each of the stacked semiconductor chips includes a semiconductor substrate having a first surface and a second surface, wherein a circuit pattern such as a bonding pad is formed on the first surface, and a first align pattern formed on the first surface of the semiconductor substrate, wherein the first align pattern is formed of a magnetic material.
摘要翻译：具有堆叠芯片结构的半导体芯片和半导体封装包括对准图案。对准图案由在半导体芯片的顶部和底部具有相反极性的磁性材料形成。因此，当为了包装而将多个芯片堆叠在基板上时，半导体芯片可以通过垂直堆叠的芯片的对准图案之间的磁力精确对准。半导体封装包括多个堆叠的半导体芯片和填充材料。堆叠的半导体芯片中的每一个包括具有第一表面和第二表面的半导体衬底，其中在第一表面上形成诸如焊盘的电路图案，以及形成在半导体衬底的第一表面上的第一对准图案，其中所述第一对准图案由磁性材料形成。

27. 发明授权

US08478292B2 Wireless localization method based on an efficient multilateration algorithm over a wireless sensor network and a recording medium in which a program for the method is recorded 有权
标题翻译：基于无线传感器网络上的有效多边算法的无线定位方法和其中记录有该方法的程序的记录介质
公开(公告)号：US08478292B2
公开(公告)日：2013-07-02
申请号：US13337653
申请日：2011-12-27
申请人： Seong Cheol Kim , Jung Kyu Lee
发明人： Seong Cheol Kim , Jung Kyu Lee
IPC分类号： H04W24/00
CPC分类号： G01S5/14 , G01S5/0289 , G01S11/06
摘要： A wireless localization technology using efficient multilateration in a wireless sensor network is disclosed. After calculating estimated distances from each of at least three reference nodes to a blind node using received signal strength of wireless signals that the at least three reference nodes received from the blind node, the estimated location of the blind node is obtained through multilateration using the calculated estimated distances. To correct error in the estimated location, the estimated distances are used, and the error correction direction and error correction distance for the estimated location are calculated by applying a largest weight to the reference node closest to the estimated location. The error of the estimated location is corrected by move the estimated location of the blind node by the calculated error correction direction and error correction distance. Calculation for the error correction is very simple and fast.
摘要翻译：公开了一种在无线传感器网络中使用高效多边测量的无线定位技术。在使用从盲节点接收到的至少三个参考节点的无线信号的接收信号强度来计算从至少三个参考节点中的每一个到盲节点的估计距离之后，通过使用计算出的估计距离为了校正估计位置的误差，使用估计的距离，并且通过对最靠近估计位置的参考节点应用最大权重来计算估计位置的误差校正方向和误差校正距离。通过将计算的误差校正方向和误差校正距离移动盲节点的估计位置来校正估计位置的误差。纠错的计算非常简单快捷。

28. 发明授权

US08399984B2 Semiconductor package 有权
标题翻译：半导体封装
公开(公告)号：US08399984B2
公开(公告)日：2013-03-19
申请号：US12640125
申请日：2009-12-17
申请人： Seong Cheol Kim
发明人： Seong Cheol Kim
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/3677 , H01L23/481 , H01L2224/02372 , H01L2224/13009 , H01L2224/16146 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/15311
摘要： A semiconductor package comprises a semiconductor chip, through electrodes and cooling parts. The semiconductor chip has bonding pads on an upper surface thereof. The through-electrodes are formed in the semiconductor chip. The cooling parts are formed in the semiconductor chip and on the upper surface of the semiconductor chip in order to dissipate heat.
摘要翻译：半导体封装包括通过电极和冷却部件的半导体芯片。半导体芯片在其上表面具有接合焊盘。贯通电极形成在半导体芯片中。为了散热，在半导体芯片和半导体芯片的上表面上形成冷却部件。

29. 发明授权

US07005791B2 Flat panel for cathode-ray tube 失效
标题翻译：阴极射线管平板
公开(公告)号：US07005791B2
公开(公告)日：2006-02-28
申请号：US10481414
申请日：2002-07-02
申请人： Kyoung Mun Choo , Eon Jin Jeong , Seong Cheol Kim
发明人： Kyoung Mun Choo , Eon Jin Jeong , Seong Cheol Kim
IPC分类号： H01J29/70 , H01J31/00
CPC分类号： H01J29/861 , H01J2229/8613 , H04N5/645
摘要： The present invention is related to a flat panel for cathode-ray tube capable of securing a large viewing area in the flat panel which is fitted into a window of a cabinet. In accordance with the panel of the present invention, stepped portions are formed along an edge of a face to fit the panel into the window of the cabinet. A depth from a surface of the face to a surface of the stepped portion is set to satisfy a condition of 2≧Tf/Tc≧0.7 where Tf is a vertical distance from a starting point of the stepped portion to an inner surface of the panel and Tc is a thickness of the center of the face. The panel in accordance with the present invention can provide perceptual flatness to a viewer; improved implosion-proof characteristics; and a structure capable of enduring an external mechanical impact. Further, the panel having a precise structure can be manufactured by a press-molding process.
摘要翻译：本发明涉及一种用于阴极射线管的平板，其能够确保安装在橱柜窗口中的平板中的大的观察面积。根据本发明的面板，沿着面的边缘形成阶梯部分，以将面板装配到橱柜的窗口中。从台阶表面到阶梯部分的表面的深度设定为满足2> = Tf / Tc> = 0.7的条件，其中Tf是从阶梯部分的起点到内表面的垂直距离面板和Tc是面部中心的厚度。根据本发明的面板可以向观看者提供感知平坦度; 改进的防爆特性; 以及能够承受外部机械冲击的结构。此外，具有精确结构的面板可以通过压制成型工艺制造。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式