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21. 发明申请

US20060012921A1 Carriage assembly of a hard disk drive 失效
标题翻译：一个硬盘驱动器的支架装配
公开(公告)号：US20060012921A1
公开(公告)日：2006-01-19
申请号：US10990139
申请日：2004-11-16
申请人： Takashi Kubota , Kenji Kobae
发明人： Takashi Kubota , Kenji Kobae
IPC分类号： G11B5/48 , G11B21/16 , G11B5/55 , G11B21/08
CPC分类号： H05K3/361 , G11B5/4833 , G11B5/484 , G11B5/4846 , G11B5/486 , H05K1/056 , H05K3/0058 , H05K3/328 , H05K3/386 , H05K2201/0969 , H05K2201/2009 , H05K2201/2036 , H05K2203/0285
摘要： A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.
摘要翻译：构造硬盘驱动器的托架组件，使得长尾悬挂电路板的飞行引线和柔性印刷电路板的接合端子的接合能够均匀可靠地进行，并且飞行的问题导致断开的问题飞行引线被拔出不会发生接合端子。柔性印刷电路板通过粘合剂附着到增强部分，其中混合具有基本相同粒径的间隔物，并且飞行引线和接合端子通过超声波接合通过在飞行引线被压在接合端子上。另外，在与引导接合端子接合的表面的飞线的相对面上设置绝缘膜，在超声波接合期间，通过绝缘膜将飞行引线按压的状态下，施加超声波振动接合端子。

22. 发明授权

US07385788B2 Carriage assembly of a hard disk drive 失效
标题翻译：一个硬盘驱动器的支架装配
公开(公告)号：US07385788B2
公开(公告)日：2008-06-10
申请号：US10990139
申请日：2004-11-16
申请人： Takashi Kubota , Kenji Kobae
发明人： Takashi Kubota , Kenji Kobae
IPC分类号： G11B21/21 , G11B5/48
CPC分类号： H05K3/361 , G11B5/4833 , G11B5/484 , G11B5/4846 , G11B5/486 , H05K1/056 , H05K3/0058 , H05K3/328 , H05K3/386 , H05K2201/0969 , H05K2201/2009 , H05K2201/2036 , H05K2203/0285
摘要： A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.
摘要翻译：构造硬盘驱动器的托架组件，使得长尾悬挂电路板的飞行引线和柔性印刷电路板的接合端子的接合能够均匀可靠地进行，并且飞行的问题导致断开的问题飞行引线被拔出不会发生接合端子。柔性印刷电路板通过粘合剂附着到增强部分，其中混合具有基本相同粒径的间隔物，并且飞行引线和接合端子通过超声波接合通过在飞行引线被压在接合端子上。另外，在与引导接合端子接合的表面的飞线的相对面上设置绝缘膜，在超声波接合期间，通过绝缘膜将飞行引线按压的状态下，施加超声波振动接合端子。

23. 发明授权

US07134588B2 Bonding tool for ultrasonic bonding and method of ultrasonic bonding 失效
公开(公告)号：US07134588B2
公开(公告)日：2006-11-14
申请号：US11019623
申请日：2004-12-23
申请人： Kenji Kobae , Takashi Kubota
发明人： Kenji Kobae , Takashi Kubota
IPC分类号： B23K1/06 , B23K5/20 , B32B37/00
CPC分类号： H01L24/81 , B23K20/10 , B23K20/106 , B23K2101/42 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2224/0401
摘要： Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and/or accumulation of foreign matter, such as plating material, on the pressure welding part during use of the bonding tool are prevented, so that the bonding tool can carry out ultrasonic bonding stably. A plurality of protrusions with curved outer surfaces are formed on the pressure welding part that contacts the bonded part during ultrasonic bonding. The protrusions can be formed with spherical outer surfaces by forming concave grooves in a grid in an end surface of the bonding tool and then sandblasting the end surface of the bonding tool.

24. 发明申请

US20060012920A1 Carriage assembly of a hard disk drive and method of manufacturing the same 失效
标题翻译：硬盘驱动器的支架组装及其制造方法
公开(公告)号：US20060012920A1
公开(公告)日：2006-01-19
申请号：US10997005
申请日：2004-11-24
申请人： Kenji Kobae , Takashi Kubota
发明人： Kenji Kobae , Takashi Kubota
IPC分类号： G11B5/48
CPC分类号： G11B5/486 , G11B5/4833 , G11B5/4846 , H05K1/056 , H05K3/363 , H05K2201/0394 , H05K2201/0969 , H05K2203/0285 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903
摘要： A carriage assembly of a hard disk drive, and a manufacturing apparatus for the same are not susceptible to problems such as flying leads breaking and resin residue being deposited on bonding terminals when the flying leads of a long tail suspension circuit board are pulled off the bonding terminals of a flexible printed circuit board. The flying leads of the long tail suspension circuit board and the bonding terminals of the flexible printed circuit board are ultrasonically bonded together by placing an ultrasonic tool in contact with opposite surfaces of the flying leads to the surfaces that are bonded to the bonding terminals and applying ultrasonic vibration from the ultrasonic tool in a state where the flying leads are pressed onto the bonding terminals. Coating layers composed of a thermally meltable metal that melts at a lower temperature than the material forming the bonding surfaces are respectively formed on the opposite surfaces of the flying leads.
摘要翻译：硬盘驱动器的托架组件及其制造装置不容易受到长尾悬挂电路板的飞行引线从接合处脱离而导致断线和树脂残留物沉积在接合端子上的问题柔性印刷电路板的端子。将长尾悬挂电路板的飞线和柔性印刷电路板的接合端子超声波接合在一起，将超声波工具与飞行引线的相对表面接触到与接合端子接合的表面并施加超声波振动来自超声波工具，其中飞行引线被压在接合端子上。由在比形成接合面的材料低的温度下熔化的可热熔融金属组成的涂层分别形成在飞线的相对表面上。

25. 发明授权

US07902983B2 RFID tag 失效
标题翻译： RFID标签
公开(公告)号：US07902983B2
公开(公告)日：2011-03-08
申请号：US12193364
申请日：2008-08-18
申请人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
发明人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
IPC分类号： G08B13/00
CPC分类号： G06K19/07749 , G06K19/07728 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191
摘要： An RFID tag includes: a sheet-like base; an antenna provided on the base and extending along the base; a circuit chip mounted on the base and connected to the antenna for performing radio communication through the antenna; a protection body wider than the circuit chip and narrower than the antenna, which is located at least either above the circuit chip or on a backside of the circuit chip with the base interposed therebetween for protecting the circuit chip; and a connection section provided as a portion of the antenna at a location where an edge of the protection body and the antenna intersect with each other as viewed from a direction intersecting with a surface of the base, which includes one or more conductor patterns narrower than other portion of the antenna, and which connects inner and outer antenna portions of the edge with each other.
摘要翻译： RFID标签包括：片状基底; 设置在基座上并沿基座延伸的天线; 安装在基座上并连接到天线的电路芯片，用于通过天线进行无线电通信; 比电路芯片更宽的保护体，并且比天线窄，其位于电路芯片的上方或电路芯片的背面上，其中插入基板，用于保护电路芯片; 以及连接部，其在从与所述基部的表面相交的方向观察时，在所述保护体和所述天线的边缘彼此相交的位置处设置为所述天线的一部分，所述方向包括一个或多个导体图案，所述导体图案比天线的其他部分，并且将边缘的内天线部分和外天线部分彼此连接。

26. 发明授权

US07356907B2 Method of manufacturing a carriage assembly of a hard disk drive 失效
标题翻译：制造硬盘驱动器的托架组件的方法
公开(公告)号：US07356907B2
公开(公告)日：2008-04-15
申请号：US10997005
申请日：2004-11-24
申请人： Kenji Kobae , Takashi Kubota
发明人： Kenji Kobae , Takashi Kubota
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/486 , G11B5/4833 , G11B5/4846 , H05K1/056 , H05K3/363 , H05K2201/0394 , H05K2201/0969 , H05K2203/0285 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903
摘要： A method of manufacturing a cartridge assembly of a hard disk drive, including a step of forming a part of a wiring circuit into flying leads and a step of forming a coating layer on the respective opposite surfaces of the bonding surfaces of the flying leads, which will be connected to bonding terminals of a flexible printed circuit board. The method also includes a step of placing an ultrasonic tool in contact with the opposite surfaces of the flying leads via the coating layers, and applying ultrasonic vibration from the ultrasonic tool in a state where the flying leads are pressed onto the bonding terminals to ultrasonically bond the flying leads and the bonding terminals together. Additionally, the method includes a step of heating and melting the coating layers to smooth surfaces of the coating layers that have been roughened by contact with the ultrasonic tool during ultrasonic bonding.
摘要翻译：一种制造硬盘驱动器的盒组件的方法，包括将布线电路的一部分形成为飞行引线的步骤以及在飞线的接合表面的相应相对表面上形成涂层的步骤，其中将连接到柔性印刷电路板的接合端子。该方法还包括将超声波工具经由涂层与飞线的相对表面接触的步骤，以及在将飞行引线按压到接合端子上以超声波接合的状态下从超声波工具施加超声波振动飞线和接合端子在一起。此外，该方法包括以下步骤：在超声波接合期间，通过与超声波工具的接触使加热和熔化涂层以平滑已经被粗糙化的涂层的表面。

27. 发明授权

US08299925B2 RFID tag and manufacturing method thereof 有权
标题翻译： RFID标签及其制造方法
公开(公告)号：US08299925B2
公开(公告)日：2012-10-30
申请号：US12180117
申请日：2008-07-25
申请人： Hiroshi Kobayashi , Kenji Kobae
发明人： Hiroshi Kobayashi , Kenji Kobae
IPC分类号： G08B13/14 , H01R43/00 , B44C1/165 , H01L23/02 , H01L23/52
CPC分类号： G06K19/07745 , G06K19/072 , G06K19/07749 , G06K19/0775 , H01L24/81 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/14 , Y10T29/49018 , Y10T29/49117 , Y10T29/49155 , H01L2924/00
摘要： The RFID tag has a base sheet having a recess, a first element provided on the base sheet astride the recess, a second element which is provided between the first element and the base sheet and which is electrically connected to the first element, and a communication antenna which is provided on the base sheet and which is connected to at least any of the first element and the second element.
摘要翻译：所述RFID标签具有基片，所述基片具有凹部，所述第一元件跨越所述凹部设置在所述基片上，所述第二元件设置在所述第一元件与所述基片之间，并且与所述第一元件电连接，天线，其设置在基片上并且连接到第一元件和第二元件中的至少任一个。

28. 发明申请

US20100001387A1 ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTED WITH ELECTRONIC DEVICE, ARTICLE EQUIPPED WITH ELECTRONIC DEVICE AND METHOD OF PRODUCING ELECTRONIC DEVICE 有权
标题翻译：电子设备，用电子设备安装的电子设备，装有电子设备的物品和生产电子设备的方法
公开(公告)号：US20100001387A1
公开(公告)日：2010-01-07
申请号：US12559219
申请日：2009-09-14
申请人： Hiroshi Kobayashi , Kenji Kobae , Shuichi Takeuchi , Hidehiko Kira
发明人： Hiroshi Kobayashi , Kenji Kobae , Shuichi Takeuchi , Hidehiko Kira
IPC分类号： H01L23/02 , H01L21/50
CPC分类号： H01L23/16 , G06K19/077 , G06K19/07728 , H01L23/3121 , H01L23/3135 , H01L2224/16
摘要： An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.
摘要翻译：电子设备包括：基座; 形成在基座上的导体图案; 以及与导体图形电连接的电路芯片。该电子设备还包括一个加强件，该加强件设置在基座上以围绕电路芯片，其外形像环形，并且包括沿基座的厚度方向堆叠的层。层的最下层最靠近基底并且比作为剩余层中的至少一层的层更柔软。电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

29. 发明申请

US20090146653A1 Slider tester 审中-公开
公开(公告)号：US20090146653A1
公开(公告)日：2009-06-11
申请号：US12292651
申请日：2008-11-24
申请人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
发明人： Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi , Shuichi Takeuchi , Takayoshi Matsumura , Hirokazu Yamanishi , Shinji Hiraoka , Yoshiaki Yanagida
IPC分类号： G01R33/12
CPC分类号： G11B5/455 , G11B5/4555 , G11B5/6005 , H01R13/2421 , H01R2201/20
摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

30. 发明授权

US07394163B2 Method of mounting semiconductor chip 失效
标题翻译：安装半导体芯片的方法
公开(公告)号：US07394163B2
公开(公告)日：2008-07-01
申请号：US10187843
申请日：2002-07-03
申请人： Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
发明人： Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/563 , H01L21/67092 , H01L21/67144 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75743 , H01L2224/81191 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/83885 , H01L2224/83951 , H01L2224/85444 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/05599
摘要： A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.
摘要翻译：通过用作底层填充剂的粘合剂填充芯片和基板之间的间隙来安装半导体芯片的方法，其中安装IC芯片。底部填充物的圆角被制成具有优选的形状。为了实现这一点，将具有凸块的头IC芯片放置在被底部填充胶粘剂覆盖的悬挂上，并设置有垫。接合工具按压头IC芯片并对头IC芯片施加超声波振荡，使得凸块适当地粘合到焊盘。当头部IC芯片被按压并进行超声波振荡时，发射紫外线108以使在头IC芯片11和悬架12之间展开的粘合剂151的周边部分151a硬化。

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