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21. 发明申请

US20070012477A1 Electronic component package including joint material having higher heat conductivity 审中-公开
标题翻译：包括具有较高导热性的接头材料的电子部件封装
公开(公告)号：US20070012477A1
公开(公告)日：2007-01-18
申请号：US11231871
申请日：2005-09-22
申请人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
发明人： Naoaki Nakamura , Hideaki Yoshimura , Kenji Fukuzono , Toshihisa Sato
IPC分类号： H01L23/34
CPC分类号： B23K35/26 , B23K35/3006 , B23K35/3601 , B23K2101/40 , B32B15/01 , B32B15/018 , C22C28/00 , H01L23/3735 , H01L23/3736 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01322 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00 , H01L2224/05599
摘要： An electronic component is mounted on the surface of a printed wiring board. A heat conductive member is received on the surface of the electronic component. A joint material is interposed between the electronic component and the heat conductive member. The joint material is made of material containing Ag in a range exceeding 3 wt % and In. The inventors have demonstrated that voids decrease at the boundary between the joint material and the electronic component as well as at the boundary between the joint material and the heat conductive member as the content of Ag increases in the overall weight of the joint material. The joint material is allowed to enjoy a higher heat conductivity as compared with a conventional solder material. The joint material allows the heat conductive member to efficiently receive heat from the electronic component.
摘要翻译：电子部件安装在印刷电路板的表面上。导电构件被容纳在电子部件的表面上。在电子部件和导热部件之间插入有接合材料。接头材料由含有Ag超过3重量％的In的材料制成。本发明人已经证明，在接头材料和电子部件之间的边界以及接头材料和导热部件之间的边界处，随着Ag含量的增加，接头材料的总重量的增加，空隙减小。与常规焊料材料相比，使接合材料具有更高的导热性。接合材料允许导热构件有效地从电子部件接收热量。

22. 发明申请

US20060212155A1 Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program 有权
标题翻译：印刷线路板设计辅助设备，印刷线路板设计辅助方法和印刷线路板设计辅助程序
公开(公告)号：US20060212155A1
公开(公告)日：2006-09-21
申请号：US11167264
申请日：2005-06-28
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： G06F19/00
CPC分类号： H05K3/0005 , G06F17/5018 , G06F2217/80 , H05K1/0271 , H05K2201/068
摘要： The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiring board design aiding program makes a computer execute the steps including a mesh division step that divides an analytical model of a printed wiring board obtained as data into meshes, a mesh displacement calculation step that calculates displacements of respective meshes of a printed wiring board which is divided in the mesh division step, a mesh displacement connection step that connects mesh displacements calculated in the mesh displacement calculation step so that the inclination of borders of respective meshes become equal, and a displacement calculation step that calculates a displacement using an entire displacement of a printed wiring board which is obtained in the mesh displacement connection step.
摘要翻译：本发明提供一种印刷线路板设计辅助装置，方法和程序，其可以容易且廉价地预测由于温度变化而导致的复杂形状和结构的印刷线路板的位移。印刷线路板设计辅助程序使得计算机执行包括将作为数据获得的印刷线路板的分析模型划分成网格的网格分割步骤的步骤，网格位移计算步骤，其计算印刷线路板的各个网格的位移其在网格划分步骤中被划分为网格位移连接步骤，其连接在网格位移计算步骤中计算的网格位移，使得各个网格的边界的倾斜度相等;以及位移计算步骤，其使用整个位移计算位移在网格位移连接步骤中获得的印刷线路板。

23. 发明申请

US20050151234A1 Semiconductor device and supporting plate 失效
标题翻译：半导体器件和支撑板
公开(公告)号：US20050151234A1
公开(公告)日：2005-07-14
申请号：US11064948
申请日：2005-02-25
申请人： Hideaki Yoshimura
发明人： Hideaki Yoshimura
IPC分类号： H01L23/00 , H01L23/04 , H01L23/13 , H01L23/20 , H01L23/31 , H01L23/433
CPC分类号： H01L23/04 , H01L23/13 , H01L23/3128 , H01L23/4334 , H01L23/564 , H01L2224/16 , H01L2924/12044 , H01L2924/15311 , H01L2924/16195
摘要： A semiconductor device includes a semiconductor element, a resin substrate where the semiconductor element is mounted, and a supporting plate configured to support the resin substrate. A first gas discharging hole is made through the supporting plate. Gas generated from the resin substrate is discharged through the first gas discharging hole.
摘要翻译：半导体器件包括半导体元件，安装有半导体元件的树脂基板和支撑板，该支撑板构造成支撑树脂基板。第一气体排出孔通过支撑板制成。从树脂基板产生的气体通过第一排气孔排出。

24. 发明授权

US06334569B1 Reflow soldering apparatus and reflow soldering method 失效
标题翻译：回流焊接装置和回流焊接方法
公开(公告)号：US06334569B1
公开(公告)日：2002-01-01
申请号：US09539627
申请日：2000-03-31
申请人： Hideaki Yoshimura
发明人： Hideaki Yoshimura
IPC分类号： B23K3102
CPC分类号： B23K1/008 , H01L2224/16225 , H05K1/0306 , H05K3/3494 , H05K2201/10674 , H05K2203/085 , H05K2203/1581
摘要： A reflow soldering apparatus for soldering a first component mounted on a substrate with a first solder having a first melting point and soldering a second component mounted on the substrate with a second solder having a second melting point higher than the first melting point. The reflow soldering apparatus includes a heat source for substantially uniformly heating the substrate, a capsule for enclosing the second component, and a vacuum pump for decreasing the pressure in the capsule. The melting point of the second solder can be lowered by operating the vacuum pump to decrease the pressure in the capsule by a given amount, so that the first component and the second component can be reflow-soldered at substantially the same temperature.
摘要翻译：一种回流焊接装置，用于利用具有第一熔点的第一焊料焊接安装在基板上的第一部件，并用安装在基板上的第二部件焊接第二熔点高于第一熔点的第二焊料。回流焊接装置包括用于基本均匀地加热基板的热源，用于封闭第二部件的胶囊和用于减小胶囊中的压力的真空泵。可以通过操作真空泵来降低第二焊料的熔点，从而将胶囊中的压力降低给定量，使得第一组分和第二组分可以在基本上相同的温度下回流焊接。

25. 发明授权

US5926445A Waveform controlling device for a tracking error signal 失效
标题翻译：用于跟踪误差信号的波形控制装置
公开(公告)号：US5926445A
公开(公告)日：1999-07-20
申请号：US770436
申请日：1996-12-20
申请人： Takashi Sasaki , Kazuhiro Kiyoura , Alex Bradshaw , Koichiro Haraguchi , Takeshi Matsumoto , Tomoko Miyagawa , Hideaki Yoshimura
发明人： Takashi Sasaki , Kazuhiro Kiyoura , Alex Bradshaw , Koichiro Haraguchi , Takeshi Matsumoto , Tomoko Miyagawa , Hideaki Yoshimura
IPC分类号： G11B7/09 , G11B7/095 , G11B7/085
CPC分类号： G11B7/094 , G11B7/0901 , G11B7/0903
摘要： An unbalanced waveform of a tracking error signal is automatically corrected within a short period of time. A peak value and a bottom value of a tracking error signal are obtained by a peak-hold circuit and a bottom-hold circuit, respectively. Based on the peak value and the bottom value, an amount of offset measured from a reference level and an amplitude of the tracking error signal are computed. An adjustment value is computed for correcting the unbalance between the peak value and the bottom value based on the amount of offset and the amplitude of the tracking error signal. The adjustment value is fed back to a tracking balance circuit so that the waveform of the unbalanced waveform of the tracking error signal is corrected.
摘要翻译：跟踪误差信号的不平衡波形在短时间内自动校正。通过峰值保持电路和底部保持电路分别获得跟踪误差信号的峰值和底部值。基于峰值和底值，计算从参考电平测量的偏移量和跟踪误差信号的幅度。基于偏移量和跟踪误差信号的振幅来计算调整值，用于校正峰值和底部值之间的不平衡。将调整值反馈到跟踪平衡电路，以便校正跟踪误差信号的不平衡波形的波形。

26. 发明申请

US20120067635A1 Package substrate unit and method for manufacturing package substrate unit 有权
标题翻译：封装衬底单元和用于制造封装衬底单元的方法
公开(公告)号：US20120067635A1
公开(公告)日：2012-03-22
申请号：US12929680
申请日：2011-02-08
申请人： Hnin Nway San Nang , Kazuya Arai , Kei Fukui , Shinpei Ikegami , Yasuhito Takahashi , Hideaki Yoshimura , Hitoshi Suzuki
发明人： Hnin Nway San Nang , Kazuya Arai , Kei Fukui , Shinpei Ikegami , Yasuhito Takahashi , Hideaki Yoshimura , Hitoshi Suzuki
IPC分类号： H05K1/18 , B23K1/20
CPC分类号： H05K3/107 , B23K1/0016 , B23K3/0623 , B23K2101/42 , H01L23/49811 , H01L23/49822 , H01L2224/16225 , Y10T29/49165
摘要： A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.
摘要翻译：封装基板单元的半导体芯片安装层包括绝缘层，形成在绝缘层的顶表面上的导电种子金属层，形成在导电种子金属层的顶表面上的导电焊盘，基本上形成在金属柱导电焊盘的顶表面上的中心部分，以及形成为围绕导电焊盘和金属柱的阻焊层。

27. 发明授权

US08023268B2 Printed circuit board unit and semiconductor package 有权
标题翻译：印刷电路板单元和半导体封装
公开(公告)号：US08023268B2
公开(公告)日：2011-09-20
申请号：US12461867
申请日：2009-08-26
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L21/10 , H01L21/563 , H01L23/3675 , H01L23/433 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401
摘要： A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.
摘要翻译：一种端子凸块组，包括内嵌在封装基板前表面上的直立的第一棱镜中的最外凸块排。导热构件与半导体元件的表面接触。导热构件向外延伸超过半导体元件的轮廓。在半导体元件的轮廓外部的导热构件和封装基板之间插入加强构件。加强构件在预定的接合区域结合到封装基板的前表面。预定的接合区域从封装基板的外周向内延伸超过封装基板的前表面。第二棱镜直立在第一棱镜内部的封装基板的前表面上，以允许最外面的凸起行包围第二棱镜。

28. 发明授权

US07381592B2 Method of making a semiconductor device with improved heat dissipation 失效
标题翻译：制造具有改善的散热的半导体器件的方法
公开(公告)号：US07381592B2
公开(公告)日：2008-06-03
申请号：US11654555
申请日：2007-01-18
申请人： Hideaki Yoshimura
发明人： Hideaki Yoshimura
IPC分类号： H01L21/00
CPC分类号： H01L24/32 , H01L21/4871 , H01L21/4882 , H01L23/36 , H01L23/3677 , H01L23/3733 , H01L23/3737 , H01L23/433 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/00 , H01L2924/00014
摘要： A method of making a heat dissipation member comprising the steps of forming a resist on a substrate, removing a portion or portions of said resist formed on the substrate in places where posts are to be formed, forming the posts on the substrate in said places where the resist is removed, forming a joint material on the posts disposed on the substrate and removing the remaining resist on the substrate.
摘要翻译：一种制造散热构件的方法，包括以下步骤：在基底上形成抗蚀剂，在形成柱的位置去除形成在基底上的所述抗蚀剂的一部分或部分，在基底上形成柱，所述位置在去除抗蚀剂，在设置在基板上的柱上形成接合材料，并除去基板上剩余的抗蚀剂。

29. 发明申请

US20080053618A1 Optical Recording Medium-Producing Sheet 审中-公开
标题翻译：光记录介质生产板
公开(公告)号：US20080053618A1
公开(公告)日：2008-03-06
申请号：US11596647
申请日：2005-03-22
申请人： Shin Kubota , Sou Miyata , Hideaki Yoshimura
发明人： Shin Kubota , Sou Miyata , Hideaki Yoshimura
IPC分类号： G11B7/26
CPC分类号： G11B7/263 , G11B7/24038 , G11B7/252 , G11B7/2533
摘要： An optical disk-producing sheet 1 comprising an energy ray-curable stamper-receiving layer 11 onto which can be transferred convexoconcave of a stamper S, and release sheets 12 and 12′, wherein the adhesive strength after curing of the stamper-receiving layer 11 to a reflective layer 3 is greater than the adhesive strength after curing of the stamper-receiving layer 11 to the stamper S, the difference between the two adhesive strengths being not less than 50 mN/25 mm. According to this optical disk-producing sheet 1, when the cured stamper-receiving layer 11 and the stamper S are separated from one an other, there is no peeling away between the stamper-receiving layer 11 and the reflective layer 3.
摘要翻译：一种光盘制造片1，其具有能够射入固化的压模接受层11，能够将印模S的凸凹部分分离，并将剥离片12和12'，其中压模接受层11固化后的粘合强度反射层3比压模接收层11固化到压模S之后的粘合强度大，两个粘合强度之间的差不小于50mN / 25mm。根据该光盘制造片1，当固化的压模接受层11和压模S彼此分离时，在压模接收层11和反射层3之间不会剥离。

30. 发明授权

US07260806B2 Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program 有权
标题翻译：印刷线路板设计辅助设备，印刷线路板设计辅助方法和印刷线路板设计辅助程序
公开(公告)号：US07260806B2
公开(公告)日：2007-08-21
申请号：US11167264
申请日：2005-06-28
申请人： Kenji Fukuzono , Hideaki Yoshimura
发明人： Kenji Fukuzono , Hideaki Yoshimura
IPC分类号： G06F17/50 , G06F19/00
CPC分类号： H05K3/0005 , G06F17/5018 , G06F2217/80 , H05K1/0271 , H05K2201/068
摘要： The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiring board design aiding program makes a computer execute the steps including a mesh division step that divides an analytical model of a printed wiring board obtained as data into meshes, a mesh displacement calculation step that calculates displacements of respective meshes of a printed wiring board which is divided in the mesh division step, a mesh displacement connection step that connects mesh displacements calculated in the mesh displacement calculation step so that the inclination of borders of respective meshes become equal, and a displacement calculation step that calculates a displacement using an entire displacement of a printed wiring board which is obtained in the mesh displacement connection step.
摘要翻译：本发明提供一种印刷线路板设计辅助装置，方法和程序，其可以容易且廉价地预测由于温度变化而导致的复杂形状和结构的印刷线路板的位移。印刷线路板设计辅助程序使得计算机执行包括将作为数据获得的印刷线路板的分析模型划分成网格的网格分割步骤的步骤，网格位移计算步骤，其计算印刷线路板的各个网格的位移其在网格划分步骤中被划分为网格位移连接步骤，其连接在网格位移计算步骤中计算的网格位移，使得各个网格的边界的倾斜度相等;以及位移计算步骤，其使用整个位移计算位移在网格位移连接步骤中获得的印刷线路板。

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