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21. 发明授权

US4239793A Gas separation membrane 失效
标题翻译：气体分离膜
公开(公告)号：US4239793A
公开(公告)日：1980-12-16
申请号：US950442
申请日：1978-10-11
申请人： Junichi Matsuura , Yukio Yamaguchi
发明人： Junichi Matsuura , Yukio Yamaguchi
IPC分类号： B01D53/22 , B01D71/44 , C08L43/04 , C08L83/04 , B32B15/06 , B01D13/00 , B01D59/12
CPC分类号： C08L43/04 , B01D71/44 , C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/24 , C08G77/60 , C08G77/70 , Y10T428/24975 , Y10T428/24992 , Y10T428/249981 , Y10T428/31663
摘要： A gas separation membrane comprises a main component of a mixture of a polyvinyltriorganosilane and an organopolysiloxane.The gas separation membrane has a dense layer having a gas selective permeability and a thickness of 0.01 to 10.mu. and a porous layer having open pores and a thickness of greater than 10.mu..
摘要翻译：气体分离膜包括聚乙烯三有机硅烷和有机聚硅氧烷的混合物的主要成分。气体分离膜具有气体选择性渗透性和厚度为0.01〜10μm的致密层，具有开孔，厚度大于10μm的多孔层。

22. 发明授权

US08947721B2 Image forming apparatus, backup and restore processing method 有权
标题翻译：图像形成装置，备份和恢复处理方法
公开(公告)号：US08947721B2
公开(公告)日：2015-02-03
申请号：US13647414
申请日：2012-10-09
申请人： Tatsuma Hirokawa , Yukio Yamaguchi , Masataka Yamazaki
发明人： Tatsuma Hirokawa , Yukio Yamaguchi , Masataka Yamazaki
IPC分类号： G06F15/00 , G06F3/12 , H04N1/00 , H04N1/32
CPC分类号： G06F3/1204 , G06F3/1229 , G06F3/1285 , H04N1/00965 , H04N1/32106 , H04N2201/0094 , H04N2201/3202 , H04N2201/3276
摘要： An image forming apparatus operates according to setting information, and includes a storage unit for storing the setting information; an interface for connecting a portable storage medium; a processing unit for reading/writing the setting information from/to the storage unit, and reading/writing the setting information from/to the portable storage medium via the interface, and a log creating unit for creating a first processing result log indicating a first processing result of a reading/writing process when the processing unit reads the setting information from the storage unit and writes the setting information in the portable storage medium, and storing the first processing result log, and creating a second processing result log indicating a second processing result of a reading/writing process when the processing unit reads the setting information from the portable storage medium and writes the setting information in the storage unit, and storing the second processing result log.
摘要翻译：图像形成装置根据设置信息进行操作，并且包括用于存储设置信息的存储单元; 用于连接便携式存储介质的接口; 用于从/向存储单元读取/写入设置信息的处理单元，以及经由接口从便携式存储介质读取/写入设置信息的日志创建单元，用于创建指示第一当处理单元从存储单元读取设置信息并将设置信息写入便携式存储介质中并且存储第一处理结果日志时，读取/写入处理的处理结果，以及创建指示第二处理的第二处理结果日志当处理单元从便携式存储介质读取设置信息并将设置信息写入存储单元中并且存储第二处理结果日志时，读/写处理的结果。

23. 发明授权

US08518363B2 Method for production of carbon nanotube 有权
标题翻译：碳纳米管生产方法
公开(公告)号：US08518363B2
公开(公告)日：2013-08-27
申请号：US12440317
申请日：2007-09-07
申请人： Suguru Noda , Hisashi Sugime , Yukio Yamaguchi
发明人： Suguru Noda , Hisashi Sugime , Yukio Yamaguchi
IPC分类号： D01C5/00
CPC分类号： B01J38/12 , B01J23/745 , B01J23/881 , B01J23/882 , B01J23/94 , B01J35/04 , B01J37/347 , B82Y30/00 , B82Y40/00 , C01B32/162 , C01B32/17 , C01B2202/02 , Y02P20/584
摘要： [Problems to be Solved]There is provided a method for production of a carbon nanotube, which allows for production of the carbon nanotube in a large scale and at a low cost.[Solution]The temperature of a catalyst loaded on a support is raised by heating the support and a raw material gas containing a carbon source is supplied on the catalyst to synthesize the carbon nanotube. The synthesized carbon nanotube is recovered, and after the recovery, the catalyst is subjected to a regeneration treatment to repeatedly utilize the support. Since the catalyst deteriorates, the catalyst is regenerated periodically or nonperiodically during the production. The regeneration treatment of the catalyst involves an oxidation treatment of the catalyst. Further, after the oxidation treatment, a reducing gas is fed to and brought into contact with the catalyst surface to reduce the catalyst. As the support, a honeycomb is used.
摘要翻译： [待解决的问题]提供了一种生产碳纳米管的方法，其可以大规模和低成本地生产碳纳米管。 [解决方案]通过加热载体来提高负载在载体上的催化剂的温度，并在催化剂上提供含有碳源的原料气体以合成碳纳米管。回收合成的碳纳米管，回收后，对催化剂进行再生处理，反复利用载体。由于催化剂劣化，催化剂在生产过程中周期性或非周期性地再生。催化剂的再生处理涉及催化剂的氧化处理。此外，在氧化处理之后，还原气体被供给到催化剂表面并与催化剂表面接触以还原催化剂。作为支撑体，使用蜂窝体。

24. 发明授权

US07455731B2 Polycrystalline silicon rod and method for processing the same 有权
标题翻译：多晶硅棒及其加工方法
公开(公告)号：US07455731B2
公开(公告)日：2008-11-25
申请号：US11414342
申请日：2006-05-01
申请人： Mamoru Nakano , Yukio Yamaguchi , Teruhisa Kitagawa , Rikito Sato , Naoki Hatakeyama
发明人： Mamoru Nakano , Yukio Yamaguchi , Teruhisa Kitagawa , Rikito Sato , Naoki Hatakeyama
IPC分类号： C30B35/00
CPC分类号： C30B29/06 , C30B13/00 , C30B15/02 , Y10S117/90 , Y10S117/911 , Y10T117/1032 , Y10T117/1072 , Y10T428/2973
摘要： A polycrystalline silicon rod according to present invention has a structure for hanging of polycrystalline silicon rods to each other end-to-end, so that the efficiency of melting polycrystalline silicon can be increased considerably. A polycrystalline silicon rod obtained by entirely or partially removing a peripheral portion from the rod to leave a central portion, and processing the central portion, preferably, the peripheral portion is removed by grinding in an amount corresponding to 10 to 60% of the diameter of the rod, and then subjected to groove-forming processing. This makes annealing unnecessary.
摘要翻译：根据本发明的多晶硅棒具有将多晶硅棒彼此端对端悬挂的结构，从而可以显着提高熔融多晶硅的效率。通过完全或部分地从棒上除去离开中心部分并且处理中心部分，优选周边部分而获得的多晶硅棒通过研磨去除，其量相当于直径的10至60％杆，然后进行槽形成处理。这使得退火不必要。

25. 发明授权

US07391979B2 Image processing apparatus and method of automatic reboot 有权
标题翻译：图像处理装置及自动重启方法
公开(公告)号：US07391979B2
公开(公告)日：2008-06-24
申请号：US11045353
申请日：2005-01-31
申请人： Yukio Yamaguchi , Yoh Masuyama
发明人： Yukio Yamaguchi , Yoh Masuyama
IPC分类号： G03G15/00 , G06F11/00
CPC分类号： H04N1/00209 , G06F11/0733 , G06F11/0748 , G06F11/076 , G06F11/0784 , G06F11/0793 , H04N1/00217 , H04N1/00832 , H04N1/32609 , H04N1/32625 , H04N1/32667 , H04N2201/0091 , H04N2201/3222 , H04N2201/3278
摘要： An image processing apparatus is disclosed that, when falling in failures possibly being fixable by switching off/on electric power, is able to be automatically and appropriately rebooted and does not involve disagreement in counts of different counters used for management actions in the course of rebooting process. The image processing apparatus, which has hardware resources used for image formation and programs used for controlling the image formation, includes a failure detection unit to detect a rebooting failure from type A or D failures which are possibly fixable by switching off/on electric power of the image processing apparatus, and a reboot unit to reboot the hardware resources and the programs. The image processing apparatus may further include an operation halting unit to halt operations of the hardware resources and the programs when the rebooting failure is detected.
摘要翻译：公开了一种图像处理装置，当通过关闭/接通电力而可能被固定的故障落下时，能够自动适当地重启并且不涉及重新启动过程中用于管理动作的不同计数器的计数的不一致处理。具有用于图像形成的硬件资源的图像处理装置和用于控制图像形成的程序的图像处理装置包括：故障检测单元，用于通过关闭/接通电力可能固定的A型或D型故障来检测重新启动故障图像处理装置以及重新启动硬件资源和程序的重启单元。图像处理装置还可以包括当检测到重新启动失败时停止硬件资源和程序的操作的操作停止单元。

26. 发明申请

US20070075436A1 Electronic device and manufacturing method of the same 审中-公开
标题翻译：电子器件及其制造方法相同
公开(公告)号：US20070075436A1
公开(公告)日：2007-04-05
申请号：US10574898
申请日：2004-10-06
申请人： Shinji Watanabe , Yukio Yamaguchi
发明人： Shinji Watanabe , Yukio Yamaguchi
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L23/13 , H01L23/49822 , H01L23/5389 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/27013 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/48479 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83051 , H01L2224/83102 , H01L2224/83192 , H01L2224/838 , H01L2224/92125 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3025 , H01L2224/83 , H01L2224/85 , H01L2224/81 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/4554
摘要： A semiconductor chip of the present invention has a wiring substrate and a chip part. The wiring substrate has an insulating resin layer having a first major surface and a second major surface, and a first wiring layer disposed on the insulating resin layer on the second major surface side. The chip part has a projection electrode on the bottom surface. The insulating resin layer holds the chip part such that the bottom and side surfaces of the chip part are in contact with the insulating resin layer, and the top surface of the chip part is exposed on the insulating layer on the first major surface side. The projection electrode of the chip part is connected with the first wiring layer.
摘要翻译：本发明的半导体芯片具有布线基板和芯片部分。布线基板具有具有第一主表面和第二主表面的绝缘树脂层，以及设置在第二主表面侧的绝缘树脂层上的第一布线层。芯片部分在底面上具有一个投影电极。绝缘树脂层保持芯片部分，使得芯片部分的底部和侧表面与绝缘树脂层接触，并且芯片部分的顶表面暴露在第一主表面侧的绝缘层上。芯片部分的投影电极与第一布线层连接。

27. 发明申请

US20060162763A1 Photovoltaic apparatus and mass-producing apparatus for mass-producing spherical semiconductor particles 审中-公开
公开(公告)号：US20060162763A1
公开(公告)日：2006-07-27
申请号：US10606900
申请日：2003-06-27
申请人： Yoshihiro Hamakawa , Mikio Murozono , Hideyuki Takakura , Yukio Yamaguchi , Jun Yamagata , Hidenori Yasuda
发明人： Yoshihiro Hamakawa , Mikio Murozono , Hideyuki Takakura , Yukio Yamaguchi , Jun Yamagata , Hidenori Yasuda
IPC分类号： H01L31/042
CPC分类号： H01L31/042 , C30B11/003 , C30B11/006 , C30B29/06 , C30B29/607 , C30B29/66 , C30B30/06 , H01L31/02008 , H01L31/035281 , H01L31/0512 , H01L31/0547 , H01L31/0745 , H01L31/1804 , H02S40/36 , Y02E10/52 , Y02E10/547 , Y02P70/521
摘要： A photoelectric conversion element is disposed in each of a plurality of recesses of a support. Light reflected by the inside surface of the recess shines on the photoelectric conversion element. The photoelectric conversion element has an approximately spherical shape and has the following structure. The outer surface of a center-side n-type amorphous silicon (a-Si) layer is covered with a p-type amorphous SiC (a-SiC) layer having a wider optical band gap than a-Si does, whereby a pn junction is formed. A first conductor of the support is connected to the p-type a-SiC layer of the photoelectric conversion element at the bottom or its neighborhood of the recess. A second conductor, which is insulated from the first conductor by an insulator, of the support is connected to the n-type a-Si layer of the photoelectric conversion element.

28. 发明授权

US07003549B2 Network system and a purchasing method using the network system, plug-in software for an internet browser, network system using the plug-in software and a purchasing method using the network system 失效
标题翻译：使用网络系统的网络系统和购买方法，互联网浏览器的插件软件，使用插件软件的网络系统和使用网络系统的购买方法
公开(公告)号：US07003549B2
公开(公告)日：2006-02-21
申请号：US09876711
申请日：2001-06-07
申请人： Yukio Yamaguchi
发明人： Yukio Yamaguchi
IPC分类号： G06F15/16
CPC分类号： H04L63/0869 , Y10S707/99932
摘要： A server 1 and client 2 have system clock synchronous means 9, 14 for synchronizing a system clocks 6, 12 to the Internet Standard Time, storing means 4, 11 for arranging and storing a plurality of log-in IDs for authenticating said server 1 and client 2 mutually, and log-in ID changing means 8, 13 for searching repeatedly from the top to the bottom of a plurality of log-in IDs stored in said storing means 4, 11, and updating a log-in ID searched at predetermined intervals as the most current log-in ID every time searching.
摘要翻译：服务器1和客户端2具有系统时钟同步装置9,14，用于将系统时钟6,12同步到互联网标准时间;存储装置4,11，用于安排和存储用于认证所述服务器1的多个登录ID;以及客户端2和登录ID改变装置8,13，用于从存储在所述存储装置4,11中的多个登录ID的顶部到底部重复搜索，并更新在预定的搜索中搜索的登录ID 间隔作为每次搜索的最新登录ID。

29. 发明授权

US06291274B1 Resin molded semiconductor device and method for manufacturing the same 有权
标题翻译：树脂模制半导体器件及其制造方法
公开(公告)号：US06291274B1
公开(公告)日：2001-09-18
申请号：US09341918
申请日：1999-07-21
申请人： Seishi Oida , Yukio Yamaguchi , Nobuhiro Suematsu
发明人： Seishi Oida , Yukio Yamaguchi , Nobuhiro Suematsu
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/565 , H01L21/566 , H01L23/3107 , H01L23/49503 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/16225 , H01L2224/32014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01013 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a semiconductor chip (15) which is bonded on a die pad (13) of a leadframe, and inner leads (12) are electrically connected to electrode pads of the semiconductor chip (15) with metal fine wires (16). The die pad (13), semiconductor chip (15) and inner leads are molded with a resin encapsulant (17). However, no resin encapsulant (17) exists on the respective back surfaces of the inner leads (12), which protrude downward from the back surface of the resin encapsulant (17) so as to be external electrodes (18).
摘要翻译：一种用于制造接合在引线框的芯片焊盘（13）上的半导体芯片（15）和内部引线（12）的方法用金属细线（16）与半导体芯片（15）的电极焊盘电连接，。模具衬垫（13），半导体芯片（15）和内部引线用树脂密封剂（17）模制。然而，从内部引线12的各个后表面，树脂密封剂17从树脂密封剂17的背面向下方突出而成为外部电极18而没有树脂密封剂17。

30. 发明授权

US5977615A Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device 失效
标题翻译：引线框架，引线框架的制造方法，半导体器件和制造半导体器件的方法
公开(公告)号：US5977615A
公开(公告)日：1999-11-02
申请号：US997651
申请日：1997-12-23
申请人： Yukio Yamaguchi , Akira Oga , Toru Nomura , Masanori Minamio
发明人： Yukio Yamaguchi , Akira Oga , Toru Nomura , Masanori Minamio
IPC分类号： H01L23/31 , H01L23/495 , H01L23/28
CPC分类号： H01L23/3121 , H01L23/3107 , H01L23/49503 , H01L23/4951 , H01L23/49558 , H01L24/32 , H01L2224/29007 , H01L2224/32014 , H01L2224/32057 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181
摘要： In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead frame, a semiconductor chip is mounted on the insulator, and the semiconductor chip is connected with the inside inner leads and the outside inner leads through metal wires, and the resultant is sealed with a resin. Thus, projections provided on the bottoms of the inside inner leads and the outside inner leads can work as external terminals. Since the external terminals can be disposed two-dimensionally on the bottom, the lead frame is applicable to high density packaging and multi-pin devices, and can additionally provide a so-called burr-less structure free from uncut waste of the resin.
摘要翻译：在引线框架中，内部引线由支撑引线穿过绝缘体支撑。内部内部引线和外部内部引线彼此分离并且被双重布置。在使用这种引线框制造半导体器件时，半导体芯片安装在绝缘体上，半导体芯片通过金属线与内部内部引线和外部内部引线连接，并且用树脂密封。因此，设置在内部内部引线和外部内部引线的底部的突起可以作为外部端子。由于外部端子可以二维地设置在底部上，所以引线框架可应用于高密度封装和多针装置，并且可以另外提供所谓的无毛刺结构，而不会产生未切割的树脂浪费。

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