专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US08076680B2 LED package having an array of light emitting cells coupled in series 有权
标题翻译： LED封装具有串联耦合的发光单元阵列
公开(公告)号：US08076680B2
公开(公告)日：2011-12-13
申请号：US11908112
申请日：2005-10-26
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

22. 发明申请

US20100224904A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 有权
标题翻译：具有连接在一起的发光细胞阵列的LED封装
公开(公告)号：US20100224904A1
公开(公告)日：2010-09-09
申请号：US12782287
申请日：2010-05-18
申请人： Chung Hoon LEE , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon LEE , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/62 , H01L33/64 , H01L33/52
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

23. 发明授权

US07704761B2 Manufacturing method of light emitting diode 有权
标题翻译：发光二极管的制造方法
公开(公告)号：US07704761B2
公开(公告)日：2010-04-27
申请号：US12064950
申请日：2006-08-17
申请人： Sang Min Lee , Hyuck Jung Choi , Won Il Kim
发明人： Sang Min Lee , Hyuck Jung Choi , Won Il Kim
IPC分类号： H01L21/00
CPC分类号： B29C45/27 , B29C45/0055 , B29C45/02 , B29C45/14655 , B29C45/1671 , B29C2045/0058 , B29C2045/2712 , B29K2995/0025 , B29K2995/0026 , H01L24/97 , H01L33/52 , H01L2224/32257 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.
摘要翻译：公开了一种发光二极管的制造方法。制造方法包括准备基板并将发光芯片安装在基板上的步骤。中间板位于基板上。中间板具有用于接收发光芯片的通孔和用于在其上表面上将通孔彼此连接的凹槽。通过使用沟槽作为流道，通过透明模塑材料进行传递模塑工艺以形成填充通孔的第一模制部分。此后，中间板被去除，并且基板被分离成单独的发光二极管。因此，可以提供一种发光二极管，其中通过传递模塑工艺形成的第一模制部分位于由衬底的切割表面包围的区域内。由于第一成型部分位于由基板的切割面包围的区域内，所以第二成型部分可以以各种方式对称地形成在第一成型部分的侧表面上。

24. 发明申请

US20090267085A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 有权
标题翻译：具有连接在一起的发光细胞阵列的LED封装
公开(公告)号：US20090267085A1
公开(公告)日：2009-10-29
申请号：US11908112
申请日：2005-10-26
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

25. 发明申请

US20090189178A1 LEADFRAME HAVING A HEAT SINK SUPPORTING PART, FABRICATING METHOD OF A LIGHT EMITTING DIODE PACKAGE USING THE SAME, AND LIGHT EMITTING DIODE PACKAGE FABRICATED BY THE METHOD 有权
标题翻译：具有散热支撑部件的铅笔，使用其的发光二极管封装的制造方法和由该方法制成的发光二极管封装
公开(公告)号：US20090189178A1
公开(公告)日：2009-07-30
申请号：US12304663
申请日：2007-06-28
申请人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
发明人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
IPC分类号： H01L33/00 , H01L23/495 , H01L21/50 , H01L23/36
CPC分类号： H01L33/62 , H01L23/4334 , H01L23/49861 , H01L33/486 , H01L33/642 , H01L2224/45139 , H01L2224/48247 , H01L2924/00011 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005
摘要： Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.
摘要翻译：公开了具有散热器支撑部件的引线框架，使用引线框架的发光二极管封装以及使用引线框架的发光二极管封装件的制造方法。引线框架包括围绕预定区域的外框架。散热器支撑部件向内延伸以从外框架彼此面对。每个支撑部分具有联接到散热器的端部。此外，引线端子向内延伸以从外框架彼此面对。引线端子与支撑部分间隔开。因此，在散热器连接到支撑部件的端部之后，可以通过插入成型技术形成封装主体，并且散热器和引线端子可以容易地对准。

26. 发明申请

US20080231214A1 LIGHT EMITTING DEVICE HAVING VARIOUS COLOR TEMPERATURE 有权
标题翻译：具有各种颜色温度的发光装置
公开(公告)号：US20080231214A1
公开(公告)日：2008-09-25
申请号：US12051637
申请日：2008-03-19
申请人： Do Hyung Kim , Hyuck Jung Choi
发明人： Do Hyung Kim , Hyuck Jung Choi
IPC分类号： H05B37/02 , F21V9/02
CPC分类号： H05B33/0857 , A61N5/0618 , A61N2005/0652 , A61N2005/0662 , F21K9/00 , F21Y2115/10 , H05B33/0821 , H05B33/0842
摘要： A light emitting device capable of emitting light having various color temperatures is disclosed. The light emitting device includes a first light emitting part emitting a daylight color having a color temperature of 6000 K or more, a second light emitting part emitting white light having a color temperature less than 6000 K, and a third light emitting part emitting light in a visible range of 580 nm or more. The second and third light emitting parts are operable independently of the first light emitting part, and realize a warm white color having a color temperature of 3000 K or less with the white light emitted from the second light emitting part and the light emitted from the third light emitting part. The light emitting device realizes white light of various spectra and color temperatures corresponding to desired mood and utility. The light emitting device is controlled to emit light having a suitable wavelength or a suitable color temperature depending on the circadian rhythm of human, thereby enabling improvement of the user's health.
摘要翻译：公开了能够发出具有各种色温的光的发光装置。发光器件包括发射具有6000K或更高的色温的日光色的第一发光部分，发射色温小于6000K的白光的第二发光部分和第三发光部分发光 580nm以上的可见范围。第二发光部分和第三发光部分可独立于第一发光部分工作，并且从第二发光部分发射的白光和从第三发光部分发出的光实现具有3000K或更小的色温的暖白色发光部分。发光装置实现了与期望的情绪和效用对应的各种光谱和色温的白光。控制发光器件根据人的昼夜节律发光具有合适的波长或合适的色温，从而能够改善用户的健康。

27. 发明授权

US08482023B2 Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method 有权
标题翻译：具有散热器支撑部件的引线框架，使用其的发光二极管封装的制造方法以及通过该方法制造的发光二极管封装
公开(公告)号：US08482023B2
公开(公告)日：2013-07-09
申请号：US12304663
申请日：2007-06-28
申请人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
发明人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
IPC分类号： H01L33/00 , H01L23/495 , H01L21/50
CPC分类号： H01L33/62 , H01L23/4334 , H01L23/49861 , H01L33/486 , H01L33/642 , H01L2224/45139 , H01L2224/48247 , H01L2924/00011 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005
摘要： Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.
摘要翻译：公开了具有散热器支撑部件的引线框架，使用引线框架的发光二极管封装以及使用引线框架的发光二极管封装件的制造方法。引线框架包括围绕预定区域的外框架。散热器支撑部件向内延伸以从外框架彼此面对。每个支撑部分具有联接到散热器的端部。此外，引线端子向内延伸以从外框架彼此面对。引线端子与支撑部分间隔开。因此，在散热器连接到支撑部件的端部之后，可以通过插入成型技术形成封装主体，并且散热器和引线端子可以容易地对准。

28. 发明授权

US08368190B2 LED package having an array of light emitting cells coupled in series 有权
公开(公告)号：US08368190B2
公开(公告)日：2013-02-05
申请号：US13074740
申请日：2011-03-29
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L23/495
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

29. 发明授权

US08159000B2 LED package having an array of light emitting cells coupled in series 有权
标题翻译： LED封装具有串联耦合的发光单元阵列
公开(公告)号：US08159000B2
公开(公告)日：2012-04-17
申请号：US13159846
申请日：2011-06-14
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
IPC分类号： H01L33/00 , H01L23/34
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

30. 发明授权

US07906892B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07906892B2
公开(公告)日：2011-03-15
申请号：US11964443
申请日：2007-12-26
申请人： Hyuck Jung Choi , Kwang Il Park
发明人： Hyuck Jung Choi , Kwang Il Park
IPC分类号： H01J5/16
CPC分类号： H01L33/504 , H01L33/44 , H01L33/46 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： Disclosed herein is a light emitting device. The light emitting device includes a light emitting diode disposed on a substrate to emit light of a first wavelength. A transparent molding part encloses the LED, a lower wavelength conversion material layer is disposed on the transparent molding part, and an upper wavelength conversion material layer is disposed on the lower wavelength conversion material layer. The lower wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a second wavelength longer than the first wavelength, and the upper wavelength conversion material layer contains a phosphor converting the light of the first wavelength into light of a third wavelength, which is longer than the first wavelength but shorter than the second wavelength. Light produced via wavelength conversion is prevented from being lost by the phosphor. Light emitting devices including a multilayer reflection mirror are also disclosed.
摘要翻译：本文公开了一种发光器件。发光装置包括设置在基板上以发射第一波长的光的发光二极管。透明成型部包围LED，在透明成型部上配置低波长转换材料层，在波长较低的转换材料层上设置上波长转换材料层。低波长转换材料层含有将第一波长的光转换成比第一波长长的第二波长的光的荧光体，并且上波长转换材料层含有将第一波长的光转换成第三波长的光的荧光体波长比第一波长长但比第二波长短。防止由波长转换产生的光被荧光体损失。还公开了包括多层反射镜的发光器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式