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    • 23. 发明授权
    • Compact rotationally steerable ultrasound transducer
    • 紧凑型可旋转超声波换能器
    • US5465724A
    • 1995-11-14
    • US69092
    • 1993-05-28
    • John W. Sliwa, Jr.Thomas G. CooperSevig Ayter
    • John W. Sliwa, Jr.Thomas G. CooperSevig Ayter
    • A61B8/00A61B8/12G10K11/35
    • A61B8/12A61B8/445A61B8/4461G10K11/355
    • According to the present invention, an ultrasonic probe for use with a remote ultrasonic imaging system is provided, having a multielement transducer with an upper surface and a lower surface. An ultrasonically attenuative backing material adjoins the lower surface of the multielement transducer. The attenuative backing material is disposed within a container. A circular track is mounted to the container, and a flexible assembly and a carrier band are attached to the container. The carrier band may be operable to rotate the multielement transducer about an axis defined by the circular track. Alternatively, the circular track may be operable to rotate the multielement transducer. Additionally, a method of forming near real-time images of an object in a plane that is oblique to the axis of rotation of the multielement transducer is provided.
    • 根据本发明,提供了一种与远程超声波成像系统一起使用的超声波探头,具有上表面和下表面的多元件换能器。 超声衰减背衬材料邻接多元件换能器的下表面。 衰减背衬材料设置在容器内。 圆形轨道安装到容器上,并且柔性组件和载体带附接到容器。 载体带可以用于围绕由圆形轨道限定的轴旋转多元件换能器。 或者,圆形轨道可操作以旋转多元件换能器。 此外,提供了在与多重元件换能器的旋转轴线倾斜的平面中形成物体的近似实时图像的方法。
    • 24. 发明授权
    • Method of coplanar integration of semiconductor IC devices
    • 半导体IC器件的共面集成方法
    • US5075253A
    • 1991-12-24
    • US581510
    • 1990-09-12
    • John W. Sliwa, Jr.
    • John W. Sliwa, Jr.
    • H01L21/98H01L23/52H01L23/538H01L25/065H01L29/06
    • H01L25/50H01L23/52H01L23/5381H01L25/0655H01L29/0657H01L2224/95146H01L2924/01004H01L2924/01014H01L2924/01019H01L2924/01078H01L2924/01079H01L2924/01322H01L2924/09701H01L2924/10253H01L2924/12041H01L2924/3011Y10T29/4913
    • A high degree of wafer-scale integration of normally incompatible IC devices is achieved by providing a plurality of segments (10), each segment having thereon one or more circuits, circuit elements, sensors and/or I/O connections (14'). Each segment is provided with at least one edge (12) having an abutting portion (12a) capable of abutting against a similar edge of a neighboring segment. The segments are placed on the surface of a flotation liquid (20) and are allowed to be pulled together so as to mate abutting edges of neighboring segments, thereby forming superchips (10'). Microbridges (22) are formed between neighboring segments, such as by solidifying the flotation liquid, and interconnections (26) are formed between neighboring segments. In this manner, coplanar integration of semiconductor ICs is obtained, permitting mixed and normally incompatible circuit functions on one pseudomonolithic device as diverse as silicon and III-V digital circuits, III-V optoelectronic devices, static RAMs, charge coupled devices, III-V lasers, superconducting thin films, ferromagnetic non-volatile memories, high electron mobility transistors, and bubble memories, to name a few, to be integrated in any desired combination. The yieldable scale of integration of a given device technology is also greatly extended. The segments are brought together in a particulate-free fashion with high throughput and exacting reproducibility at low cost.
    • 通常提供多个段(10),每个段具有一个或多个电路,电路元件,传感器和/或I / O连接(14'),可实现通常不兼容的IC器件的高度的晶片级集成。 每个段设置有至少一个边缘(12),该边缘具有抵靠部分(12a),该邻接部分能抵靠邻近段的类似边缘。 这些段被放置在浮选液体(20)的表面上,并被允许被拉在一起,以便配合相邻段的邻接边缘,由此形成超级磁芯(10')。 在相邻段之间形成微桥(22),例如通过固化浮选液体,并且在相邻段之间形成互连(26)。 以这种方式,获得半导体IC的共面集成,允许在一个假单元器件上混合和通常不兼容的电路功能,如硅和III-V数字电路,III-V光电子器件,静态RAM,电荷耦合器件,III-V 激光器,超导薄膜,铁磁非易失性存储器,高电子迁移率晶体管和气泡存储器等等,以集成在任何期望的组合中。 给定设备技术的可收缩的整合规模也大大延伸。 这些片段以无颗粒的方式以低成本以高产量和严格的再现性结合在一起。
    • 26. 发明授权
    • Integrated circuit micropackaging
    • 集成电路微封装
    • US4322737A
    • 1982-03-30
    • US96211
    • 1979-11-20
    • John W. Sliwa, Jr.
    • John W. Sliwa, Jr.
    • F28D15/04H01L23/34H01L23/427H01L31/052H02S40/42H02S40/44H01L23/02H01L25/04H01L23/48
    • F28D15/046H01L23/34H01L23/427H01L31/052H01L2924/0002Y02E10/50Y10S257/93
    • Thermal dissipation problems characteristic of micropackaging applications in integrated circuits can be eliminated by the use of a semiconductor heat pipe package. Additionally, the heat pipe package as herein disclosed can be employed for the creation of substantially constant temperature surfaces. In applications where a device requires controlled temperatures in order to achieve optimum operation, such as in photo voltaic converters, the packaging of the present invention provides a means for such temperature control. The heat pipe package comprises, in its simplest form, a closed vessel or box containing a heat transferring fluid. In its liquid state, the heat transferring fluid is transported along the interior surfaces of the box by means of a plurality of microgrooves through capillary action. The interior cavity of the heat pipe package or box provides a means for transport of the heat transferring fluid in the vapor state. The integrated circuits may be disposed in the semiconductor surface of the package itself, or mounted as dies in high density. The large number of intercommunications which are required between the high density of integrated circuits included with the micropackaging can be achieved by a combination of optical and electrical communication lines or buses.
    • 通过使用半导体热管封装可以消除集成电路中的微封装应用的特征的散热问题。 此外,如本文所公开的热管包装可用于创建基本恒定的温度表面。 在设备需要受控温度以达到最佳操作的应用中,例如在光伏转换器中,本发明的封装提供了这种温度控制的手段。 热管包装以其最简单的形式包括含有传热流体的密闭容器或箱体。 在其液体状态下,传热流体通过多个微槽通过毛细作用沿着盒的内表面传送。 热管封装或箱体的内腔提供了一种在蒸汽状态下运输传热流体的装置。 集成电路可以设置在封装本身的半导体表面中,或者作为模具高密度地安装。 包含在微封装中的高密度集成电路之间所需的大量互通可以通过光和电通信线路或总线的组合来实现。
    • 27. 发明授权
    • Stacked and filled capacitive microelectromechanical ultrasonic transducer for medical diagnostic ultrasound systems
    • 用于医疗诊断超声系统的堆叠和填充的电容式微机电超声波换能器
    • US06558330B1
    • 2003-05-06
    • US09731597
    • 2000-12-06
    • Sevig AyterJohn W. Sliwa, Jr.
    • Sevig AyterJohn W. Sliwa, Jr.
    • A61B800
    • B06B1/0292B06B2201/76
    • A capacitive microelectromechanical ultrasound transducer array with improved efficiency and durability is provided. Efficiency is provided by stacking CMUTs in the range dimension (i.e. away from the face of the transducer). A plurality of chambers and associated membranes are stacked along a range dimension or parallel to the direction of acoustic radiation. Because the CMUT transducer element is stacked, ultrasound is transmitted through the plurality of chambers, amplifying the response of the transducer element. Durability is increased within the transducer by filling the chamber with a nongaseous filler. A liquid, polymer, solid or plasma fills the chamber or chambers. The nongaseous filler allows movement of the membrane for transducing between acoustic and electrical energies, but prevents collapse or bottoming out of the membrane.
    • 提供了具有改进的效率和耐久性的电容式微机电超声换能器阵列。 通过将CMUT堆叠在范围维度(即远离换能器的表面)来提供效率。 多个室和相关膜沿着范围尺寸或平行于声辐射的方向堆叠。 由于CMUT换能器元件堆叠,超声波通过多个腔室传播,从而放大换能器元件的响应。 通过用非气体填充物填充室,传感器内的耐久性增加。 液体,聚合物,固体或等离子体填充室或室。 非气态填充剂允许膜在声能和电能之间的转移移动,但是防止膜的塌陷或底部流出。
    • 28. 发明授权
    • Compact rotationally steerable ultrasound transducer
    • 紧凑型可旋转超声波换能器
    • US5575288A
    • 1996-11-19
    • US479617
    • 1995-06-07
    • John W. Sliwa, Jr.Thomas G. CooperSevig Ayter
    • John W. Sliwa, Jr.Thomas G. CooperSevig Ayter
    • A61B8/00A61B8/12G10K11/35
    • A61B8/12A61B8/445A61B8/4461G10K11/355
    • According to the present invention, an ultrasonic imaging system having a remote ultrasound console and a probe connected thereto for inspecting an interior region of a body is provided. The ultrasonic imaging system includes a scanhead housing disposed at a distal end of the probe. A transducer is mounted upon a support structure within the scanhead housing and is electrically connected to the ultrasonic imaging system. The present invention also includes a magnetic position sensor located within the scanhead housing and coupled to the ultrasonic imaging system. The magnetic sensor may be attached to the support structure. In addition, the present invention may include a piezomotor mounted within an ultrasound probe, the piezomotor being mechanically coupled to an acoustic device within the probe.
    • 根据本发明,提供了一种具有远程超声控制台和连接到其上的用于检查身体内部区域的探针的超声波成像系统。 超声波成像系统包括设置在探头的远端处的扫描头壳体。 传感器安装在扫描头壳体内的支撑结构上并且电连接到超声波成像系统。 本发明还包括位于扫描头壳体内并耦合到超声成像系统的磁性位置传感器。 磁传感器可以附接到支撑结构。 此外,本发明可以包括安装在超声波探头内的压电电动机,该压电电动机被机械耦合到探针内的声学装置。
    • 30. 发明授权
    • Microvibratory memory device
    • 微振动记忆装置
    • US5216631A
    • 1993-06-01
    • US608335
    • 1990-11-02
    • John W. Sliwa, Jr.
    • John W. Sliwa, Jr.
    • G11C11/00G01Q80/00G01Q90/00G11B5/35G11B9/00G11B9/14G11B25/04G11B33/12G11B33/14G11C23/00
    • G11B33/121G11B25/04G11B33/12G11B33/14G11B5/35G11B9/14G11B9/1418G11B9/1436B82Y10/00G01Q70/06G01Q80/00
    • A memory device whose media scanning is vibrationally (cyclic harmonic vibration) or inertially (one-time pulsed read/write) driven is provided, comprising a plurality of cantilevers (7, 7', 7"), attached at one end and capable of vibrating. On the opposite end of each cantilever is disposed an array of storage bits (26). Opposite the surface of each cantilever having such a bit array is a read/-write head (27) which is similar in nature to a scanning tunneling microscopy or atomic force microscopy scanning-tip. Electronic support circuitry is provided to implement the memory device of the invention. Such circuitry includes a microprocessor (67), a multiplexer/demultiplexer (70), a group of circuits (66) comprising power supplies, sensing circuits and digital/analog and analog/digital conversion circuits,and switching means (65) to permit all of the previous functions to be properly addressed to/from the correct bit/array(s) and mating subdevice(s).
    • 提供其媒体扫描振动(循环谐波振动)或惯性(一次脉冲读/写)驱动的存储器件,包括多个悬臂(7,7',7“),其连接在一端并具有 振动。 在每个悬臂的另一端设置有一组存储位(26)。 与具有这种位阵列的每个悬臂的表面相对的是读/写头(27),其本质上类似于扫描隧道显微镜或原子力显微镜扫描尖端。 提供电子支持电路以实现本发明的存储器件。 这种电路包括微处理器(67),多路复用器/多路分解器(70),包括电源,感测电路和数字/模拟和模拟/数字转换电路的一组电路(66)和开关装置(65) 以前的功能被正确地寻址到/来自正确的位/阵列和配对子设备。