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21. 发明申请

US20130182333A1 APPARATUS AND PROCESS FOR PRODUCING PLANO-CONVEX SILICONE-ON-GLASS LENS ARRAYS 审中-公开
标题翻译：用于生产平面玻璃硅玻璃透镜阵列的装置和工艺
公开(公告)号：US20130182333A1
公开(公告)日：2013-07-18
申请号：US13812100
申请日：2011-07-21
申请人： Matthew Meitl , Rudolph Bukovnik , Etienne Menard , Wolfgang Wagner , David Kneeburg , Jimmy Mark
发明人： Matthew Meitl , Rudolph Bukovnik , Etienne Menard , Wolfgang Wagner , David Kneeburg , Jimmy Mark
IPC分类号： G02B3/00
CPC分类号： G02B3/0031 , B29C33/3842 , B29C33/58 , B29C33/62 , G02B3/0025 , G02B3/0056
摘要： Coating a machined mold with a flowable, hardenable polymer coating produces an optically-smooth finish and maintains sharpness in upward-pointing features. These procedures produce molds for highly efficient plano-convex silicone-on-glass lens arrays in a fast and inexpensive manner in which an end-mill defines the shape of a lens, and the coating produces its smoothness. End-mill machining and coating lens-shaped features in plates that have movable pins produce molds with eject features disposed inside features that form templates for lens elements without significantly reducing optical performance. Additionally, machining and coating plates that have movable inserts produce molds for lens arrays with reduced volume and one or several rings in each lens element.
摘要翻译：用可流动的可硬化聚合物涂层涂覆加工的模具产生光学光滑的表面，并保持向上指向特征的清晰度。这些程序以快速和便宜的方式为高效平凸硅硅玻璃透镜阵列生产模具，其中端铣刀限定透镜的形状，并且涂层产生其平滑度。端铣加工和具有可移动销的板中的透镜形状特征在具有布置在特征内的弹出特征的模具中，其形成用于透镜元件的模板，而不显着降低光学性能。此外，具有可移动嵌件的机械加工和涂布板可以产生具有减小体积的透镜阵列的模具和每个透镜元件中的一个或几个环。

22. 发明授权

US08470701B2 Printable, flexible and stretchable diamond for thermal management 有权
标题翻译：可打印，灵活和可拉伸的金刚石进行热管理
公开(公告)号：US08470701B2
公开(公告)日：2013-06-25
申请号：US12418071
申请日：2009-04-03
申请人： John A. Rogers , Tae Ho Kim , Won Mook Choi , Dae Hyeong Kim , Matthew Meitl , Etienne Menard , John Carlisle
发明人： John A. Rogers , Tae Ho Kim , Won Mook Choi , Dae Hyeong Kim , Matthew Meitl , Etienne Menard , John Carlisle
IPC分类号： H01L21/20
CPC分类号： H01L21/20 , B81B7/0093 , B81C1/0038 , B81C2201/0191 , H01L23/3732 , H01L2924/0002 , H01L2924/00
摘要： Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.
摘要翻译：公开了各种散热部件和制造散热部件的方法，其中与一个或多个发热部件热接触的金刚石能够散热，从而提供热调节部件。导热金刚石以能够提供有效和最大的热传递的图案提供，远离可能易受高温损坏的部件。这些器件和方法用于冷却易于产生显着热量的柔性电子器件，集成电路和其他复杂电子器件。还提供了制造可在一系列装置和装置部件中使用的可印刷金刚石图案的方法。

23. 发明授权

US08440546B2 Methods and devices for fabricating and assembling printable semiconductor elements 有权
公开(公告)号：US08440546B2
公开(公告)日：2013-05-14
申请号：US13113504
申请日：2011-05-23
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L21/322
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

24. 发明申请

US20100236603A1 Concentrator-Type Photovoltaic (CPV) Modules, Receiver and Sub-Receivers and Methods of Forming Same 有权
标题翻译：集中式光伏（CPV）模块，接收器和子接收器及其形成方法
公开(公告)号：US20100236603A1
公开(公告)日：2010-09-23
申请号：US12702841
申请日：2010-02-09
申请人： Etienne Menard , Christopher Bower , Scott Burroughs , Joe Carr , Bob Conner , Sergiy Dets , Bruce Furman , Matthew Meitl , Michael Sullivan
发明人： Etienne Menard , Christopher Bower , Scott Burroughs , Joe Carr , Bob Conner , Sergiy Dets , Bruce Furman , Matthew Meitl , Michael Sullivan
IPC分类号： H01L31/052 , H01L31/18
CPC分类号： G02B19/0076 , G02B3/0056 , G02B19/0014 , G02B19/0042 , H01L31/0232 , H01L31/02325 , H01L31/0543 , H01L31/0547 , Y02E10/52
摘要： CPV modules include a back plate having an array of 1 mm2 or smaller solar cells thereon. A backplane interconnect network is also provided on the back plate. This backplane interconnect network operates to electrically connect the array of solar cells together. A front plate, which is spaced-apart from the back plate, is provided. This front plate includes an array of primary lenses thereon that face the array of solar cells. The front plate can be configured to provide a greater than 1000× lens-to-cell light concentration to the array of solar cells. To achieve this 1000× lens-to-cell light concentration, the primary lenses can be configured as plano-convex lenses having a lens sag of less than about 4 mm. An array of secondary optical elements may also be provided, which extend between the array of primary lenses and the array of solar cells.
摘要翻译： CPV模块包括其上具有1mm 2或更小的太阳能电池阵列的背板。背板互连网络也设置在背板上。该背板互连网络用于将太阳能电池阵列电连接在一起。提供了与背板间隔开的前板。该前板包括面向太阳能电池阵列的主镜阵列。前板可以配置为向太阳能电池阵列提供大于1000倍的透镜到单元的光浓度。为了实现这种1000×透镜到单元光的浓度，主透镜可以被配置为具有小于约4mm的透镜凹陷的平凸透镜。还可以提供在主要透镜阵列和太阳能电池阵列之间延伸的次级光学元件阵列。

25. 发明授权

US09355854B2 Methods of fabricating printable compound semiconductor devices on release layers 有权
标题翻译：在剥离层上制造可印刷化合物半导体器件的方法
公开(公告)号：US09355854B2
公开(公告)日：2016-05-31
申请号：US13814343
申请日：2011-08-04
申请人： Matthew Meitl , Christopher Bower , Etienne Menard , James Carter , Allen Gray , Salvatore Bonafede
发明人： Matthew Meitl , Christopher Bower , Etienne Menard , James Carter , Allen Gray , Salvatore Bonafede
IPC分类号： H01L21/82 , H01L21/306 , H01L31/18 , H01L23/28 , H01L31/0216 , H01L31/048 , H01L23/053 , H01L21/02 , H01L21/78
CPC分类号： H01L21/306 , H01L21/02395 , H01L21/02461 , H01L21/02546 , H01L21/02549 , H01L21/02664 , H01L21/30612 , H01L21/7813 , H01L23/053 , H01L23/28 , H01L31/02168 , H01L31/048 , H01L31/184 , H01L31/1844 , H01L31/1892 , H01L2924/0002 , Y02E10/544 , H01L2924/00
摘要： A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed.
摘要翻译：制造可转移半导体器件的方法包括在衬底上提供包括磷化铝铟的释放层，并在释放层上提供支撑层。支撑层和基板包括各种材料，例如基于砷化物的材料，使得剥离层相对于支撑层和基底具有蚀刻选择性。在支撑层上提供至少一个器件层。选择性地蚀刻释放层，而基本上不蚀刻支撑层和基底。还讨论了相关的结构和方法。

26. 发明授权

US09142468B2 Structures and methods for testing printable integrated circuits 有权
标题翻译：用于测试可印刷集成电路的结构和方法
公开(公告)号：US09142468B2
公开(公告)日：2015-09-22
申请号：US13818901
申请日：2011-08-24
申请人： Christopher Bower , Etienne Menard , Matthew Meitl
发明人： Christopher Bower , Etienne Menard , Matthew Meitl
IPC分类号： H01L23/58 , H01L21/66 , H01L21/683 , G01R31/26 , H01L21/308
CPC分类号： H01L33/62 , G01R31/26 , G01R31/2644 , H01L21/308 , H01L21/6835 , H01L22/14 , H01L22/30 , H01L22/32 , H01L25/0753 , H01L33/16 , H01L33/30 , H01L33/34 , H01L33/48 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： A substrate includes an anchor area (30) physically secured to a surface of the substrate (10) and at least one printable electronic component (20). The at least one printable electronic component includes an active layer (14) having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers (40). The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.
摘要翻译：衬底包括物理地固定到衬底（10）的表面上的锚定区域（30）和至少一个可印刷的电子部件（20）。所述至少一个可印刷电子部件包括其上具有一个或多个有源元件的有源层（14），并且通过导电可破坏的系绳（40）悬挂在基板的表面上。导电可破裂系绳包括绝缘层和导电层，其物理地固定和电连接至少一个可印刷的电子部件到锚定区域，并且被配置为响应于施加到其上的压力而优先断裂。还讨论了相关的制造和测试方法。

27. 发明申请

US20100248484A1 Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby 有权
标题翻译：形成可印刷的集成电路器件和器件的方法
公开(公告)号：US20100248484A1
公开(公告)日：2010-09-30
申请号：US12732868
申请日：2010-03-26
申请人： Christopher Bower , Etienne Menard , Matthew Meitl
发明人： Christopher Bower , Etienne Menard , Matthew Meitl
IPC分类号： H01L21/302
CPC分类号： H01L27/1266 , H01L21/3065 , H01L21/32055 , H01L21/76834 , H01L21/76877 , H01L21/84 , H01L27/1214 , H01L27/1222 , H01L27/124 , H01L27/1248 , H01L29/78666
摘要： Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.
摘要翻译：形成集成电路器件的方法包括在处理衬底上形成牺牲层并在牺牲层上形成半导体活性层。执行步骤以依次选择性地蚀刻半导体有源层和牺牲层以限定绝缘体上半导体（SOI）衬底，其包括半导体有源层的第一部分。可以在SOI衬底上形成多层电互连网络。该多层电互连网络可以由与半导体有源层的第一部分的上表面接触的无机覆盖层封装。可以执行步骤以选择性地蚀刻通过覆盖层和半导体有源层的第一部分，从而暴露牺牲层。可以从半导体有源层的第一部分和处理衬底之间选择性地去除牺牲层，从而限定由封盖层封装的悬浮集成电路芯片。

28. 发明申请

US20090294803A1 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 有权
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：US20090294803A1
公开(公告)日：2009-12-03
申请号：US11145574
申请日：2005-06-02
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L29/772 , H01L27/12 , H01L21/782 , H01L21/30 , H01L29/06 , H01L29/861
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

29. 发明授权

US09049797B2 Electrically bonded arrays of transfer printed active components 有权
标题翻译：转印印刷活性组件的电子结合阵列
公开(公告)号：US09049797B2
公开(公告)日：2015-06-02
申请号：US13638040
申请日：2011-03-22
申请人： Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
发明人： Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
IPC分类号： H05K7/00 , H05K1/16 , B23K31/00 , H05K1/18 , H01L21/683 , H01L21/768 , H01L23/48 , H01L27/12 , H01L27/146 , H01L31/0203 , H01L31/048 , H05K13/04 , H01L23/00 , H01S5/022
CPC分类号： H05K7/06 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/02 , H01L24/05 , H01L24/08 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L27/1214 , H01L27/1266 , H01L27/14618 , H01L31/0203 , H01L31/048 , H01L2221/6835 , H01L2221/68372 , H01L2221/68381 , H01L2224/02371 , H01L2224/02372 , H01L2224/0239 , H01L2224/04026 , H01L2224/05548 , H01L2224/056 , H01L2224/08238 , H01L2224/24011 , H01L2224/24137 , H01L2224/24147 , H01L2224/24226 , H01L2224/245 , H01L2224/24998 , H01L2224/2731 , H01L2224/29078 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/3012 , H01L2224/32104 , H01L2224/32146 , H01L2224/32227 , H01L2224/73267 , H01L2224/76155 , H01L2224/80203 , H01L2224/80224 , H01L2224/81192 , H01L2224/82007 , H01L2224/821 , H01L2224/82102 , H01L2224/82106 , H01L2224/83093 , H01L2224/83121 , H01L2224/83191 , H01L2224/83192 , H01L2224/83805 , H01L2224/83815 , H01L2224/8384 , H01L2224/83851 , H01L2224/83855 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/92143 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01S5/02236 , H01S5/02276 , H05K1/18 , H05K3/0058 , H05K3/10 , H05K13/04 , H05K13/046 , Y02E10/50 , Y10T29/41 , Y10T29/4913 , Y10T29/49139 , H01L2924/00014 , H01L2924/00 , H01L2224/13111
摘要： An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.
摘要翻译：有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的上侧和相对的底侧以及一个或多个有源元件。有源元件电连接到触点，并且底侧粘附到目标基板。还讨论了相关的制造方法。

30. 发明申请

US20130221355A1 STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS 有权
标题翻译：用于测试可打印集成电路的结构和方法
公开(公告)号：US20130221355A1
公开(公告)日：2013-08-29
申请号：US13818901
申请日：2011-08-24
申请人： Christopher Bower , Etienne Menard , Matthew Meitl
发明人： Christopher Bower , Etienne Menard , Matthew Meitl
IPC分类号： H01L21/66 , G01R31/26 , H01L21/308
CPC分类号： H01L33/62 , G01R31/26 , G01R31/2644 , H01L21/308 , H01L21/6835 , H01L22/14 , H01L22/30 , H01L22/32 , H01L25/0753 , H01L33/16 , H01L33/30 , H01L33/34 , H01L33/48 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： A substrate includes an anchor area (30) physically secured to a surface of the substrate (10) and at least one printable electronic component (20). The at least one printable electronic component includes an active layer (14) having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers (40). The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.
摘要翻译：衬底包括物理地固定到衬底（10）的表面上的锚定区域（30）和至少一个可印刷的电子部件（20）。所述至少一个可印刷电子部件包括其上具有一个或多个有源元件的有源层（14），并且通过导电可破坏的系绳（40）悬挂在基板的表面上。导电可破裂系绳包括绝缘层和导电层，其物理地固定和电连接至少一个可印刷的电子部件到锚定区域，并且被配置为响应于施加到其上的压力而优先断裂。还讨论了相关的制造和测试方法。

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