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1. 发明申请

US20130196474A1 MATERIALS AND PROCESSES FOR RELEASING PRINTABLE COMPOUND SEMICONDUCTOR DEVICES 有权
标题翻译：用于释放可印刷复合半导体器件的材料和方法
公开(公告)号：US20130196474A1
公开(公告)日：2013-08-01
申请号：US13814343
申请日：2011-08-04
申请人： Matthew Meitl , Christopher Bower , Etienne Menard , James Carter , Allen Gray , Salvatore Bonafede
发明人： Matthew Meitl , Christopher Bower , Etienne Menard , James Carter , Allen Gray , Salvatore Bonafede
IPC分类号： H01L21/306
CPC分类号： H01L21/306 , H01L21/02395 , H01L21/02461 , H01L21/02546 , H01L21/02549 , H01L21/02664 , H01L21/30612 , H01L21/7813 , H01L23/053 , H01L23/28 , H01L31/02168 , H01L31/048 , H01L31/184 , H01L31/1844 , H01L31/1892 , H01L2924/0002 , Y02E10/544 , H01L2924/00
摘要： A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed.
摘要翻译：制造可转移半导体器件的方法包括在衬底上提供包括磷化铝铟的释放层，并在释放层上提供支撑层。支撑层和基板包括各种材料，例如基于砷化物的材料，使得剥离层相对于支撑层和基底具有蚀刻选择性。在支撑层上提供至少一个器件层。选择性地蚀刻释放层，而基本上不蚀刻支撑层和基底。还讨论了相关的结构和方法。

2. 发明授权

US09355854B2 Methods of fabricating printable compound semiconductor devices on release layers 有权
标题翻译：在剥离层上制造可印刷化合物半导体器件的方法
公开(公告)号：US09355854B2
公开(公告)日：2016-05-31
申请号：US13814343
申请日：2011-08-04
申请人： Matthew Meitl , Christopher Bower , Etienne Menard , James Carter , Allen Gray , Salvatore Bonafede
发明人： Matthew Meitl , Christopher Bower , Etienne Menard , James Carter , Allen Gray , Salvatore Bonafede
IPC分类号： H01L21/82 , H01L21/306 , H01L31/18 , H01L23/28 , H01L31/0216 , H01L31/048 , H01L23/053 , H01L21/02 , H01L21/78
CPC分类号： H01L21/306 , H01L21/02395 , H01L21/02461 , H01L21/02546 , H01L21/02549 , H01L21/02664 , H01L21/30612 , H01L21/7813 , H01L23/053 , H01L23/28 , H01L31/02168 , H01L31/048 , H01L31/184 , H01L31/1844 , H01L31/1892 , H01L2924/0002 , Y02E10/544 , H01L2924/00
摘要： A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed.
摘要翻译：制造可转移半导体器件的方法包括在衬底上提供包括磷化铝铟的释放层，并在释放层上提供支撑层。支撑层和基板包括各种材料，例如基于砷化物的材料，使得剥离层相对于支撑层和基底具有蚀刻选择性。在支撑层上提供至少一个器件层。选择性地蚀刻释放层，而基本上不蚀刻支撑层和基底。还讨论了相关的结构和方法。

3. 发明申请

US20100236603A1 Concentrator-Type Photovoltaic (CPV) Modules, Receiver and Sub-Receivers and Methods of Forming Same 有权
标题翻译：集中式光伏（CPV）模块，接收器和子接收器及其形成方法
公开(公告)号：US20100236603A1
公开(公告)日：2010-09-23
申请号：US12702841
申请日：2010-02-09
申请人： Etienne Menard , Christopher Bower , Scott Burroughs , Joe Carr , Bob Conner , Sergiy Dets , Bruce Furman , Matthew Meitl , Michael Sullivan
发明人： Etienne Menard , Christopher Bower , Scott Burroughs , Joe Carr , Bob Conner , Sergiy Dets , Bruce Furman , Matthew Meitl , Michael Sullivan
IPC分类号： H01L31/052 , H01L31/18
CPC分类号： G02B19/0076 , G02B3/0056 , G02B19/0014 , G02B19/0042 , H01L31/0232 , H01L31/02325 , H01L31/0543 , H01L31/0547 , Y02E10/52
摘要： CPV modules include a back plate having an array of 1 mm2 or smaller solar cells thereon. A backplane interconnect network is also provided on the back plate. This backplane interconnect network operates to electrically connect the array of solar cells together. A front plate, which is spaced-apart from the back plate, is provided. This front plate includes an array of primary lenses thereon that face the array of solar cells. The front plate can be configured to provide a greater than 1000× lens-to-cell light concentration to the array of solar cells. To achieve this 1000× lens-to-cell light concentration, the primary lenses can be configured as plano-convex lenses having a lens sag of less than about 4 mm. An array of secondary optical elements may also be provided, which extend between the array of primary lenses and the array of solar cells.
摘要翻译： CPV模块包括其上具有1mm 2或更小的太阳能电池阵列的背板。背板互连网络也设置在背板上。该背板互连网络用于将太阳能电池阵列电连接在一起。提供了与背板间隔开的前板。该前板包括面向太阳能电池阵列的主镜阵列。前板可以配置为向太阳能电池阵列提供大于1000倍的透镜到单元的光浓度。为了实现这种1000×透镜到单元光的浓度，主透镜可以被配置为具有小于约4mm的透镜凹陷的平凸透镜。还可以提供在主要透镜阵列和太阳能电池阵列之间延伸的次级光学元件阵列。

4. 发明授权

US10416425B2 Concentrator-type photovoltaic (CPV) modules, receiver and sub-receivers and methods of forming same 有权
公开(公告)号：US10416425B2
公开(公告)日：2019-09-17
申请号：US12702841
申请日：2010-02-09
申请人： Etienne Menard , Christopher Bower , Scott Burroughs , Joe Carr , Bob Conner , Sergiy Dets , Bruce Furman , Matthew Meitl , Michael Sullivan
发明人： Etienne Menard , Christopher Bower , Scott Burroughs , Joe Carr , Bob Conner , Sergiy Dets , Bruce Furman , Matthew Meitl , Michael Sullivan
IPC分类号： H01L31/0232 , H01L31/054 , G02B19/00 , G02B3/00
摘要： CPV modules include a back plate having an array of 1 mm2 or smaller solar cells thereon. A backplane interconnect network is also provided on the back plate. This backplane interconnect network operates to electrically connect the array of solar cells together. A front plate, which is spaced-apart from the back plate, is provided. This front plate includes an array of primary lenses thereon that face the array of solar cells. The front plate can be configured to provide a greater than 1000× lens-to-cell light concentration to the array of solar cells. To achieve this 1000× lens-to-cell light concentration, the primary lenses can be configured as plano-convex lenses having a lens sag of less than about 4 mm. An array of secondary optical elements may also be provided, which extend between the array of primary lenses and the array of solar cells.

5. 发明授权

US08877648B2 Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby 有权
标题翻译：通过选择性蚀刻来形成可印刷集成电路器件的方法，以将器件从处理衬底悬挂下来，以及由此形成的器件
公开(公告)号：US08877648B2
公开(公告)日：2014-11-04
申请号：US12732868
申请日：2010-03-26
申请人： Christopher Bower , Etienne Menard , Matthew Meitl
发明人： Christopher Bower , Etienne Menard , Matthew Meitl
IPC分类号： H01L21/311
CPC分类号： H01L27/1266 , H01L21/3065 , H01L21/32055 , H01L21/76834 , H01L21/76877 , H01L21/84 , H01L27/1214 , H01L27/1222 , H01L27/124 , H01L27/1248 , H01L29/78666
摘要： Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.
摘要翻译：形成集成电路器件的方法包括在处理衬底上形成牺牲层并在牺牲层上形成半导体活性层。执行步骤以依次选择性地蚀刻半导体有源层和牺牲层以限定绝缘体上半导体（SOI）衬底，其包括半导体有源层的第一部分。可以在SOI衬底上形成多层电互连网络。该多层电互连网络可以由与半导体有源层的第一部分的上表面接触的无机覆盖层封装。可以执行步骤以选择性地蚀刻通过覆盖层和半导体有源层的第一部分，从而暴露牺牲层。可以从半导体有源层的第一部分和处理衬底之间选择性地去除牺牲层，从而限定由封盖层封装的悬浮集成电路芯片。

6. 发明授权

US09142468B2 Structures and methods for testing printable integrated circuits 有权
标题翻译：用于测试可印刷集成电路的结构和方法
公开(公告)号：US09142468B2
公开(公告)日：2015-09-22
申请号：US13818901
申请日：2011-08-24
申请人： Christopher Bower , Etienne Menard , Matthew Meitl
发明人： Christopher Bower , Etienne Menard , Matthew Meitl
IPC分类号： H01L23/58 , H01L21/66 , H01L21/683 , G01R31/26 , H01L21/308
CPC分类号： H01L33/62 , G01R31/26 , G01R31/2644 , H01L21/308 , H01L21/6835 , H01L22/14 , H01L22/30 , H01L22/32 , H01L25/0753 , H01L33/16 , H01L33/30 , H01L33/34 , H01L33/48 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： A substrate includes an anchor area (30) physically secured to a surface of the substrate (10) and at least one printable electronic component (20). The at least one printable electronic component includes an active layer (14) having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers (40). The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.
摘要翻译：衬底包括物理地固定到衬底（10）的表面上的锚定区域（30）和至少一个可印刷的电子部件（20）。所述至少一个可印刷电子部件包括其上具有一个或多个有源元件的有源层（14），并且通过导电可破坏的系绳（40）悬挂在基板的表面上。导电可破裂系绳包括绝缘层和导电层，其物理地固定和电连接至少一个可印刷的电子部件到锚定区域，并且被配置为响应于施加到其上的压力而优先断裂。还讨论了相关的制造和测试方法。

7. 发明申请

US20100248484A1 Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby 有权
标题翻译：形成可印刷的集成电路器件和器件的方法
公开(公告)号：US20100248484A1
公开(公告)日：2010-09-30
申请号：US12732868
申请日：2010-03-26
申请人： Christopher Bower , Etienne Menard , Matthew Meitl
发明人： Christopher Bower , Etienne Menard , Matthew Meitl
IPC分类号： H01L21/302
CPC分类号： H01L27/1266 , H01L21/3065 , H01L21/32055 , H01L21/76834 , H01L21/76877 , H01L21/84 , H01L27/1214 , H01L27/1222 , H01L27/124 , H01L27/1248 , H01L29/78666
摘要： Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.
摘要翻译：形成集成电路器件的方法包括在处理衬底上形成牺牲层并在牺牲层上形成半导体活性层。执行步骤以依次选择性地蚀刻半导体有源层和牺牲层以限定绝缘体上半导体（SOI）衬底，其包括半导体有源层的第一部分。可以在SOI衬底上形成多层电互连网络。该多层电互连网络可以由与半导体有源层的第一部分的上表面接触的无机覆盖层封装。可以执行步骤以选择性地蚀刻通过覆盖层和半导体有源层的第一部分，从而暴露牺牲层。可以从半导体有源层的第一部分和处理衬底之间选择性地去除牺牲层，从而限定由封盖层封装的悬浮集成电路芯片。

8. 发明授权

US09049797B2 Electrically bonded arrays of transfer printed active components 有权
标题翻译：转印印刷活性组件的电子结合阵列
公开(公告)号：US09049797B2
公开(公告)日：2015-06-02
申请号：US13638040
申请日：2011-03-22
申请人： Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
发明人： Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
IPC分类号： H05K7/00 , H05K1/16 , B23K31/00 , H05K1/18 , H01L21/683 , H01L21/768 , H01L23/48 , H01L27/12 , H01L27/146 , H01L31/0203 , H01L31/048 , H05K13/04 , H01L23/00 , H01S5/022
CPC分类号： H05K7/06 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/02 , H01L24/05 , H01L24/08 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L27/1214 , H01L27/1266 , H01L27/14618 , H01L31/0203 , H01L31/048 , H01L2221/6835 , H01L2221/68372 , H01L2221/68381 , H01L2224/02371 , H01L2224/02372 , H01L2224/0239 , H01L2224/04026 , H01L2224/05548 , H01L2224/056 , H01L2224/08238 , H01L2224/24011 , H01L2224/24137 , H01L2224/24147 , H01L2224/24226 , H01L2224/245 , H01L2224/24998 , H01L2224/2731 , H01L2224/29078 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/3012 , H01L2224/32104 , H01L2224/32146 , H01L2224/32227 , H01L2224/73267 , H01L2224/76155 , H01L2224/80203 , H01L2224/80224 , H01L2224/81192 , H01L2224/82007 , H01L2224/821 , H01L2224/82102 , H01L2224/82106 , H01L2224/83093 , H01L2224/83121 , H01L2224/83191 , H01L2224/83192 , H01L2224/83805 , H01L2224/83815 , H01L2224/8384 , H01L2224/83851 , H01L2224/83855 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/92143 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01S5/02236 , H01S5/02276 , H05K1/18 , H05K3/0058 , H05K3/10 , H05K13/04 , H05K13/046 , Y02E10/50 , Y10T29/41 , Y10T29/4913 , Y10T29/49139 , H01L2924/00014 , H01L2924/00 , H01L2224/13111
摘要： An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.
摘要翻译：有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的上侧和相对的底侧以及一个或多个有源元件。有源元件电连接到触点，并且底侧粘附到目标基板。还讨论了相关的制造方法。

9. 发明申请

US20130221355A1 STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS 有权
标题翻译：用于测试可打印集成电路的结构和方法
公开(公告)号：US20130221355A1
公开(公告)日：2013-08-29
申请号：US13818901
申请日：2011-08-24
申请人： Christopher Bower , Etienne Menard , Matthew Meitl
发明人： Christopher Bower , Etienne Menard , Matthew Meitl
IPC分类号： H01L21/66 , G01R31/26 , H01L21/308
CPC分类号： H01L33/62 , G01R31/26 , G01R31/2644 , H01L21/308 , H01L21/6835 , H01L22/14 , H01L22/30 , H01L22/32 , H01L25/0753 , H01L33/16 , H01L33/30 , H01L33/34 , H01L33/48 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： A substrate includes an anchor area (30) physically secured to a surface of the substrate (10) and at least one printable electronic component (20). The at least one printable electronic component includes an active layer (14) having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers (40). The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.
摘要翻译：衬底包括物理地固定到衬底（10）的表面上的锚定区域（30）和至少一个可印刷的电子部件（20）。所述至少一个可印刷电子部件包括其上具有一个或多个有源元件的有源层（14），并且通过导电可破坏的系绳（40）悬挂在基板的表面上。导电可破裂系绳包括绝缘层和导电层，其物理地固定和电连接至少一个可印刷的电子部件到锚定区域，并且被配置为响应于施加到其上的压力而优先断裂。还讨论了相关的制造和测试方法。

10. 发明申请

US20130153277A1 ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS 有权
标题翻译：传输打印活动组件的电粘结阵列
公开(公告)号：US20130153277A1
公开(公告)日：2013-06-20
申请号：US13638040
申请日：2011-03-22
申请人： Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
发明人： Etienne Menard , Christopher Bower , Matthew Meitl , Philip Garrou
IPC分类号： H05K1/18 , H05K13/04
CPC分类号： H05K7/06 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L24/02 , H01L24/05 , H01L24/08 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L27/1214 , H01L27/1266 , H01L27/14618 , H01L31/0203 , H01L31/048 , H01L2221/6835 , H01L2221/68372 , H01L2221/68381 , H01L2224/02371 , H01L2224/02372 , H01L2224/0239 , H01L2224/04026 , H01L2224/05548 , H01L2224/056 , H01L2224/08238 , H01L2224/24011 , H01L2224/24137 , H01L2224/24147 , H01L2224/24226 , H01L2224/245 , H01L2224/24998 , H01L2224/2731 , H01L2224/29078 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/3012 , H01L2224/32104 , H01L2224/32146 , H01L2224/32227 , H01L2224/73267 , H01L2224/76155 , H01L2224/80203 , H01L2224/80224 , H01L2224/81192 , H01L2224/82007 , H01L2224/821 , H01L2224/82102 , H01L2224/82106 , H01L2224/83093 , H01L2224/83121 , H01L2224/83191 , H01L2224/83192 , H01L2224/83805 , H01L2224/83815 , H01L2224/8384 , H01L2224/83851 , H01L2224/83855 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/92143 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01S5/02236 , H01S5/02276 , H05K1/18 , H05K3/0058 , H05K3/10 , H05K13/04 , H05K13/046 , Y02E10/50 , Y10T29/41 , Y10T29/4913 , Y10T29/49139 , H01L2924/00014 , H01L2924/00 , H01L2224/13111
摘要： An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.
摘要翻译：有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的上侧和相对的底侧以及一个或多个有源元件。有源元件电连接到触点，并且底侧粘附到目标基板。还讨论了相关的制造方法。

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