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21. 发明授权

US5650914A Compliant thermal connectors, methods of making the same and assemblies incorporating the same 失效
标题翻译：符合标准的热连接器，制造相同的方法和结合其的组件
公开(公告)号：US5650914A
公开(公告)日：1997-07-22
申请号：US695611
申请日：1996-08-12
申请人： Thomas H. DiStefano , John W. Smith
发明人： Thomas H. DiStefano , John W. Smith
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H05K7/20
CPC分类号： H05K7/20445 , H01L23/3672 , H01L23/4006 , H01L2023/4043 , H01L2023/4062 , H01L2023/4068 , H01L2224/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , Y10T29/4935
摘要： A thermal connector for conducting heat from microelectronic components such as semiconductor chips to a heat sink. The connector includes a large number of flexible thermal conductors desirably formed as elongated "S"-shaped strips or ribbons. The conductors can flex to accommodate tolerances in the assembly and displacement of the components caused by thermal expansion. The conductors may have relatively thin neck sections to increase the flexibility of the conductors, The connector may be fabricated by a process which includes fabrication of the conductors as flat strips, bonding of the conductors to a pair of opposed planar sheets and vertically moving the sheets away from one another to expand the conductors vertically to their final three-dimensional configuration.
摘要翻译：用于将热量从诸如半导体芯片的微电子部件传导到散热器的热连接器。连接器包括大量柔性热导体，期望形成为细长的“S”形条带。导体可以弯曲以适应由热膨胀引起的部件的组装和位移偏差。导体可以具有相对较薄的颈部部分以增加导体的柔性。该连接器可以通过包括将导体制成扁平条，将导体粘合到一对相对的平面片上并垂直移动片的工艺来制造彼此远离地将导体垂直地扩展到它们的最终三维配置。

22. 发明授权

US5629239A Manufacture of semiconductor connection components with frangible lead sections 失效
标题翻译：制造具有易碎引线部分的半导体连接部件
公开(公告)号：US5629239A
公开(公告)日：1997-05-13
申请号：US408262
申请日：1995-03-21
申请人： Thomas H. DiStefano , John W. Smith , Konstantine Karavakis , Joseph Fjelstad
发明人： Thomas H. DiStefano , John W. Smith , Konstantine Karavakis , Joseph Fjelstad
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498
CPC分类号： H01L24/86 , H01L21/4846 , H01L23/4985 , H01L23/49861 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , Y10T29/49121
摘要： A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads. The process avoids the need for especially fine etching to form notches in the lateral edges of the leads.
摘要翻译：一种半导体芯片连接部件，其具有多个引线，跨越支撑结构中的间隙并排延伸，每个引线具有易碎部分，以允许引线的一端在接合过程中从支撑结构脱离。通过在延伸的处理区域中处理引线形成材料形成脆性部分，该处理区域延伸穿过由许多引线占据的区域。该工艺避免了在引线的侧边缘上特别细蚀刻形成凹口的需要。

23. 发明授权

US5615824A Soldering with resilient contacts 失效
标题翻译：焊接与弹性接触
公开(公告)号：US5615824A
公开(公告)日：1997-04-01
申请号：US410324
申请日：1995-03-24
申请人： Joseph Fjelstad , Thomas H. DiStefano , John W. Smith
发明人： Joseph Fjelstad , Thomas H. DiStefano , John W. Smith
IPC分类号： H01R33/76 , B23K1/19 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/48 , H01L21/60 , H01L23/32 , H01L23/48 , H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H01R12/70 , H01R12/71 , H01R13/24 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/08 , H05K7/10 , B23K1/00
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/07357 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/7076 , H01R12/714 , H01R13/2407 , H01R13/2464 , H01R13/2485 , H05K3/326 , H05K3/3436 , H05K7/1069 , G01R1/06711 , G01R1/06733 , G01R1/06738 , G01R1/06744 , G01R3/00 , H01L2224/13109 , H01L2224/16 , H01L2224/16237 , H01L2224/8114 , H01L2224/81899 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01L2924/351 , H01R4/028 , H05K1/118 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , H05K3/3431 , H05K3/4092 , Y02P70/613 , Y10T29/49144 , Y10T29/49179
摘要： A method of making a solder connection. An element bearing a solder mass is forcibly engaged with another element bearing a resilient metallic contact so that the contact wipes the surface of the solder mass and so that the contact is deformed and bears against the wiped surface. While the contact is in its deformed condition, the contact and solder mass are brought to an elevated bonding temperature sufficient to soften the solder, so that the contact penetrates into the solder mass under the influence of its own resilience. The contact bonds with the pure solder inside the solder mass, so that the effective bonding can be achieved even without flux.
摘要翻译：制造焊接连接的方法。带有焊料块的元件被强制地与另一个带有弹性金属接触件的元件接合，使得接触件擦拭焊料块的表面，并使触头变形并且抵靠擦拭表面。当接触处于其变形状态时，接触和焊料质量达到足以软化焊料的升高的粘合温度，使得接触在其自身弹性的影响下渗透到焊料块中。触点与焊料中的纯焊料接合，从而即使没有焊剂也可以实现有效的接合。

24. 发明授权

US5489749A Semiconductor connection components and method with releasable lead support 失效
标题翻译：半导体连接元件和方法，具有可释放的引线支撑
公开(公告)号：US5489749A
公开(公告)日：1996-02-06
申请号：US268040
申请日：1994-06-29
申请人： Thomas H. DiStefano , Gary W. Grube , Igor Y. Khandros , Gaetan Mathiew
发明人： Thomas H. DiStefano , Gary W. Grube , Igor Y. Khandros , Gaetan Mathiew
IPC分类号： H01L21/60 , H01L23/31 , H01L23/495 , H01L23/498 , H01L23/50 , H05K1/18 , H05K3/36 , H05K3/40
CPC分类号： H01L23/49572 , H01L23/3107 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L24/01 , H01L2924/01082 , H01L2924/12042 , H05K3/361 , H05K3/4084 , Y10T29/49121 , Y10T29/4913 , Y10T29/49135 , Y10T29/49218 , Y10T29/49222
摘要： A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.
摘要翻译：用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙的优选介电支撑结构。引线延伸穿过这些间隙，使得引线支撑在间隙的两侧。因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。优选地，每个引线包括与间隙的一侧相邻的易碎部分，并且当引线与触点接合时，易碎部分断裂。引线与芯片上的触点的最终对准由焊接工具提供，其具有适于控制引线位置的特征。

25. 发明授权

US5282312A Multi-layer circuit construction methods with customization features 失效
标题翻译：多层电路施工方法具有定制功能
公开(公告)号：US5282312A
公开(公告)日：1994-02-01
申请号：US816634
申请日：1991-12-31
申请人： Thomas H. DiStefano , Igor Y. Khandros , Gary W. Grube
发明人： Thomas H. DiStefano , Igor Y. Khandros , Gary W. Grube
IPC分类号： H01L21/48 , H01L23/538 , H05K1/00 , H05K3/40 , H05K3/42 , H05K3/46 , H05K3/36
CPC分类号： H05K3/462 , H01L21/4857 , H01L23/5383 , H01L23/5385 , H01R12/523 , H05K1/0287 , H05K1/029 , H01L2924/0002 , H01L2924/09701 , H05K1/0298 , H05K2201/0195 , H05K2201/0305 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/09609 , H05K2201/09945 , H05K2201/10378 , H05K2201/10666 , H05K2203/175 , H05K3/4038 , H05K3/4069 , H05K3/4602 , H05K3/4623 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Multilayer circuit assemblies are made by stacking circuit panels having contacts on their top surfaces, through conductors extending between top and bottom surfaces and terminals connected to the bottomend of each through conductor. The terminals and contacts are arranged so that when the panels are stacked the terminals on the bottom of one panel are in alignment with the contacts on the top surface of the immediately underlying panel. The panels are selectively treated on their top and/or bottom surfaces so as to selectively disconnect or connect each contact to a terminal on the bottom surface of the same panel. For example, the top surface of the panel may be selectively etched to disconnect a contact from one through conductor and hence from the associated terminal. The aligned terminals and contacts are nonselectively connected to one another at each interface so that wherever a terminal and contact on adjacent panels are aligned with one another there are connected to one another. This forms composite vertical conductors extending through a plurality of the panels. The selective treatment of the panel top and bottom surfaces provides selective interruptions in the vertical conductors. A circuit panel precursor having the through conductors and methods of making the same are also provided.
摘要翻译：多层电路组件通过在其顶表面上堆叠具有触点的电路板，通过在顶表面和底表面之间延伸的导体以及连接到每个贯通导体的底端的端子而形成。端子和触点被布置成使得当面板堆叠时，一个面板的底部上的端子与紧邻的底板的顶表面上的触点对准。在其顶表面和/或底表面上选择性地处理这些面板，以便选择性地将每个接触件断开或连接到同一面板的底表面上的端子。例如，可以选择性地蚀刻面板的顶表面以将接触从一个导体断开，并因此从相关联的端子断开。对准的端子和触点在每个接口处彼此非选择性地连接，使得相邻面板上的端子和触点彼此对准的位置彼此连接。这形成延伸穿过多个面板的复合垂直导体。面板顶部和底部表面的选择性处理在垂直导体中提供选择性的中断。还提供了具有贯通导体的电路板前体及其制造方法。

26. 发明授权

US4587579A System for position detection on a rotating disk 失效
标题翻译：旋转盘上的位置检测系统
公开(公告)号：US4587579A
公开(公告)日：1986-05-06
申请号：US454745
申请日：1982-12-30
申请人： John Cocke , Thomas H. DiStefano
发明人： John Cocke , Thomas H. DiStefano
IPC分类号： G05D3/12 , G11B5/596 , G11B21/08 , G11B21/10 , G11B5/55
CPC分类号： G11B5/59677
摘要： An information reading/writing head is positioned to follow data tracks that are formed concentrically on a magnetic recording disk. A set of spiral radial position-indicating markings if formed which can be detected on the disk optically, or capacitively. The position of the head is determined by sensing the spiral markings. The reference for the phase detection is detected by sensing radial indicia on the disk periphery or spiral markings of servo data with a different pitch and frequency from the position-indicating spiral markings. A servo control system operated by the above disk, reads the radial position-indicating spiral pattern and the reference pattern on the disk and compares the relative phases of the two to compute the track position of the head. A set of phase-locked loops with subsequent phase comparators is used to decode the servo data.
摘要翻译：信息读/写头被定位成跟随在磁记录盘上同心地形成的数据轨迹。如果形成的一组螺旋径向位置指示标记，可以在光盘上或电容上在盘上检测。通过感测螺旋标记来确定头的位置。通过从位置指示螺旋标记感测具有不同间距和频率的伺服数据的盘周边的径向标记或螺旋标记来检测相位检测的参考。由上述盘操作的伺服控制系统读取盘上的径向位置指示螺旋图案和参考图案，并比较两者的相对相位以计算头部的轨迹位置。一组具有后续相位比较器的锁相环用于对伺服数据进行解码。

27. 发明授权

US07679001B2 Circuit board and method of manufacture thereof 失效
标题翻译：电路板及其制造方法
公开(公告)号：US07679001B2
公开(公告)日：2010-03-16
申请号：US11565715
申请日：2006-12-01
申请人： Alan E. Wang , Kevin C. Olson , Thomas H. DiStefano
发明人： Alan E. Wang , Kevin C. Olson , Thomas H. DiStefano
IPC分类号： H05K1/03
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/44 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/0919 , H05K2201/09309 , H05K2201/09554 , H05K2201/10446 , H05K2203/135 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.
摘要翻译：提供一种形成电路板的方法，包括：（a）提供第一导电片; （b）选择性地去除所述第一导电片的一个或多个部分以形成具有第一电路板的第一面板，所述第一电路板通过从所述第一电路板的边缘延伸的至少一个接片连接到所述第一面板的一次性部分到所述第一面板的一次性部分的边缘; （c）向第一电路板施加绝缘涂层，使得第一电路板的至少每个边缘被覆盖; 以及（d）以一种方式将第一电路板与一次性部分分开，由此至少部分突片保持附接到第一电路板并且包括第一电路板的导电片的暴露边缘。还提供了通过该方法形成的电路板。

28. 发明授权

US06938338B2 Method of making an electronic contact 失效
标题翻译：制作电子联系人的方法
公开(公告)号：US06938338B2
公开(公告)日：2005-09-06
申请号：US10417746
申请日：2003-04-17
申请人： Joseph Fjelstad , John W. Smith , Thomas H. DiStefano , James Zaccardi , A. Christian Walton
发明人： Joseph Fjelstad , John W. Smith , Thomas H. DiStefano , James Zaccardi , A. Christian Walton
IPC分类号： B23K1/19 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/48 , H01L23/48 , H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H01R12/70 , H01R12/71 , H01R13/24 , H01R43/16 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/08 , H05K7/10
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/07357 , G01R3/00 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01L24/81 , H01L2224/16237 , H01L2224/45144 , H01L2224/8114 , H01L2224/81385 , H01L2224/81899 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01R12/7076 , H01R13/2485 , H05K1/118 , H05K3/326 , H05K3/3431 , H05K3/3436 , H05K3/4092 , H05K7/1069 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/4921 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.
摘要翻译：诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。每个粗糙部分的尖端具有远离接触表面的尖端特征。当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合接合材料。

29. 发明授权

US06653172B2 Methods for providing void-free layers for semiconductor assemblies 有权
公开(公告)号：US06653172B2
公开(公告)日：2003-11-25
申请号：US10229593
申请日：2002-08-28
申请人： Thomas H. DiStefano , Joseph Fjelstad
发明人： Thomas H. DiStefano , Joseph Fjelstad
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/3107 , H01L23/3114 , H01L23/49572 , H01L24/32 , H01L24/80 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2224/08225 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/80203 , H01L2224/80207 , H01L2224/81192 , H01L2224/81904 , H01L2224/83209 , H01L2224/9212 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/80001 , H01L2224/81
摘要： A method of treating an interposer layer includes disposing an interposer layer between a semiconductor wafer and a substrate so that voids within the interposer layer are sealed and applying pressure to substantially eliminate the voids. A method of creating a substantially void-free interposer layer includes injecting the interposer layer between a wafer and a substrate and applying pressure to substantially remove the voids.

30. 发明授权

US06635553B1 Microelectronic assemblies with multiple leads 失效
标题翻译：具有多个引线的微电子组件
公开(公告)号：US06635553B1
公开(公告)日：2003-10-21
申请号：US09721048
申请日：2000-11-22
申请人： Thomas H. DiStefano , John W. Smith
发明人： Thomas H. DiStefano , John W. Smith
IPC分类号： H01L2130
CPC分类号： H01L23/4985 , H01L21/4839 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/642 , H01L24/72 , H01L2224/16 , H01L2224/45124 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01066 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/49126 , Y10T29/49144 , Y10T29/49158 , H01L2924/00 , H01L2224/48
摘要： A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.
摘要翻译：微电子连接部件包括诸如具有沿着表面延伸的细长引线的电介质片的支撑件。引线具有永久地连接到支撑件的端部端部和可释放地连接到支撑件的尖端端部。支撑件与诸如半导体芯片或晶片的另外的元件并置，并且引线的尖端使用通过支撑件中的孔前进的焊接工具结合到晶片上的触点。在粘合之后，支撑件和另外的元件彼此远离，以使引线变形。

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