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21. 发明申请

US20100156054A1 HIGH TEMPERATURE ELECTROSTATIC CHUCK BONDING ADHESIVE 有权
标题翻译：高温静电胶粘剂粘合剂
公开(公告)号：US20100156054A1
公开(公告)日：2010-06-24
申请号：US12640496
申请日：2009-12-17
申请人： Jennifer Y. Sun , Senh Thach , Ren-Guan Duan
发明人： Jennifer Y. Sun , Senh Thach , Ren-Guan Duan
IPC分类号： H01L21/683 , C09J5/06 , C08L83/06 , H02N13/00
CPC分类号： H01L21/6833 , C08K3/22 , C08K3/28 , C08K2003/2227 , C08K2003/282 , C09D183/04 , C09J11/04 , C09J183/04 , H01L21/6831 , H02N13/00 , Y10T279/23 , Y10T279/34
摘要： Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (Al2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.
摘要翻译：本文提供了用于将静电卡盘结合到基板支撑件的部件的方法和装置。在一些实施例中，用于粘合基底支撑件的部件的粘合剂可以包括其中分散有填料的硅基聚合物材料的基体。硅基聚合物材料可以是具有低分子量（LMW）含量＆Sgr的分子量的聚二甲基硅氧烷（PDMS）结构。 D3-D10小于约500ppm。在一些实施方案中，填料可以占粘合剂层的约50至约70体积％。在一些实施例中，填料可以包括氧化铝（Al 2 O 3），氮化铝（AlN），氧化钇（Y 2 O 3）或其组合的颗粒。在一些实施方案中，填料可以包含直径为约10纳米至约10微米的颗粒。

22. 发明授权

US09520314B2 High temperature electrostatic chuck bonding adhesive 有权
标题翻译：高温静电卡盘粘合胶
公开(公告)号：US09520314B2
公开(公告)日：2016-12-13
申请号：US12640496
申请日：2009-12-17
申请人： Jennifer Y. Sun , Senh Thach , Ren-Guan Duan
发明人： Jennifer Y. Sun , Senh Thach , Ren-Guan Duan
IPC分类号： H01L21/68 , H02N13/00 , C09D183/04 , H01L21/683
CPC分类号： H01L21/6833 , C08K3/22 , C08K3/28 , C08K2003/2227 , C08K2003/282 , C09D183/04 , C09J11/04 , C09J183/04 , H01L21/6831 , H02N13/00 , Y10T279/23 , Y10T279/34
摘要： Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (Al2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.
摘要翻译：本文提供了用于将静电卡盘结合到基板支撑件的部件的方法和装置。在一些实施例中，用于粘合基底支撑件的部件的粘合剂可以包括其中分散有填料的硅基聚合物材料的基体。硅基聚合物材料可以是分子量小于约500ppm的具有低分子量（LMW）含量ΣD3-D10的聚二甲基硅氧烷（PDMS）结构。在一些实施方案中，填料可以占粘合剂层的约50至约70体积％。在一些实施例中，填料可以包括氧化铝（Al 2 O 3），氮化铝（AlN），氧化钇（Y 2 O 3）或其组合的颗粒。在一些实施方案中，填料可以包含直径为约10纳米至约10微米的颗粒。

23. 发明申请

US20110198034A1 GAS DISTRIBUTION SHOWERHEAD WITH COATING MATERIAL FOR SEMICONDUCTOR PROCESSING 审中-公开
标题翻译：具有涂层材料的气体分布式淋浴器用于半导体加工
公开(公告)号：US20110198034A1
公开(公告)日：2011-08-18
申请号：US13011839
申请日：2011-01-21
申请人： Jennifer Sun , Senh Thach , Ren-Guan Duan , Thomas Graves
发明人： Jennifer Sun , Senh Thach , Ren-Guan Duan , Thomas Graves
IPC分类号： H01L21/00 , C23C4/12 , C23C16/455 , C23C16/50 , C23F1/08
CPC分类号： H01J37/3244 , C23C4/02 , C23C4/11 , C23C4/18
摘要： Described herein are exemplary methods and apparatuses for fabricating a gas distribution showerhead assembly in accordance with one embodiment. In one embodiment, a method includes providing a gas distribution plate having a first set of through-holes for delivering processing gases into a semiconductor processing chamber. The first set of through-holes is located on a backside of the plate (e.g., Aluminum substrate). The method includes spraying (e.g., plasma spraying) a coating material (e.g., Ytrria based material) onto a cleaned surface of the gas distribution plate. The method includes removing (e.g., surface grinding) a portion of the coating material from the surface to reduce a thickness of the coating material. The method includes forming (e.g., UV laser drilling, machining) a second set of through-holes in the coating material such that the through-holes are aligned with the first-set of through-holes.
摘要翻译：这里描述了根据一个实施例的用于制造气体分配喷头组件的示例性方法和装置。在一个实施例中，一种方法包括提供具有第一组通孔的气体分配板，用于将处理气体输送到半导体处理室中。第一组通孔位于板的背面（例如铝基板）上。该方法包括将涂层材料（例如，基于Ytrria的材料）喷雾（例如，等离子体喷涂）到气体分配板的清洁表面上。该方法包括从表面去除（例如，表面研磨）涂层材料的一部分以减小涂层材料的厚度。该方法包括在涂层材料中形成（例如UV激光钻孔，加工）第二组通孔，使得通孔与第一组通孔对齐。

24. 发明申请

US20100129670A1 Protective coatings resistant to reactive plasma processing 有权
标题翻译：耐反应等离子体处理的保护涂层
公开(公告)号：US20100129670A1
公开(公告)日：2010-05-27
申请号：US12590200
申请日：2009-11-03
申请人： Jennifer Y. Sun , Ren-Guan Duan , Kenneth S. Collins
发明人： Jennifer Y. Sun , Ren-Guan Duan , Kenneth S. Collins
IPC分类号： B32B18/00 , B32B17/06 , B32B9/04 , B05D3/02 , C04B35/50 , C04B35/553
CPC分类号： C04B41/86 , C03C8/00 , C03C2214/20 , C04B41/009 , C04B41/5023 , H01J37/32477 , C04B41/4539 , C04B41/5055 , C04B35/10 , C04B35/00 , C04B35/14 , C04B35/565 , C04B35/584 , C04B35/581
摘要： Embodiments of the invention relate to compositions of metal oxyfluoride-comprising glazes or metal fluoride-comprising glazes, glass ceramics, and combinations thereof which are useful as plasma-resistant solid substrates or plasma resistant protective coatings over other substrates. Also described are methods of fabricating various structures which incorporate such compositions, including solid substrates and coatings over the surface of a substrate which has a melting point which is higher than about 1600° C., such as aluminum oxide, aluminum nitride, quartz, silicon carbide, silicon nitride.
摘要翻译：本发明的实施方案涉及可用作等离子体固体基质或耐等离子体保护涂层超过其它基底的包含氟化of的釉料或含金属氟化物的釉料，玻璃陶瓷及其组合的组合物。还描述了制造包含这样的组合物的各种结构的方法，其包括在熔点高于约1600℃的基底表面上的固体基质和涂层，例如氧化铝，氮化铝，石英，硅碳化物，氮化硅。

25. 发明申请

US20100119844A1 Corrosion-resistant bonding agents for bonding ceramic components which are exposed to plasmas 有权
标题翻译：用于粘接暴露于等离子体的陶瓷部件的耐腐蚀粘合剂
公开(公告)号：US20100119844A1
公开(公告)日：2010-05-13
申请号：US12291747
申请日：2008-11-12
申请人： Jennifer Y. Sun , Ren-Guan Duan , Kenneth S. Collins
发明人： Jennifer Y. Sun , Ren-Guan Duan , Kenneth S. Collins
IPC分类号： B32B18/00 , C09D1/00 , B32B37/00
CPC分类号： C03C10/16 , C03C3/247 , C03C3/325 , C03C8/24 , C03C2204/00 , C04B35/119 , C04B37/005 , C04B2235/3201 , C04B2235/3206 , C04B2235/3225 , C04B2235/445 , C04B2235/5445 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2235/80 , C04B2237/06 , C04B2237/064 , C04B2237/08 , C04B2237/10 , C04B2237/34 , C04B2237/343 , C04B2237/60 , C04B2237/708 , C04B2237/72 , H01L21/6719
摘要： Embodiments of the invention relate to component structures which are useful as apparatus in plasma processing chambers. Portions of the component structures are bonded together using oxyfluoride-comprising glazes, glass ceramics, and combinations thereof. The bonding material is resistant to halogen-containing plasmas and exhibits desirable mechanical properties.
摘要翻译：本发明的实施例涉及可用作等离子体处理室中的装置的部件结构。使用含氟氟化物的釉料，玻璃陶瓷及其组合将部件结构的部分粘结在一起。粘合材料对含卤素等离子体具有耐受性，并且具有所需的机械性能。

26. 发明授权

US08858745B2 Corrosion-resistant bonding agents for bonding ceramic components which are exposed to plasmas 有权
标题翻译：用于粘接暴露于等离子体的陶瓷部件的耐腐蚀粘合剂
公开(公告)号：US08858745B2
公开(公告)日：2014-10-14
申请号：US12291747
申请日：2008-11-12
申请人： Jennifer Y. Sun , Ren-Guan Duan , Kenneth S. Collins
发明人： Jennifer Y. Sun , Ren-Guan Duan , Kenneth S. Collins
IPC分类号： C03B29/00 , C04B37/00 , C03C3/247 , C03C3/32 , C04B35/119 , C03C8/24 , B32B17/06 , C04B9/02 , H01L21/67
CPC分类号： C03C10/16 , C03C3/247 , C03C3/325 , C03C8/24 , C03C2204/00 , C04B35/119 , C04B37/005 , C04B2235/3201 , C04B2235/3206 , C04B2235/3225 , C04B2235/445 , C04B2235/5445 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2235/80 , C04B2237/06 , C04B2237/064 , C04B2237/08 , C04B2237/10 , C04B2237/34 , C04B2237/343 , C04B2237/60 , C04B2237/708 , C04B2237/72 , H01L21/6719
摘要： Embodiments of the invention relate to component structures which are useful as apparatus in plasma processing chambers. Portions of the component structures are bonded together using oxyfluoride-comprising glazes, glass ceramics, and combinations thereof. The bonding material is resistant to halogen-containing plasmas and exhibits desirable mechanical properties.
摘要翻译：本发明的实施例涉及可用作等离子体处理室中的装置的部件结构。使用含氟氟化物的釉料，玻璃陶瓷及其组合将部件结构的部分粘结在一起。粘合材料对含卤素等离子体具有耐受性，并且具有所需的机械性能。

27. 发明授权

US09017765B2 Protective coatings resistant to reactive plasma processing 有权
标题翻译：耐反应等离子体处理的保护涂层
公开(公告)号：US09017765B2
公开(公告)日：2015-04-28
申请号：US12590200
申请日：2009-11-03
申请人： Jennifer Y. Sun , Ren-Guan Duan , Kenneth S. Collins
发明人： Jennifer Y. Sun , Ren-Guan Duan , Kenneth S. Collins
IPC分类号： B05D3/02 , C04B41/86 , C03C8/00 , C04B41/00 , C04B41/50
CPC分类号： C04B41/86 , C03C8/00 , C03C2214/20 , C04B41/009 , C04B41/5023 , H01J37/32477 , C04B41/4539 , C04B41/5055 , C04B35/10 , C04B35/00 , C04B35/14 , C04B35/565 , C04B35/584 , C04B35/581
摘要： Embodiments of the invention relate to compositions of metal oxyfluoride-comprising glazes or metal fluoride-comprising glazes, glass ceramics, and combinations thereof which are useful as plasma-resistant solid substrates or plasma resistant protective coatings over other substrates. Also described are methods of fabricating various structures which incorporate such compositions, including solid substrates and coatings over the surface of a substrate which has a melting point which is higher than about 1600° C., such as aluminum oxide, aluminum nitride, quartz, silicon carbide, silicon nitride.
摘要翻译：本发明的实施方案涉及可用作等离子体固体基质或耐等离子体保护涂层超过其它基底的包含氟化of的釉料或含金属氟化物的釉料，玻璃陶瓷及其组合的组合物。还描述了制造包含这样的组合物的各种结构的方法，其包括在熔点高于约1600℃的基底表面上的固体基质和涂层，例如氧化铝，氮化铝，石英，硅碳化物，氮化硅。

28. 发明申请

US20090302002A1 METHOD AND APPARATUS FOR REMOVING POLYMER FROM A SUBSTRATE 审中-公开
标题翻译：从基板上去除聚合物的方法和装置
公开(公告)号：US20090302002A1
公开(公告)日：2009-12-10
申请号：US12395057
申请日：2009-02-27
申请人： Kenneth Collins , Martin Salinas , Walter Merry , Jie Yuan , Andrew Nguyen , Kartik Ramaswamy , Jennifer Sun , Ren-Guan Duan , Xiaoming He , Nancy Fung
发明人： Kenneth Collins , Martin Salinas , Walter Merry , Jie Yuan , Andrew Nguyen , Kartik Ramaswamy , Jennifer Sun , Ren-Guan Duan , Xiaoming He , Nancy Fung
IPC分类号： B44C1/22 , C23F1/08
CPC分类号： H01J37/321 , G03F7/427 , H01J37/32357 , H01L21/02063 , H01L21/02087 , H01L21/0209 , H01L21/31138
摘要： A method and an apparatus for removing polymer from a substrate are provided. In one embodiment, an apparatus utilized to remove polymer from a substrate includes a processing chamber having a chamber wall and a chamber lid defining a process volume, a substrate support assembly disposed in the processing chamber, and a remote plasma source coupled to the processing chamber through an outlet port formed within the chamber wall, the outlet port having an opening pointing toward an periphery region of a substrate disposed on the substrate support assembly, wherein the remote plasma source is fabricated from a material resistant to hydrogen species.
摘要翻译：提供了从基板上除去聚合物的方法和装置。在一个实施方案中，用于从基材中除去聚合物的装置包括具有室壁和限定处理体积的室盖的处理室，设置在处理室中的基板支撑组件和耦合到处理室的远程等离子体源通过形成在室壁内的出口，出口具有指向设置在基板支撑组件上的基板的周边区域的开口，其中远程等离子体源由耐氢物质的材料制成。

29. 发明授权

US07128850B2 Electrically conductive Si-Ti-C-N ceramics 有权
标题翻译：导电Si-Ti-C-N陶瓷
公开(公告)号：US07128850B2
公开(公告)日：2006-10-31
申请号：US10453879
申请日：2003-06-02
申请人： Ren-Guan Duan , Joshua D. Kuntz , Amiya K. Mukherjee
发明人： Ren-Guan Duan , Joshua D. Kuntz , Amiya K. Mukherjee
IPC分类号： C04B35/596 , C04B35/56 , C04B35/58 , H01B1/06 , B28B3/00
CPC分类号： C04B35/64 , A61F2002/30968 , B82Y30/00 , C04B35/58 , C04B35/58021 , C04B35/6261 , C04B35/62615 , C04B35/645 , C04B2235/3232 , C04B2235/3826 , C04B2235/3882 , C04B2235/465 , C04B2235/5454 , C04B2235/6581 , C04B2235/666 , C04B2235/77 , C04B2235/781 , C04B2235/785 , C04B2235/80 , C04B2235/96 , H01B1/18
摘要： Composite materials containing silicon, titanium, carbon, and nitrogen, formed by spark plasma sintering of ceramic starting materials to a high relative density, demonstrate unusually high electrical conductivity as well as high-performance mechanical and chemical properties including hardness, fracture toughness, and corrosion resistance. This combination of electrical, mechanical, and chemical properties makes these composites useful as electrical conductors in applications where high-performance materials are needed due to exposure to extreme conditions such as high temperatures, mechanical stresses, and corrosive environments.
摘要翻译：通过陶瓷起始材料的放电等离子体烧结形成的含有硅，钛，碳和氮的复合材料具有高的相对密度，显示出非常高的导电性以及高性能的机械和化学性质，包括硬度，断裂韧性和腐蚀抵抗性。这种电气，机械和化学性质的组合使得这些复合材料在高温，机械应力和腐蚀性环境等极端条件下需要高性能材料的应用中可用作电导体。

30. 发明申请

US20120104703A1 ELECTROSTATIC CHUCK AND SHOWERHEAD WITH ENHANCED THERMAL PROPERTIES AND METHODS OF MAKING THEREOF 有权
标题翻译：具有增强热性能的静电钻头和淋浴器及其制造方法
公开(公告)号：US20120104703A1
公开(公告)日：2012-05-03
申请号：US13276524
申请日：2011-10-19
申请人： Jennifer Sun , Sumanth Banda , Ren-Guan Duan
发明人： Jennifer Sun , Sumanth Banda , Ren-Guan Duan
IPC分类号： B23B31/28 , B32B37/06 , B05B1/00 , B32B37/14 , B32B41/00 , B65D6/00 , B32B37/12 , B32B37/10
CPC分类号： B23B31/28 , B05B1/14 , B23B31/02 , B23Q3/00 , B32B15/08 , C04B35/6269 , C04B35/63424 , C04B37/005 , C04B37/006 , C04B37/008 , C04B37/025 , C04B37/026 , C04B37/028 , C04B2235/604 , C04B2237/064 , C04B2237/08 , C04B2237/12 , C04B2237/34 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/402 , C04B2237/55 , C04B2237/62 , H01L21/6831 , Y10T156/10 , Y10T279/23
摘要： Embodiments of the present invention generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present invention provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.
摘要翻译：本发明的实施例通常提供具有增强的热性质的腔室部件和增强包括接合材料在内的腔室部件的热性能的方法。本发明的一个实施例提供一种制造复合结构的方法。该方法包括：向第一部件施加接合材料，并且通过加热接合材料将从第一部件施加的接合材料转化为增强的接合层，从而从接合材料排出挥发性物质。脱气的挥发性物质在接合材料的质量上累积至少0.05％。该方法还包括使第二组分和增强的结合层接触以连接第一和第二组分。

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