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    • 25. 发明授权
    • Sample processing device compression systems and methods
    • 样品处理设备压缩系统和方法
    • US07754474B2
    • 2010-07-13
    • US11174757
    • 2005-07-05
    • James E. AystaWilliam BedinghamBarry W. Robole
    • James E. AystaWilliam BedinghamBarry W. Robole
    • C12M3/00
    • B01L9/52B01L3/50851B01L3/50853B01L7/52B01L2200/0689B01L2300/041B01L2300/0803B01L2300/1805B01L2300/1861G01N35/025G01N2035/00366Y10S435/809
    • Sample processing systems and methods of using those systems for processing sample materials located in sample processing devices are disclosed. The sample processing systems include a rotating base plate on which the sample processing devices are located during operation of the systems. The systems also include a cover and compression structure designed to force a sample processing device towards the base plate. The preferred result is that the sample processing device is forced into contact with a thermal structure on the base plate. The systems and methods of the present invention may include one or more of the following features to enhance thermal coupling between the thermal structure and the sample processing device: a shaped transfer surface, magnetic compression structure, and floating or resiliently mounted thermal structure. The methods may preferably involve deformation of a portion of a sample processing device to conform to a shaped transfer surface.
    • 公开了使用这些系统来处理位于样品处理装置中的样品材料的样品处理系统和方法。 样品处理系统包括在系统操作期间样品处理装置位于其上的旋转底板。 该系统还包括设计成迫使样品处理装置朝向底板的盖和压缩结构。 优选的结果是,样品处理装置被迫与基板上的热结构接触。 本发明的系统和方法可以包括以下特征中的一个或多个,以增强热结构和样品处理装置之间的热耦合:成形转印表面,磁性压缩结构以及浮动或弹性安装的热结构。 该方法可以优选地包括样品处理装置的一部分的变形以符合成形的转印表面。