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    • 22. 发明授权
    • Micromachining method for workpiece observation
    • 工件观察的微加工方法
    • US06395347B1
    • 2002-05-28
    • US08351093
    • 1994-11-30
    • Tatsuya AdachiTakashi KaitoYoshihiro KoyamaKouji Iwasaki
    • Tatsuya AdachiTakashi KaitoYoshihiro KoyamaKouji Iwasaki
    • H01J300
    • H01J37/3056G01N1/32H01J2237/31744
    • A method for preparing a sample for observation, by the steps of: contacting a first predetermined area of the sample surface with an organic compound vapor while irradiating the first predetermined area with an ion beam to decompose the organic compound into a layer having a mask function, the layer covering the first predetermined area; and contacting a second predetermined area of the sample surface with an etching gas while irradiating the second predetermined area with an ion beam in order to remove material from the sample surface at the second predetermined area, wherein the second predetermined area includes at least part of the first predetermined area and the layer covering the first predetermined area prevents removal of material from the sample surface in the first predetermined area.
    • 一种用于制备用于观察的样品的方法,包括以下步骤:使用离子束照射所述第一预定区域,使所述样品表面的第一预定区域与有机化合物蒸气接触,以将所述有机化合物分解成具有掩模功能的层 覆盖第一预定区域的层; 以及使所述样品表面的第二预定区域与蚀刻气体接触,同时用离子束照射所述第二预定区域,以便在所述第二预定区域从所述样品表面去除材料,其中所述第二预定区域包括所述第二预定区域的至少一部分 第一预定区域和覆盖第一预定区域的层防止在第一预定区域中从样品表面移除材料。
    • 23. 发明申请
    • MICRO CROSS-SECTION PROCESSING METHOD
    • 微交叉处理方法
    • US20100215868A1
    • 2010-08-26
    • US12708896
    • 2010-02-19
    • Kouji IwasakiTatsuya Adachi
    • Kouji IwasakiTatsuya Adachi
    • G21K5/10G01N23/22B05D3/06
    • G21K5/04G01N23/2202G21K5/10H01J2237/31745H01J2237/31749
    • A micro cross-section processing method includes the steps of determining a linear cross-section estimated position including an observation object on a surface of the sample, irradiating the focused ion beam to the cross-section estimated position perpendicularly to or at a tilt angle to form a cross-section at a position in front of the cross-section estimated position, irradiating the focused ion beam to both ends of the cross-section to form side cuts extending to a position in rear of the cross-section estimated position, irradiating the focused ion beam to a position on the surface of the cross-section and at a position deeper than the observation object to form a bottom cut extending to a position in rear of the cross-section estimated position, irradiating the focused ion beam along from the side cuts to the cross-section estimated position to form wedges connecting to the bottom cut, and applying impact to a region in front of the cross-section estimated position of the sample to cleave the vicinity of the cross-section estimated position between the wedges and form a plane of cleavage.
    • 微截面处理方法包括以下步骤:确定包括在样品表面上的观察对象的线性横截面估计位置,将聚焦离子束垂直于或以倾斜角照射到横截面估计位置, 在横截面估计位置前面的位置处形成横截面,将聚焦离子束照射到横截面的两端,以形成延伸到横截面估计位置后方的位置的侧切口 所述聚焦离子束到达所述横截面表面上的位置,并且位于比所述观察对象更深的位置,以形成延伸到所述横截面估计位置的后方的位置的底切口,从而沿着所述聚焦离子束照射 侧面切割到横截面估计位置以形成连接到底切口的楔形,并且对样品的横截面估计位置前面的区域施加冲击 以切割楔块之间的横截面估计位置附近并形成切割平面。
    • 27. 发明授权
    • Thin specimen producing method and apparatus
    • 薄标本制造方法和装置
    • US07002150B2
    • 2006-02-21
    • US10854868
    • 2004-05-27
    • Kouji IwasakiYutaka Ikku
    • Kouji IwasakiYutaka Ikku
    • G21K7/00
    • G01N1/32H01J2237/3174
    • A thin specimen producing method acquires a work amount in a 1-line scan by an FIB under a predetermined condition, measures a remaining work width of a thin film on an upper surface of a specimen by a microscopic length-measuring function, determines a required number of scan lines of work to reach a predetermined width by calculation, and executes a work to obtain a set thickness. The work amount in a one-line scan by the FIB under the predetermined condition is determined by working the specimen in scans of plural lines, measuring the etched dimension by the microscopic length-measuring function, and calculating an average work amount per one-line scan.
    • 薄标本制作方法通过FIB在预定条件下获取1行扫描中的工作量,通过微观长度测量功能测量样品上表面上的薄膜的剩余工作宽度,确定所需的 通过计算达到预定宽度的扫描线的数量,并执行获得设定厚度的工作。 通过FIB在预定条件下的单行扫描中的工作量通过在多行扫描中进行样品的工作,通过微观长度测量功能测量蚀刻尺寸并计算每行的平均工作量来确定 扫描
    • 28. 发明授权
    • Method of preparing a transmission electron microscope sample and a sample piece for a transmission electron microscope
    • 制备透射电子显微镜样品的方法和透射电子显微镜的样品片
    • US08191168B2
    • 2012-05-29
    • US12264750
    • 2008-11-04
    • Xin ManKouji IwasakiTatsuya Asahata
    • Xin ManKouji IwasakiTatsuya Asahata
    • G01N13/10
    • H01J37/3056B82Y15/00G01N1/286H01J37/20H01J37/26H01J2237/2007H01J2237/202H01J2237/204H01J2237/206H01J2237/2067H01J2237/2802H01J2237/31745H01J2237/31749
    • Provided is a method of preparing a sample piece for a transmission electron microscope, the sample piece for a transmission electron microscope including a substantially planar finished surface which can be observed with the transmission electron microscope and a grabbing portion which microtweezers can grab without contacting the finished surface. The method of preparing a sample piece for a transmission electron microscope is characterized by including: a first step of cutting out the sample piece from a sample body Wa with a charged particle beam, the sample piece being coupled to the sample body at a coupling portion; a second step of grabbing with the microtweezers the grabbing portion of the sample piece with the finished surface of the sample piece cut out in the first step being covered with the microtweezers; a third step of detaching the sample piece grabbed with the microtweezers in the second step from the sample body by cutting the coupling portion with the charged particle beam with a grabbed state of the sample piece being maintained; and a fourth step of transferring and fixing with the microtweezers the sample piece detached in the third step onto a sample holder.
    • 提供了一种制备透射电子显微镜样品的方法,用于透射电子显微镜的样品片,其包括可透射电子显微镜观察的基本上平面的成品表面,以及微型加工者可以在不接触成品的情况下抓取的抓取部分 表面。 制备透射电子显微镜样品的方法的特征在于包括:第一步骤,利用带电粒子束从样品体Wa切出样品片,样品片以耦合部分 ; 第二步骤是用微型加湿器抓住样品的抓取部分,其中在第一步骤中切出的样品的成品表面被微型加工机覆盖; 第三步骤,通过用保持样品的抓取状态的带电粒子束切割耦合部分,将样品从第二步骤中剥离出来; 以及第四步骤,用微型加工机将第三步骤中拆卸的样品片转移和固定到样品架上。